公开(公告)号：ES2151501T3

公开(公告)日：2001-01-01

申请号：ES93480108

申请日：1993-07-30

Applicant: IBM

Inventor： BANTU NAGESCHWER R ,  KEESLER ROSS W ,  SINCLAIR TERRY D ,  BHATT ANILKUMAR C ,  PAPATHOMAS KONSTANTINOS ,  WAGNER JEROME J

IPC: B01D3/00 ,  C07D317/36 ,  G03F7/30 ,  G03F7/42 ,  H01L21/02 ,  H01L21/027 ,  H01L21/30

公开(公告)号：AT196902T

公开(公告)日：2000-10-15

申请号：AT93480108

申请日：1993-07-30

Applicant: IBM

Inventor： BANTU NAGESCHWER R ,  KEESLER ROSS W ,  SINCLAIR TERRY D ,  BHATT ANILKUMAR C ,  PAPATHOMAS KONSTANTINOS ,  WAGNER JEROME J

IPC: B01D3/00 ,  C07D317/36 ,  G03F7/30 ,  G03F7/42 ,  H01L21/02 ,  H01L21/027 ,  H01L21/30

公开(公告)号：CA2094407A1

公开(公告)日：1994-02-05

申请号：CA2094407

申请日：1993-04-20

Applicant: IBM

Inventor： BANTU NAGESHWER R ,  BAHAT ANILKUMAR C ,  KEESLER ROSS W ,  PAPATHOMAS KONSTANTINOS ,  SINCLAIR TERRY D ,  WAGNER JEROME J

IPC: B01D3/00 ,  C07D317/36 ,  G03F7/30 ,  G03F7/42 ,  H01L21/02 ,  H01L21/027 ,  H01L21/30 ,  B01D1/00

公开(公告)号：DE69329537D1

公开(公告)日：2000-11-16

申请号：DE69329537

申请日：1993-07-30

Applicant: IBM

Inventor： BANTU NAGESCHWER R ,  KEESLER ROSS W ,  SINCLAIR TERRY D ,  BHATT ANILKUMAR C ,  PAPATHOMAS KONSTANTINOS ,  WAGNER JEROME J

IPC: B01D3/00 ,  C07D317/36 ,  G03F7/30 ,  G03F7/42 ,  H01L21/02 ,  H01L21/027 ,  H01L21/30

公开(公告)号：BR9302987A

公开(公告)日：1994-03-01

申请号：BR9302987

申请日：1993-07-26

Applicant: IBM

Inventor： BANTU NAGESHWER R ,  BHATT ANIKUMAR C ,  KEESLER ROSS W ,  PAPATHOMAS KONSTANTINOS ,  WAGNER JEROME J

IPC: B01D3/00 ,  C07D317/36 ,  G03F7/30 ,  G03F7/42 ,  H01L21/02 ,  H01L21/027 ,  H01L21/30 ,  C07C69/96

公开(公告)号：DE69329537T2

公开(公告)日：2001-06-07

申请号：DE69329537

申请日：1993-07-30

Applicant: IBM

Inventor： BANTU NAGESCHWER R ,  KEESLER ROSS W ,  SINCLAIR TERRY D ,  BHATT ANILKUMAR C ,  PAPATHOMAS KONSTANTINOS ,  WAGNER JEROME J

IPC: B01D3/00 ,  C07D317/36 ,  G03F7/30 ,  G03F7/42 ,  H01L21/02 ,  H01L21/027 ,  H01L21/30

公开(公告)号：HK1027468A1

公开(公告)日：2001-01-12

申请号：HK00106448

申请日：2000-10-11

Applicant: IBM

Inventor： KEESLER ROSS W ,  MARKOVICH VOYA R ,  PAOLETTI JIM ,  PERRINO MARYBETH ,  WILSON WILLIAM E

IPC: H05K3/00 ,  H05K3/42 ,  H05K3/46 ,  H05K

Abstract: A method forming a composite laminate structure includes providing first and second circuit board element each having circuitry on at least one face thereof and plated through holes. A voltage plane element is provided having at least one voltage plane having opposite faces with layers of partially cured photodielectric material on each face. At least one hole is photopatterned and etched through the voltage plane element but completely isolated from the voltage plane. Each through hole in the voltage plane element is aligned with a plated through hole in each of the circuit board elements to provide a surface on the voltage plane element communicating with the plated through holes. The voltage plane is laminated between the circuit board elements and the photoimageable material on the voltage plane is fully cured. The surfaces of the voltage plane element communicating with the plated through holes in the circuit board elements are plated with a conducting material to establish a connection between the circuitry on the first and second circuit board elements.