METHOD FOR RECOVERING ORGANIC SOLVENT FROM WASTE LIQUID

    公开(公告)号:JP2003113481A

    公开(公告)日:2003-04-18

    申请号:JP2002227213

    申请日:2002-08-05

    Applicant: IBM

    Abstract: PROBLEM TO BE SOLVED: To provide a method for recovering an organic solvent from a waste liquid containing the organic solvent, supercritical carbon dioxide (CO2 ), and an etchant contaminants. SOLUTION: In this method, the organic solvent is separated from the waste liquid comprising supercritical CO2 , the organic solvent, and the etchant contaminants. The method comprises separating the supercritical CO2 by subjecting the waste liquid to elevated temperature and/or reduced pressure, to thereby obtain a first composition containing supercritical CO2 and a second composition containing the organic solvent free of the supercritical CO2 ; and then removing non-volatile etching contaminants from the second composition, to recover the organic solvent by at least one of the following: evaporation, distillation, filtration, centrifugation and settling.

    Method for treating photolithographic developer and stripper waste streams containing resist or solder mask and gamma butyrolactone or benzyl alcohol

    公开(公告)号:SG67425A1

    公开(公告)日:1999-09-21

    申请号:SG1997003615

    申请日:1995-08-11

    Applicant: IBM

    Abstract: A method is disclosed for using the simple, environmentally-friendly organic compounds gamma-butyrolactone and benzyl alcohol to develop and to strip free radical-initiated, addition polymerizable resists, cationically cured resists and solder masks and Vacrel photoresists. In all cases the developers and strippers include gamma butyrolactone or benzyl alcohol. The developers and strippers optionally also include a minor amount of methanol, ethanol, isopropyl alcohol, propylene glycol monomethylacetate, ethylene glycol monomethyl ether, formamide, nitromethane, propylene oxide, or methyl ethyl ketone, acetone and water. During development of the photopatterned resist or solder mask, the unpolymerized regions are dissolved in the disclosed developers. During stripping of the resist or solder mask, the polymerized regions are debonded from a circuit board in the disclosed strippers. Following removal of the developers and strippers, any residual monomers or polymers of the resist or solder mask as well as residual developing solution and stripping solution are rinsed from the printed circuit package. A method is also disclosed for treating the combined developer and stripper rinse effluents in an activated biomass to reduce the biological oxygen demand of the developer/stripper/resist/solder mask waste streams.

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