公开(公告)号：EP1653789A4

公开(公告)日：2008-09-24

申请号：EP04746998

申请日：2004-07-05

Applicant: IBM

Inventor： MORI HIROYUKI ,  YAMANAKA KIMIHIRO ,  KODAMA YASUSHI

IPC: H05K3/46 ,  H05K1/03 ,  H05K3/42

CPC classification number: H05K3/421 ,  H05K1/0366 ,  H05K3/4644 ,  H05K2201/029 ,  H05K2201/0769 ,  H05K2201/09509 ,  H05K2201/09581 ,  Y10T29/49155

Abstract: A printed-wiring board capable of preventing occurrence of short-circuit is provided. A printed-wiring board (100) comprises a via land (2A), a glass epoxy resin layer (3), a via conductor (6), and a block layer (4A). The via land (2A) is formed on a core layer (1). The glass epoxy resin layer (3) is formed on the core layer (1) and via land (2A). The via conductor (6) is formed on the via land (2A). The block layer (4A) is formed on the via land (2A) and between the via conductor (6) and glass epoxy resin layer (3).

公开(公告)号：JPH0992682A

公开(公告)日：1997-04-04

申请号：JP24424695

申请日：1995-09-22

Applicant: IBM

Inventor： KODAMA YASUSHI ,  TSUCHIDA SHUHEI ,  TSUKADA YUTAKA ,  ORII YASUMITSU ,  OKUMA HIDEO

IPC: H01L21/60 ,  B23K1/005 ,  B23K1/012 ,  H01L21/603 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To grip a chip by a head to solder keeping the molten solder by with molten. SOLUTION: Solder bumps 3 formed on a chip 1 face the electrodes 11 on a mounting board 10. Then the solder bumps 3 are heated to their melting points by heating a heating block 21 provided on the rear surface side of the chip 1. It is preferable to provide another heating block 22 on the rear surface of the board 10. With the solder bumps 3 molten, the bumps 3 are soldered to the electrodes 11 by bringing the bumps 3 into contact with the electrodes 11.