公开(公告)号：CA1286791C

公开(公告)日：1991-07-23

申请号：CA589395

申请日：1989-01-27

Applicant: IBM

Inventor： BOSS DAVID W ,  CARR TIMOTHY W ,  DUBETSKY DERRY J ,  GREENSTEIN GEORGE M ,  GROBMAN WARREN D ,  HAYUNGA CARL P ,  KUMAR ANANDA H ,  LANGE WALTER F ,  MASSEY ROBERT H ,  PALMATEER PAUL H ,  ROMANO JOHN A ,  SHIH DA-YUAN

IPC: H05K9/00 ,  H01L23/498 ,  H05K3/46 ,  H01L23/485

Abstract: Sealing and stress relief are provided to a low-fracture strength glass-ceramic substrate. Hermeticity is addressed through the use of capture pads in alignment with vias and through polymeric overlayers with interconnection between the underlying via or pad metallurgy and the device, chip, wire or pin bonded to the surface of the layer. Multilevel structures are taught along with a self-aligned sealing and wiring process.