公开(公告)号：US3401369A

公开(公告)日：1968-09-10

申请号：US55572966

申请日：1966-06-07

Applicant: IBM

Inventor： PALMATEER PAUL H ,  ROCHE KEVIN J

IPC: H01R12/50 ,  H05K1/09 ,  H05K3/36

CPC classification number: H01R12/721 ,  H05K1/09 ,  H05K3/365

公开(公告)号：US3397393A

公开(公告)日：1968-08-13

申请号：US47855865

申请日：1965-08-10

Applicant: IBM

Inventor： PALMATEER PAUL H ,  PRICER WILBUR D

IPC: G11C17/04

CPC classification number: G11C17/04

公开(公告)号：US3319317A

公开(公告)日：1967-05-16

申请号：US33270963

申请日：1963-12-23

Applicant: IBM

Inventor： ROCHE KEVIN J ,  PALMATEER PAUL H

IPC: C23F1/02 ,  C25D5/02 ,  H01B1/00 ,  H01R12/52 ,  H05K3/00 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/4652 ,  C23F1/02 ,  C25D5/02 ,  H01B1/00 ,  H01R12/526 ,  H05K3/002 ,  H05K3/421 ,  H05K3/427 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2203/0554 ,  Y10S205/92

公开(公告)号：CA882932A

公开(公告)日：1971-10-05

申请号：CA882932D

Applicant: IBM

Inventor： PALMATEER PAUL H ,  PRICER WILBUR D

公开(公告)号：CA846385A

公开(公告)日：1970-07-07

申请号：CA846385D

Applicant: IBM

Inventor： PALMATEER PAUL H ,  ROCHE KEVIN J

公开(公告)号：CA1286791C

公开(公告)日：1991-07-23

申请号：CA589395

申请日：1989-01-27

Applicant: IBM

Inventor： BOSS DAVID W ,  CARR TIMOTHY W ,  DUBETSKY DERRY J ,  GREENSTEIN GEORGE M ,  GROBMAN WARREN D ,  HAYUNGA CARL P ,  KUMAR ANANDA H ,  LANGE WALTER F ,  MASSEY ROBERT H ,  PALMATEER PAUL H ,  ROMANO JOHN A ,  SHIH DA-YUAN

IPC: H05K9/00 ,  H01L23/498 ,  H05K3/46 ,  H01L23/485

Abstract: Sealing and stress relief are provided to a low-fracture strength glass-ceramic substrate. Hermeticity is addressed through the use of capture pads in alignment with vias and through polymeric overlayers with interconnection between the underlying via or pad metallurgy and the device, chip, wire or pin bonded to the surface of the layer. Multilevel structures are taught along with a self-aligned sealing and wiring process.

公开(公告)号：CA768834A

公开(公告)日：1967-10-03

申请号：CA768834D

Applicant: IBM

Inventor： ROCHE KEVIN J ,  PALMATEER PAUL H