公开(公告)号：JPH02190475A

公开(公告)日：1990-07-26

申请号：JP30229589

申请日：1989-11-22

Applicant: IBM

Inventor： ARUFURETSUDO BIIBETSUKU ,  SUTEIIBUN RESURII BUTSUKUUOORU ,  UIRIAMU AASAA DONSON ,  JIYON JIYOZEFU GURENINGU ,  MAATEIN JIYOZEFU GOORUDOBAAGU ,  KUATO RUUDORUFU GURIIBU ,  KARORAIN AN KOBATSUKU ,  RINDA KARORIN MASHIYUU ,  UOORUTAA POORU PAUROUSUKII ,  MAAKU JIEFURII SHIYATSUTO ,  MAIKURU ROI SHIYOIAAMAN ,  SUTEIIBUN RIIOU TEISUDEIRU

IPC: C23C18/20 ,  C08J5/12 ,  C08J7/00 ,  C23C18/16 ,  C23C18/28 ,  H05K3/38

公开(公告)号：JPH06322547A

公开(公告)日：1994-11-22

申请号：JP21022593

申请日：1993-08-25

Applicant: IBM

Inventor： ARUFURETSUDO BIIBETSUKU ,  SUTEIIBUN RESURII BUTSUKUUOORU ,  UIRIAMU AASAA DONSON ,  JIYON JIYOSEFU GURENINGU ,  MAATEIN JIYOZEFU GOORUDOBAAGU ,  KUATO RUUDORUFU GURIIBU ,  KARORAIN AN KOBATSUKU ,  RINDA KARORIN MASHIYUU ,  UOORUTAA POORU PAUROUSUKII ,  MAAKU JIEFURII SHIYATSUTO ,  MAIKURU ROI SHIYOIAAMAN ,  SUTEIIBUN RIIOU TEISUDEIRU

IPC: C23C18/20 ,  C08J5/12 ,  C08J7/00 ,  C23C18/16 ,  C23C18/28 ,  H05K3/38

公开(公告)号：JPH05131604A

公开(公告)日：1993-05-28

申请号：JP8070292

申请日：1992-04-02

Applicant: IBM

Inventor： PEI CHIEE CHIEN ,  TOMASU EDOWAADO KINDORU ,  POORU JIYOOJI RIKAARU ,  MAAKU JIEFURII SHIYATSUTO ,  JIYON GUREGORII SUTEFUANII

IPC: B29C65/64 ,  B29K79/00 ,  B29L9/00 ,  B32B15/08 ,  B32B15/088 ,  B32B37/00 ,  C08G73/10 ,  C08J5/12 ,  C08J5/18 ,  H05K1/03 ,  H05K1/05

Abstract: PURPOSE: To provide superior adhesive thermoplastic polyimide by combining double layers consisting of thermoplastic polyimide and hardly workable polyimide on a stainless steel substrate. CONSTITUTION: Stainless steel on which polyimide is adhered is put in a laminating press, then copper foil is put on the thermoplastic polyimide, and next the pressure is raised up to about 10 psi to form a structure including a stainless steel substrate 10, a hardly workable polyimide layer 12 adhered thereon, a thermoplastic polyimide layer 14 adhered and linked with the polyimide layer 12, and a beryllium-copper alloy foil 16 mechanically adhered on the thermoplastic polyimide layer 14. The laminated structure has extremely high adhesion strength in the unstable adhesion between copper and polyimide formed in the laminating process.