公开(公告)号：JP2003109431A

公开(公告)日：2003-04-11

申请号：JP2002184636

申请日：2002-06-25

Applicant: IBM

Inventor： JOHN M COTTE ,  MCCULLOUGH KENNETH JOHN ,  MOREAU WAYNE MARTIN ,  PETRARCA KEVIN ,  SIMONS JOHN P ,  TAFT CHARLES J ,  VOLANT RICHARD

IPC: H01B3/30 ,  H01L21/3105 ,  H01L21/312 ,  H01L21/316

Abstract: PROBLEM TO BE SOLVED: To provide a new kind of high polymer material having a lowered dielectric constant, properly applicable to an electric assembly using a small semiconductor element recently developed. SOLUTION: This high polymer material is formed by forcing a polymer having a low dielectric constant into contact with liquid or supercritical carbon dioxide under a thermodynamic condition to maintain the carbon dioxide in a liquid or supercritical state. Thereby, a porous product is formed. Subsequently, the high polymer material having a substantially lowered dielectric constant can be obtained by changing the thermodynamic condition to a working environment wherein the carbon dioxide escapes from fine holes and is replaced with air.

公开(公告)号：JPH10125644A

公开(公告)日：1998-05-15

申请号：JP27892397

申请日：1997-10-13

Applicant: IBM

Inventor： MCCULLOUGH KENNETH JOHN ,  PURTELL ROBERT JOSEPH ,  ROTHMAN LAURA BETH ,  WU JIN-JWANG

IPC: H01L21/302 ,  B08B7/00 ,  H01L21/02 ,  H01L21/304 ,  H01L21/306 ,  H01L21/3065 ,  H01L21/311 ,  H01L21/3213

Abstract: PROBLEM TO BE SOLVED: To eliminate etchant residue from a precision surface having residue by eliminating the residue from the surface by exposure to supercritical fluid. SOLUTION: Supercritical fluid is pressurized in advance by a high pressure pump. The supercritical fluid is preliminarily pressurized at about 3000psi before it enters a process chamber 12. The preliminarily pressurized supercritical fluid is sent to the process chamber 12 containing a semiconductor specimen through an inlet line 22. The semiconductor specimen having reactive ion etching(RIE) residue is arranged in a specimen zone 16 of the process chamber 12. The specimen is exposed to the supercritical fluid, under a condition sufficient to eliminate RIE residue from the specimen. The supercritical fluid is maintained to be higher than or equal to the critical temperature and the critical pressure.

公开(公告)号：JP2002225000A

公开(公告)日：2002-08-13

申请号：JP2001369501

申请日：2001-12-04

Applicant: IBM

Inventor： JOHN MICHAEL COTT ,  MCCULLOUGH KENNETH JOHN ,  MOREAU WAYNE MARTIN ,  SIMONS JOHN P ,  TAFT CHARLES J

IPC: B81C1/00 ,  B05D1/18 ,  B82B3/00 ,  C23C18/00

Abstract: PROBLEM TO BE SOLVED: To provide a method for sticking a thin film to a nanometer structure. SOLUTION: The method is to stick the thin film to the nanometer structure preparing an aerogel material or a coating that can be formed as a metal seed layer. The coating is mixed with a supercritical composition to form a supercritical coating composition. The supercritical coating composition is stuck to the nanometer structure under a supercritical condition. Then the supercritical condition is eliminated and the supercritical composition is removed to solidify the coating into a solid thin film.

公开(公告)号：JP2002222786A

公开(公告)日：2002-08-09

申请号：JP2001388283

申请日：2001-12-20

Applicant: IBM

Inventor： JOHN MICHAEL COTT ,  DELEHANTY DONALD J ,  MCCULLOUGH KENNETH JOHN ,  MOREAU WAYNE MARTIN ,  SIMONS JOHN P ,  TAFT CHARLES J ,  VOLANT RICHARD P

IPC: H01L21/304 ,  B08B7/00 ,  C11D1/00 ,  C11D3/20 ,  C11D3/43 ,  C23G5/00 ,  H01L21/3105 ,  H01L21/321

Abstract: PROBLEM TO BE SOLVED: To provide a process for removing residual slurry which is generated by chemical mechanical polishing of a workpiece. SOLUTION: This process includes a step for removing the residual slurry resulting from the chemical mechanical polishing which uses composition containing mixture of supercritical fluid, which contains carbon dioxide, co- solvent and a surfactant. It is considered that the supercritical fluid must satisfy two conditions. Firstly, residual slurry removing fluid whose surface tension is sufficiently low must be used, in order to permeate as far as very narrow apertures. Secondly, the fluid must be able to neutralize electric charges applied to slurry particles, in order not only to permeate as far as the narrow apertures but also to remove the residual slurry particles.