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公开(公告)号：JP2004167671A
公开(公告)日：2004-06-17
申请号：JP2003348877
申请日：2003-10-07
Applicant: Internatl Business Mach Corp
, インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation Inventor： KOCIS JOSEPH T , TORNELLO JAMES , PETRARCA KEVIN , VOLANT RICHARD , SUBANNA SESHADRI
CPC classification number: B81C1/00666 , B81B2201/014 , B81C2201/0167 , H01F2007/068 , H01H50/005
Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing an encapsulated micro electro-mechanical system (MEMS) which causes little metallic fatigue and stress.
SOLUTION: The MEMS manufacturing method includes steps for forming a dielectric layer 204, patterning the upper surface of the first dielectric layer 204 to form a trench, forming a release material 212 in the trench, patterning the upper surface of the release material 212 to form the other trench, forming a first encapsulating layer 222 that includes sidewalls in the other trench, forming a core layer 242 in the first encapsulating layer 222, and forming a second encapsulating layer 262 above the core layer 242 where the second encapsulating layer 262 is connected to sidewalls of the first encapsulating layer 222.
COPYRIGHT: (C)2004,JPO-
公开(公告)号：JP2003109431A
公开(公告)日：2003-04-11
申请号：JP2002184636
申请日：2002-06-25
Applicant: IBM
Inventor： JOHN M COTTE , MCCULLOUGH KENNETH JOHN , MOREAU WAYNE MARTIN , PETRARCA KEVIN , SIMONS JOHN P , TAFT CHARLES J , VOLANT RICHARD
IPC: H01B3/30 , H01L21/3105 , H01L21/312 , H01L21/316
Abstract: PROBLEM TO BE SOLVED: To provide a new kind of high polymer material having a lowered dielectric constant, properly applicable to an electric assembly using a small semiconductor element recently developed. SOLUTION: This high polymer material is formed by forcing a polymer having a low dielectric constant into contact with liquid or supercritical carbon dioxide under a thermodynamic condition to maintain the carbon dioxide in a liquid or supercritical state. Thereby, a porous product is formed. Subsequently, the high polymer material having a substantially lowered dielectric constant can be obtained by changing the thermodynamic condition to a working environment wherein the carbon dioxide escapes from fine holes and is replaced with air.
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公开(公告)号：JP2002216606A
公开(公告)日：2002-08-02
申请号：JP2001355091
申请日：2001-11-20
Applicant: IBM
Inventor： PETRARCA KEVIN , ROBERT A GROVES , HERBST BRIAN , JAHNES CHRISTOPHER , VOLANT RICHARD
Abstract: PROBLEM TO BE SOLVED: To provide a new micromini electromechanical(MEM) switch. SOLUTION: This MEM switch contains a guide post formed on a substrate. A signal transmission line having a gap to form an open-circuit is produced on the substrate. The switch also contains a switch body internally-provided with a via opening, which is movably-located along the length demarcated by the guide post. The guide post is partially enclosed with the via opening.
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公开(公告)号：AT487230T
公开(公告)日：2010-11-15
申请号：AT06778031
申请日：2006-07-27
Applicant: IBM
Inventor： HICHRI HABIB , LARSEN KIMBERLY , MAYNARD HELEN , PETRARCA KEVIN
IPC: H01L21/02 , H01F17/00 , H01F41/04 , H01F41/10 , H01L21/768
Abstract: The invention forms integrated circuit devices of similar structure and dissimilar depth, such as interconnects and inductors, simultaneously. The invention deposits a conformal polymer over an area on a substrate with vias and an area without vias. Simultaneously, cavities are formed in the areas with and without vias. The depth of the cavities formed in the areas with vias will extend deeper into the substrate than the cavities formed in areas without vias. Such occurs because the polymer deposits unevenly along the surface of the substrate and more specifically, more thinly in areas with underlying depressions. Once filled with a conductive material, cavities which extend more deeply into the substrate, which were formed in areas with vias, become inductors, and the cavities which extend less deeply into the substrate, which were formed in areas without vias, become interconnects.
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公开(公告)号：AT368934T
公开(公告)日：2007-08-15
申请号：AT01126761
申请日：2001-11-09
Applicant: IBM
Inventor： GROVES ROBERT A , HERBST BRIAN , JAHNES CHRISTOPHER , PETRARCA KEVIN , VOLANT RICHARD
Abstract: A micro electromechanical switch has a guidepost formed upon a substrate. A signal transmission line is formed on the substrate, with the signal transmission line having a gap and forming an open circuit. The switch further includes a switch body having a via opening formed therein, with the switch body being movably disposed along an length defined by the guide post. The guidepost is partially surrounded by the via opening.
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Patent Agency Ranking
公开(公告)号：AT522953T
公开(公告)日：2011-09-15
申请号：AT03770552
申请日：2003-09-30
Applicant: IBM
Inventor： VOLANT RICHARD , PETRARCA KEVIN , WALKER GEORGE
IPC: H01R12/00
Abstract: A three-dimensional package consisting of a plurality of folded integrated circuit chips ( 100, 110, 120 ) is described wherein at least one chip provides interconnect pathways for electrical connection to additional chips of the stack, and at least one chip ( 130 ) is provided with additional interconnect wiring to a substrate ( 500 ), package or printed circuit board. Further described, is a method of providing a flexible arrangement of interconnected chips that are folded over into a three-dimensional arrangements to consume less aerial space when mounted on a substrate, second-level package or printed circuit board.
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公开(公告)号：DE602006018049D1
公开(公告)日：2010-12-16
申请号：DE602006018049
申请日：2006-07-27
Applicant: IBM
Inventor： HICHRI HABIB , LARSEN KIMBERLY , MAYNARD HELEN , PETRARCA KEVIN
IPC: H01L21/02 , H01F17/00 , H01F41/04 , H01F41/10 , H01L21/768
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公开(公告)号：DE60129657T2
公开(公告)日：2008-05-21
申请号：DE60129657
申请日：2001-11-09
Applicant: IBM
Inventor： GROVES ROBERT A , HERBST BRIAN , JAHNES CHRISTOPHER , PETRARCA KEVIN , VOLANT RICHARD
Abstract: A micro electromechanical switch has a guidepost formed upon a substrate. A signal transmission line is formed on the substrate, with the signal transmission line having a gap and forming an open circuit. The switch further includes a switch body having a via opening formed therein, with the switch body being movably disposed along an length defined by the guide post. The guidepost is partially surrounded by the via opening.
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公开(公告)号：DE60129657D1
公开(公告)日：2007-09-13
申请号：DE60129657
申请日：2001-11-09
Applicant: IBM
Inventor： GROVES ROBERT A , HERBST BRIAN , JAHNES CHRISTOPHER , PETRARCA KEVIN , VOLANT RICHARD
Abstract: A micro electromechanical switch has a guidepost formed upon a substrate. A signal transmission line is formed on the substrate, with the signal transmission line having a gap and forming an open circuit. The switch further includes a switch body having a via opening formed therein, with the switch body being movably disposed along an length defined by the guide post. The guidepost is partially surrounded by the via opening.
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公开(公告)号：AT549741T
公开(公告)日：2012-03-15
申请号：AT04723639
申请日：2004-03-26
Applicant: IBM
Inventor： ANGELL DAVID , BEAULIEU FREDERIC , HISADA TAKASHI , KELLY ADREANNE , MCKNIGHT SAMUEL , MIYAI HIROMITSU , PETRARCA KEVIN , SAUTER WOLFGANG , VOLANT RICHARD , WEINSTEIN CAITLIN
IPC: H01L21/60 , H01L23/485
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