公开(公告)号：JP2003123217A

公开(公告)日：2003-04-25

申请号：JP2001313491

申请日：2001-10-11

Applicant: IBM

Inventor： TSUCHIYA TATSUMI ,  MATSUMOTO YUSUKE ,  MUROKAWA TAKAAKI ,  FUJII NAOKI ,  SATO TAKUYA ,  MITA YASUHIRO ,  TSUCHIDA HIROYASU ,  UEMATSU YOSHIO

IPC: G11B5/60 ,  G11B5/48 ,  G11B21/21 ,  H05K1/18 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide a wiring integrated suspension where the position of a solder ball is not deviated from a center line when a bonding pad and a lead wiring pad are connected by the solder ball. SOLUTION: In the wiring integrated suspension where a solder ball 400 is arranged between a lead wiring pad 20 disposed in the flexure part 5 of a suspension and a bonding pad 15 disposed in the slide of a head gimbals part, and the solder ball 400 is melted to connect the lead wiring pad 20 and the bonding pad 13 by solder, in the vicinity of the center lien CL of the surface of the lead wiring pad 20, a recess 21 is formed to drop the solder ball 400 from the surface projected parts 22, 23 of the lead wiring pad 20 by gravity.