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公开(公告)号：JP2002251705A
公开(公告)日：2002-09-06
申请号：JP2001039888
申请日：2001-02-16
Applicant: IBM
Inventor： TSUCHIYA TATSUMI , SATO TAKUYA , MITA YASUHIRO , SHI ARASHI , YOKOME HIROYOSHI , YOSHIDA TATSUSHI , SURUYA PATANAIKU
Abstract: PROBLEM TO BE SOLVED: To attain the increase in efficiency, the miniaturization and the enhancement in maintenance of a solder ball disposing device for disposing a solder ball and a solder ball reflow device for performing solder ball reflow, with respect to a device which joins the slider bonding pad of a head gimbals assembly and the leading pad of a lead wire to each other by a solder ball. SOLUTION: The solder ball flying out from a solder ball discharging opening of a solder ball supplying device 1 is attracted by a suction pad 3. An environmental space 6c in which an inert atmosphere is formed and an inert gas supplying part are formed on a placing plate 6 and the inert gas supplying means is removed from an optical device 4 so that the solder ball is directly irradiated with an outputted convergent laser beam.
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公开(公告)号：JP2002048716A
公开(公告)日：2002-02-15
申请号：JP2000200861
申请日：2000-07-03
Applicant: IBM
Inventor： TSUCHIYA TATSUMI , YOSHIDA TATSUSHI , ITO KENJI , KOIKE TORU , MATSUMOTO YUSUKE , FUJIMORI MASASHI , NAKAGAWA SEIJI
Abstract: PROBLEM TO BE SOLVED: To provide a jig unnecessary for an inspector to pass a head assembly from one hand to the other hand many times when executing an appearance inspection from many directions. SOLUTION: This jig is provided with a base part 11 having an upper plane 11u to be a placing table of an optical microscope 100 in inspecting the appearance of a small component 30 using the optical microscope 100, and provided with a moving means 11b for moving the upper plane 11u almost parallel with the optical axis direction of at least an objective lens 103 of the optical microscope 100 in order to focus an inspected part of the small component 30 placed on the upper place 11u, on the focus of the optical microscope 100, an inspection object support part 20 provided with a support means 21 capable of supporting the small component 30 in a specified position on the base part 11, and reflecting mirror means 22 to 24 having mirror surfaces at the rising angle of about 45 deg. from the upper plane 11u of the base part 11.
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公开(公告)号：JP2001043647A
公开(公告)日：2001-02-16
申请号：JP20163099
申请日：1999-07-15
Applicant: IBM
Inventor： TSUCHIYA TATSUMI , YOSHIDA TATSUSHI , TSUCHIDA HIROYASU , INOUE HIROO , SURUYA PATANAIKU , ISHIKAWA HIROMI , NANBA MASAAKI
Abstract: PROBLEM TO BE SOLVED: To prevent short-circuiting caused by the oozing-out of flexure adhesive, to absorb distortion caused by the contraction of a soldered part by reducing the rigidity of a flexure, and to improve the quality of the soldered part by arranging pads adjacently to each other as much as possible when the bonding pad formed in a slider held in the flexure and the leading pad for a lead fixed to the platform of the flexure are soldered to each other. SOLUTION: Holes 21 and 22 are bored in a flexure 8 portion near the soldered parts of the bonding pads 28 to 31 of a slider 25 and the leading pads 41 to 44 of a lead end part. Thus, since adhesive for adhering the slider 25 to a flexure tongue 20 is moved downward from the holes 21 and 22, the adhesive is prevented from being brought into contact with the bonding pads 28 to 31.
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公开(公告)号：JP2002045962A
公开(公告)日：2002-02-12
申请号：JP2001158474
申请日：2001-05-28
Applicant: IBM
Inventor： TSUCHIYA TATSUMI , YOSHIDA TATSUSHI , MITA YASUHIRO , TOMIYAMA TADAAKI , KIDACHI TAKAO , SURUYA PATANAIKU
Abstract: PROBLEM TO BE SOLVED: To prevent defective bonding due to positional deviation or distortion of a soldered part by correctly positioning a spherical solder ball at a desired bonding position, irradiating it with the laser beam in a stable state, and implementing the reflow when bonding a bonding pad formed on a slider with a pad for a lead formed on a lead wire by the solder ball bonding, and to prevent reduction in energy due to the reflection of the laser beam inside a capillary tube. SOLUTION: A most distal tip part of the capillary tube can be located slightly below a center position P1 of the solder ball contained therein by tapering a tip part 6a of the capillary tube, a play clearance for allowing the solder ball to move is prevented from being increased. In addition, a part in the capillary tube, which is irradiated with the laser beam is mirror-finished.
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公开(公告)号：JP2001232573A
公开(公告)日：2001-08-28
申请号：JP2000044742
申请日：2000-02-22
Applicant: IBM
Inventor： UEMATSU YOSHIO , ICHIMURA YOTARO , TSUCHIYA TATSUMI , YOSHIDA TATSUSHI
Abstract: PROBLEM TO BE SOLVED: To provide an air tweezer capable of sucking an object having an extremely small dimension such as a pico slider or a femto slider and arranging it at a predetermined position of a suspension efficiently and providing a countermeasure against ESD. SOLUTION: This air tweezer 1 comprises a tweezer body 2 for gripping when work is done, a tube assembly 5 mounted on the tweezer body 2 and having a suction passage, and a suction pad 6 mounted at a tip of the tube assembly 5 and provided with an opening communicated with the suction passage to suck the object by the suction pad 6 by letting a suction force act on the suction passage of the tube assembly 5. The suction pad 6 is made of an elastic member provided with an electric current carrying path.
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Patent Agency Ranking
公开(公告)号：JP2000315367A
公开(公告)日：2000-11-14
申请号：JP12348899
申请日：1999-04-30
Applicant: IBM
Inventor： TSUCHIYA TATSUMI , NOJIRI TOMOAKI , YOSHIDA TATSUSHI , YOKOME HIROYOSHI , SUZUKI NAOKI
Abstract: PROBLEM TO BE SOLVED: To evenly extend an adhesive to a face to be bonded by moving a nozzle which puts out an adhesive along a straight line on either of the face to be bonded of a slider and the face to be bonded of suspension by a prescribed distance so that a moving locus at the time of leaving of the nozzle from the face to be bonded includes a component in the direction perpendicular to the face to be bonded. SOLUTION: The nozzle 77b is positioned at the standby position where attaching and removing of a connecting jig 50 is not obstructed in the initial state, is loaded at the point P1 at the time of staring the coating motion and the tip part is moved along a moving path R1 to the point P2. Therein, air is fed into a syringe charged with a high viscosity and low elastic epoxy adhesive having thixotropy and the nozzle is moved along the moving path R2 parallel to the face 25a to be bonded of the slider 25 while extruding the adhesive from the nozzle 77b. The nozzle stops the extrusion of the adhesive at the point P3 and is moved up to the point P4 along the moving path R3 in the direction perpendicular to the face to be bonded. Further, the nozzle is moved up to the point 5 along the moving path R4 in an inverse direction with the moving path R2.
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公开(公告)号：JP2000195031A
公开(公告)日：2000-07-14
申请号：JP37027298
申请日：1998-12-25
Applicant: IBM
Inventor： TSUCHIYA TATSUMI , YOSHIDA TATSUSHI , YOKOME HIROYOSHI , FUJII NAOKI
Abstract: PROBLEM TO BE SOLVED: To prevent damage of a read/write head during the heat treatment by providing, to a load beam, an exposure opening to expose both a part of the surface area including an edge of the bonding part of the flexure and a part of the slider surface. SOLUTION: An opening 49 is formed at the position where both a part of the surface area including an edge of the bonding part 56A and a part of the upper surface of the slider are exposed. This opening 49 is formed between the opposite edge and dimple 62 against an edge at the surface of slider in which the read/write head 63 is mounted. With this formation, an MR head 63 can be prevented from damage due to the heat applied with the laser beam. A part of the heat applied to such position is transferred to a load beam 54 via the dimple 62 arranged in the heat transfer path provided between such position and he read/write head 63.
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公开(公告)号：JPH1196710A
公开(公告)日：1999-04-09
申请号：JP26152397
申请日：1997-09-26
Applicant: IBM
Inventor： SATO TAKUYA , YOSHIDA TATSUSHI , TSUCHIYA TATSUMI , KUROSU NAOKI
Abstract: PROBLEM TO BE SOLVED: To provide a method for ultrasonic adhesion of a slider adapted to a simplified integral type suspension structure which is relatively simple in production and a treatment method therefor. SOLUTION: The integral type suspension for a slider 48 of a magnetic memory system is assembled from the separated parts including a load beam 58, a flexer 60 and a mounting plate. The flexer includes a flexible member 74 and conductive leads 64 integrally formed thereon. Since the flexible member 24 is an ultra-thin type, the deflection of the flexer is minimized by the supporting with a platform support in the ultrasonic adhesion of the conductive leads 64 and the bonding pads 78 of the slider 48. The ultrasonic adhesion is executed successively from the points near the supporting points in order to minimize the deflection. Further, the influence on the flexer which is a fine part is averted by using a tab 72 extending from the front end of the loading beam 58.
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公开(公告)号：JPH09128726A
公开(公告)日：1997-05-16
申请号：JP26441395
申请日：1995-10-12
Applicant: IBM
Inventor： TSUCHIYA TATSUMI , NAKAGAWA SEIJI , YOSHIDA TATSUSHI , MITA YASUHIRO
Abstract: PROBLEM TO BE SOLVED: To eliminate the need of a harness, to reduce the number of parts and the number of processes and to improve productivity and quality by providing a new tab structure. SOLUTION: The flexure 42 of a suspension assembly 40 is formed with high accuracy and the new tab structure is provided integrally with or separately from the flexure 42. The plural wires 52 of a wire assembly are held with prescribed gaps and bridged to the extension part 112 of the tab structure and the wires 52 and the bonding pad 70 of a head 20 are relatively accurately positioned and bonded by the hole 116 for positioning of high flatness. Thereafter, the suspension assembly 40 and the head 20 are adhered, the unnecessitated tab structure is removed and a head suspension assembly is finally completed.
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10.发明专利
公开(公告)号：JP2002170351A
公开(公告)日：2002-06-14
申请号：JP2000355838
申请日：2000-11-22
Applicant: IBM
Inventor： KIDACHI TAKAO , TOMIYAMA TADAAKI , UEMATSU YOSHIO , ISHIKAWA HIROMI , YOSHIDA TATSUSHI , YOKOME HIROYOSHI , NAKAMURA YUKIHIRO , OYAMA HIROSHI , TSUCHIYA TATSUMI
Abstract: PROBLEM TO BE SOLVED: To solve the problems, such as the degradation in working space efficiency and a cost increase by as much as the need for assembly jigs (holders and fixtures, etc.), as trays or blocks move as a pair at all times while unfinished HG assemblies move between respective manufacturing process steps in assembling the HG assemblies which are components of hard disk devices and consequently the assembly jigs are needed by as much as the number of the unfinished HG assemblies existing in at least the respective assembly process steps. SOLUTION: Base plates, load beams, etc., which are lamination members constituting the HG assemblies are respectively formed of run constitution. The base late runs 3 and the load beam runs 4 are conveyed in the laminated run state by the conveyance equipment 2 and are subjected in the run state to necessary assembly process steps, such as adhesion of the respective layers, fitting of sliders, electrical connection of terminals and the like.
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