公开(公告)号：JP2003123217A

公开(公告)日：2003-04-25

申请号：JP2001313491

申请日：2001-10-11

Applicant: IBM

Inventor： TSUCHIYA TATSUMI ,  MATSUMOTO YUSUKE ,  MUROKAWA TAKAAKI ,  FUJII NAOKI ,  SATO TAKUYA ,  MITA YASUHIRO ,  TSUCHIDA HIROYASU ,  UEMATSU YOSHIO

IPC: G11B5/60 ,  G11B5/48 ,  G11B21/21 ,  H05K1/18 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide a wiring integrated suspension where the position of a solder ball is not deviated from a center line when a bonding pad and a lead wiring pad are connected by the solder ball. SOLUTION: In the wiring integrated suspension where a solder ball 400 is arranged between a lead wiring pad 20 disposed in the flexure part 5 of a suspension and a bonding pad 15 disposed in the slide of a head gimbals part, and the solder ball 400 is melted to connect the lead wiring pad 20 and the bonding pad 13 by solder, in the vicinity of the center lien CL of the surface of the lead wiring pad 20, a recess 21 is formed to drop the solder ball 400 from the surface projected parts 22, 23 of the lead wiring pad 20 by gravity.

公开(公告)号：JP2002015536A

公开(公告)日：2002-01-18

申请号：JP2001158467

申请日：2001-05-28

Applicant: IBM

Inventor： TSUCHIYA TATSUMI ,  YOSHIDA TATSUSHI ,  FUJII NAOKI ,  SUZUKI NAOKI ,  MATSUMOTO YUSUKE ,  SURUYA PATANAIKU ,  WILLIAM A CHILDERS ,  O'REGAN DIANE SPRANDEL

IPC: G11B21/21 ,  G11B5/48

Abstract: PROBLEM TO BE SOLVED: To solve the problem that conventionally it is difficult to improve the efficiency of operation and the efficiency of internal space in a high-temperature vessel, because it is necessary to keep a joined state between a slider of hard disk device(HDD) and a suspension which supports the slider, by using a joining jig until epoxy adhesive is hardened through heat treatment, when the slider and the suspension are adhered by the epoxy adhesive of low elasticity, and, the operation is performed in the state of being set by the joining jig, even when both are moved during operational processes or are heat treated in the high-temperature vessel. SOLUTION: One part of a joint part, of the slider and the suspension which are joined with an epoxy adhesive of low elasticity interposed in between, is heated by a laser beam and is temporally tacked by partially hardening the adhesive. In addition, in order to determine the output and the irradiation time of the laser beam beforehand, the value of resistance of a head which is disposed on the slider is measured, and the temperature is monitored. The output and the irradiation time, which permits the desired temporal tacking strength within a range, where the measured temperature does not exceeds the prescribed temperature, are determined.

公开(公告)号：JP2000195031A

公开(公告)日：2000-07-14

申请号：JP37027298

申请日：1998-12-25

Applicant: IBM

Inventor： TSUCHIYA TATSUMI ,  YOSHIDA TATSUSHI ,  YOKOME HIROYOSHI ,  FUJII NAOKI

IPC: G11B5/60 ,  G11B5/48 ,  G11B21/21

Abstract: PROBLEM TO BE SOLVED: To prevent damage of a read/write head during the heat treatment by providing, to a load beam, an exposure opening to expose both a part of the surface area including an edge of the bonding part of the flexure and a part of the slider surface. SOLUTION: An opening 49 is formed at the position where both a part of the surface area including an edge of the bonding part 56A and a part of the upper surface of the slider are exposed. This opening 49 is formed between the opposite edge and dimple 62 against an edge at the surface of slider in which the read/write head 63 is mounted. With this formation, an MR head 63 can be prevented from damage due to the heat applied with the laser beam. A part of the heat applied to such position is transferred to a load beam 54 via the dimple 62 arranged in the heat transfer path provided between such position and he read/write head 63.