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公开(公告)号：JP2002015534A
公开(公告)日：2002-01-18
申请号：JP2000182775
申请日：2000-06-19
Applicant: IBM
Inventor： TSUCHIYA TATSUMI , YOSHIDA TATSUSHI , SATO TAKUYA , MITA YASUHIRO , NAKA KOICHIRO
Abstract: PROBLEM TO BE SOLVED: To prevent a head gimbal assembly(HGA) as a component of a hard disk device, which has a bent part which is elastic and is bent by a prescribed angle in the no-load state, is fitted into the joining jig, in a state with the bent part being straight and stuck with a slider to a holding part, from falling into the locked state because the bent part is not freely recovered, and therefore, is hitched on a joining jig in the process, when the HG assembly is separated from the joining jig after the sticking. SOLUTION: The slider 54 is restrained by the joining jig 1, a positioning pin 2 which is relatively movable in the state of being fitted into the positioning hole 11 of the HG assembly 10 is fitted thereinto, and at the same time, a movable pin 3 is fitted into a mounting hole 56 and is moved in the direction of an arrow YY and the HG assembly is fixed on the joining jig 1 by a clamper 64 in the state that the holding of the bent part 52i is straightened. In addition, after the sticking, the restraint of the slider 54 is released, and the fixed state of the HG assembly 10 by means of the clamper 64 is released, in a state with the movable pin 3 being set freely movable.
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公开(公告)号：JP2002251705A
公开(公告)日：2002-09-06
申请号：JP2001039888
申请日：2001-02-16
Applicant: IBM
Inventor： TSUCHIYA TATSUMI , SATO TAKUYA , MITA YASUHIRO , SHI ARASHI , YOKOME HIROYOSHI , YOSHIDA TATSUSHI , SURUYA PATANAIKU
Abstract: PROBLEM TO BE SOLVED: To attain the increase in efficiency, the miniaturization and the enhancement in maintenance of a solder ball disposing device for disposing a solder ball and a solder ball reflow device for performing solder ball reflow, with respect to a device which joins the slider bonding pad of a head gimbals assembly and the leading pad of a lead wire to each other by a solder ball. SOLUTION: The solder ball flying out from a solder ball discharging opening of a solder ball supplying device 1 is attracted by a suction pad 3. An environmental space 6c in which an inert atmosphere is formed and an inert gas supplying part are formed on a placing plate 6 and the inert gas supplying means is removed from an optical device 4 so that the solder ball is directly irradiated with an outputted convergent laser beam.
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Patent Agency Ranking
公开(公告)号：JP2002045962A
公开(公告)日：2002-02-12
申请号：JP2001158474
申请日：2001-05-28
Applicant: IBM
Inventor： TSUCHIYA TATSUMI , YOSHIDA TATSUSHI , MITA YASUHIRO , TOMIYAMA TADAAKI , KIDACHI TAKAO , SURUYA PATANAIKU
Abstract: PROBLEM TO BE SOLVED: To prevent defective bonding due to positional deviation or distortion of a soldered part by correctly positioning a spherical solder ball at a desired bonding position, irradiating it with the laser beam in a stable state, and implementing the reflow when bonding a bonding pad formed on a slider with a pad for a lead formed on a lead wire by the solder ball bonding, and to prevent reduction in energy due to the reflection of the laser beam inside a capillary tube. SOLUTION: A most distal tip part of the capillary tube can be located slightly below a center position P1 of the solder ball contained therein by tapering a tip part 6a of the capillary tube, a play clearance for allowing the solder ball to move is prevented from being increased. In addition, a part in the capillary tube, which is irradiated with the laser beam is mirror-finished.
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公开(公告)号：JPH1145531A
公开(公告)日：1999-02-16
申请号：JP19811797
申请日：1997-07-24
Applicant: IBM
Inventor： TSUCHIDA HIROYASU , SATO TAKUYA , MITA YASUHIRO , YOSHIDA TATSUSHI , ISHIKAWA HIROMI , TANAKA TATSUYA
Abstract: PROBLEM TO BE SOLVED: To accurately control the flying height by obtaining the ideal static attitude of a head/slider assembly. SOLUTION: The head supporting arm 17 of the disk drive device is provided with a front part for supporting an assembly 21, a rear part pivotally attached 30 to the frame of the drive device, a bent part 31 between the front part and rear part, plural conductive wires 25 covered with a tube, and a first and 2nd fixing positions 38, 39 symmetrically arranged on the both sides of the center line of the arm in the position between the bent part and the front part. The tube is mounted on the arm between the bent part and the rear part, and the plural conductive wires extended from the tip of the tube positioned on the front part side of the arm are extended above the bent part and divided into a 1st and 2nd groups 25A, 25B, then the wires of the 1st, 2nd groups are respectively fixed to the 1st and 2nd fixing positions and connected to the head while being symmetrically arranged on the both sides of the center line 29.
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公开(公告)号：JPH09128726A
公开(公告)日：1997-05-16
申请号：JP26441395
申请日：1995-10-12
Applicant: IBM
Inventor： TSUCHIYA TATSUMI , NAKAGAWA SEIJI , YOSHIDA TATSUSHI , MITA YASUHIRO
Abstract: PROBLEM TO BE SOLVED: To eliminate the need of a harness, to reduce the number of parts and the number of processes and to improve productivity and quality by providing a new tab structure. SOLUTION: The flexure 42 of a suspension assembly 40 is formed with high accuracy and the new tab structure is provided integrally with or separately from the flexure 42. The plural wires 52 of a wire assembly are held with prescribed gaps and bridged to the extension part 112 of the tab structure and the wires 52 and the bonding pad 70 of a head 20 are relatively accurately positioned and bonded by the hole 116 for positioning of high flatness. Thereafter, the suspension assembly 40 and the head 20 are adhered, the unnecessitated tab structure is removed and a head suspension assembly is finally completed.
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公开(公告)号：JP2003123217A
公开(公告)日：2003-04-25
申请号：JP2001313491
申请日：2001-10-11
Applicant: IBM
Inventor： TSUCHIYA TATSUMI , MATSUMOTO YUSUKE , MUROKAWA TAKAAKI , FUJII NAOKI , SATO TAKUYA , MITA YASUHIRO , TSUCHIDA HIROYASU , UEMATSU YOSHIO
Abstract: PROBLEM TO BE SOLVED: To provide a wiring integrated suspension where the position of a solder ball is not deviated from a center line when a bonding pad and a lead wiring pad are connected by the solder ball. SOLUTION: In the wiring integrated suspension where a solder ball 400 is arranged between a lead wiring pad 20 disposed in the flexure part 5 of a suspension and a bonding pad 15 disposed in the slide of a head gimbals part, and the solder ball 400 is melted to connect the lead wiring pad 20 and the bonding pad 13 by solder, in the vicinity of the center lien CL of the surface of the lead wiring pad 20, a recess 21 is formed to drop the solder ball 400 from the surface projected parts 22, 23 of the lead wiring pad 20 by gravity.
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公开(公告)号：JP2000315307A
公开(公告)日：2000-11-14
申请号：JP12328899
申请日：1999-04-30
Applicant: IBM
Inventor： ITO KENJI , MITA YASUHIRO , NANBA MASAAKI , YOSHIDA TATSUSHI
Abstract: PROBLEM TO BE SOLVED: To lower the wire height of HGA(head gimbal assembly) and to stabilize the stationary posture of a head/slider. SOLUTION: The HGA is equipped with a head/slider 40 consisting of a slider for flying on a disk surface and a head for reading/writing data in a non-contact state for the disk surface; with four electrically conductive data- transmitting wires 61 connected to the head at one end; and with a load beam 20 which is loaded with the wires 61, which carries the head/slider 40 near the front end 24, and which is supported at the rear end 23 by an actuator. Further, in the HGA, the wires 61 are fixed on the wire loading surface 21 of the load beam 20 at the fixing point E (E1, E2) between the head connecting end H and the rear end 23, with a wire loop 610 provided between the head connecting end H and the wire fixing point E, and a distance De is shorter than the conventional one between the head connecting position Hg and the wire fixing position Eg, that is, approximately 3.8 (mm) or less.
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