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    SOLDER BALL JOINING DEVICE AND METHOD FOR JOINING SOLDER BALL
    1.
    发明专利
    SOLDER BALL JOINING DEVICE AND METHOD FOR JOINING SOLDER BALL 失效

    公开(公告)号：JP2002025025A

    公开(公告)日：2002-01-25

    申请号：JP2000189148

    申请日：2000-06-23

    Applicant: IBM

    Inventor： TSUCHIYA TATSUMI ,  YOSHIDA TATSUSHI ,  SATO TAKUYA ,  SURUYA PATANAIKU

    IPC: B23K1/00 ,  B23K1/005 ,  B23K3/00 ,  B23K3/06 ,  B23K31/02 ,  B23K101/38 ,  G11B5/17 ,  G11B5/60 ,  G11B21/21 ,  H01R43/02 ,  H05K3/34

    Abstract: PROBLEM TO BE SOLVED: To solve the problem that laser irradiation efficiency, maintenance, work efficiency of a conventional solder ball joining device due to spatial restriction, difficulty in the weight reduction and fixed work procedure, etc., involved in the device which joins the slider bonding pad of a head gimbals assembly and the leading pad of a lead wire to each other by a solder ball, and carries out (1) the supplying of the solder ball, (2) the positioning of the solder ball, (3) the spraying of nitrogen gas N2, and (4) the dissolving of the solder ball by laser irradiation, by only one device. SOLUTION: This solder ball joining device is provided with a solder ball holding device 1, and optical device 4, these being separately installed, and a suction pad 3, solder balls 135 held in the soldering ball holding holes of the soldering ball holding device 1 are conveyed to the connection part of the head gimbals assembly by the suction pad 3, and solder is caused to reflow by the optical device 4.

    METHOD FOR SEPARATING HEAD GIMBAL ASSEMBLY FROM JOINING JIG AND ITS JOINING JIG
    2.
    发明专利
    METHOD FOR SEPARATING HEAD GIMBAL ASSEMBLY FROM JOINING JIG AND ITS JOINING JIG 失效

    公开(公告)号：JP2002015534A

    公开(公告)日：2002-01-18

    申请号：JP2000182775

    申请日：2000-06-19

    Applicant: IBM

    Inventor： TSUCHIYA TATSUMI ,  YOSHIDA TATSUSHI ,  SATO TAKUYA ,  MITA YASUHIRO ,  NAKA KOICHIRO

    IPC: G11B21/21 ,  B23K37/04 ,  G11B5/48

    Abstract: PROBLEM TO BE SOLVED: To prevent a head gimbal assembly(HGA) as a component of a hard disk device, which has a bent part which is elastic and is bent by a prescribed angle in the no-load state, is fitted into the joining jig, in a state with the bent part being straight and stuck with a slider to a holding part, from falling into the locked state because the bent part is not freely recovered, and therefore, is hitched on a joining jig in the process, when the HG assembly is separated from the joining jig after the sticking. SOLUTION: The slider 54 is restrained by the joining jig 1, a positioning pin 2 which is relatively movable in the state of being fitted into the positioning hole 11 of the HG assembly 10 is fitted thereinto, and at the same time, a movable pin 3 is fitted into a mounting hole 56 and is moved in the direction of an arrow YY and the HG assembly is fixed on the joining jig 1 by a clamper 64 in the state that the holding of the bent part 52i is straightened. In addition, after the sticking, the restraint of the slider 54 is released, and the fixed state of the HG assembly 10 by means of the clamper 64 is released, in a state with the movable pin 3 being set freely movable.

    ULTRASONIC BONDING METHOD OF SLIDER AND LEAD WIRE
    3.
    发明专利
    ULTRASONIC BONDING METHOD OF SLIDER AND LEAD WIRE 失效

    公开(公告)号：JP2000315308A

    公开(公告)日：2000-11-14

    申请号：JP12351799

    申请日：1999-04-30

    Applicant: IBM

    Inventor： TSUCHIYA TATSUMI ,  YOSHIDA TATSUSHI ,  SATO TAKUYA ,  HAYASHI AKIKO

    IPC: G11B5/60 ,  B23K20/10 ,  G11B21/21

    Abstract: PROBLEM TO BE SOLVED: To prevent deformation of a flexure after ultrasonic bonding by placing a sucking pad against a platform, sucking the platform by the sucking pad, securing the platform on the sucking pad, pressing a part to be bonded of a lead wire against an opposed bonding pad and executing the ultrasonic bonding thereon. SOLUTION: A slider 25 is firmly positioned by a slider fixing base, a slider fixing lever and a clamper 83a of a bonding jig. The platform 39 of a top end part of the flexure 8 is sucked, to four sucking ports 87, 88, 89 and 90 of the sucking pad 82 and held on a top end surface 91 of the sucking pad 82. Subsequently, a wedge pressurizes a connection terminal 42 of the lead 32, the curved part of the lead 32 is plastically deformed and pressed against the contacting bonding pad 29 of the slider 25. The wedge itself is subjected to ultrasonic vibration in a state where the connection terminal 43 is pressurized against the bonding pad 30 by the wedge. Therein, the vibration occurs in a direction along X-axis.

    METHOD FOR EXECUTING ULTRASONIC ADHESION AND METHOD FOR RELEASING SUSPENSION ASSEMBLY BY DEFORMING AND MAINTAINING THE SAME
    6.
    发明专利
    METHOD FOR EXECUTING ULTRASONIC ADHESION AND METHOD FOR RELEASING SUSPENSION ASSEMBLY BY DEFORMING AND MAINTAINING THE SAME 失效

    公开(公告)号：JPH1196710A

    公开(公告)日：1999-04-09

    申请号：JP26152397

    申请日：1997-09-26

    Applicant: IBM

    Inventor： SATO TAKUYA ,  YOSHIDA TATSUSHI ,  TSUCHIYA TATSUMI ,  KUROSU NAOKI

    IPC: G11B5/60 ,  G11B5/48 ,  G11B21/21

    Abstract: PROBLEM TO BE SOLVED: To provide a method for ultrasonic adhesion of a slider adapted to a simplified integral type suspension structure which is relatively simple in production and a treatment method therefor. SOLUTION: The integral type suspension for a slider 48 of a magnetic memory system is assembled from the separated parts including a load beam 58, a flexer 60 and a mounting plate. The flexer includes a flexible member 74 and conductive leads 64 integrally formed thereon. Since the flexible member 24 is an ultra-thin type, the deflection of the flexer is minimized by the supporting with a platform support in the ultrasonic adhesion of the conductive leads 64 and the bonding pads 78 of the slider 48. The ultrasonic adhesion is executed successively from the points near the supporting points in order to minimize the deflection. Further, the influence on the flexer which is a fine part is averted by using a tab 72 extending from the front end of the loading beam 58.

    HEAD SUPPORTING ARM AND DISK DRIVE DEVICE
    7.
    发明专利
    HEAD SUPPORTING ARM AND DISK DRIVE DEVICE 失效

    公开(公告)号：JPH1145531A

    公开(公告)日：1999-02-16

    申请号：JP19811797

    申请日：1997-07-24

    Applicant: IBM

    Inventor： TSUCHIDA HIROYASU ,  SATO TAKUYA ,  MITA YASUHIRO ,  YOSHIDA TATSUSHI ,  ISHIKAWA HIROMI ,  TANAKA TATSUYA

    IPC: G11B5/60 ,  G11B5/48 ,  G11B21/21

    Abstract: PROBLEM TO BE SOLVED: To accurately control the flying height by obtaining the ideal static attitude of a head/slider assembly. SOLUTION: The head supporting arm 17 of the disk drive device is provided with a front part for supporting an assembly 21, a rear part pivotally attached 30 to the frame of the drive device, a bent part 31 between the front part and rear part, plural conductive wires 25 covered with a tube, and a first and 2nd fixing positions 38, 39 symmetrically arranged on the both sides of the center line of the arm in the position between the bent part and the front part. The tube is mounted on the arm between the bent part and the rear part, and the plural conductive wires extended from the tip of the tube positioned on the front part side of the arm are extended above the bent part and divided into a 1st and 2nd groups 25A, 25B, then the wires of the 1st, 2nd groups are respectively fixed to the 1st and 2nd fixing positions and connected to the head while being symmetrically arranged on the both sides of the center line 29.

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