公开(公告)号：EP2104136A4

公开(公告)日：2012-03-07

申请号：EP07850933

申请日：2007-12-19

Applicant: IBM

Inventor： OYAMA YUKIFUMI ,  TORIYAMA KAZUSHIGE ,  NISHIWAKI HIDETOSHI ,  ORII YASUMITSU ,  NISHIO TOSHIHIKO

IPC: H01L21/60

CPC classification number: H01L24/13 ,  B23K1/0016 ,  B23K3/0623 ,  B23K2201/40 ,  H01L23/498 ,  H01L23/49822 ,  H01L23/4985 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13016 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/7515 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3511 ,  H05K3/3478 ,  H05K2201/0367 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/049 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599

Abstract: After preliminary supply of an equal amount of solder to all of stud-bumps of a semiconductor part, establishing solder connection between the stud-bumps and connecting pads of a circuit substrate. A method for mounting a semiconductor part on a circuit substrate is provided, which includes the steps of preparing the semiconductor part (10) having a surface thereof provided with a plurality of stud-bumps (12), preparing a solder substrate (13) having a surface thereof on which solid-solders (14) corresponding to respective of the plurality of stud-bumps (12) are arranged, preparing the circuit substrate (20) having a surface thereof provided with connecting pads (21) corresponding to respective of the plurality of stud-bumps, attaching, to respective tip ends of the plurality of stud bumps, the corresponding solid-solders on the solder substrate, separating the solid-solders attached to the tip ends of the stud-bumps from the solder substrate, contacting the solid-solder attached to respective of the tip ends of the stud-bumps with the corresponding connecting pads, and melting the solid-solders contacted with the corresponding connecting pads thereby establishing solder connection between respective of the stud-bumps and the corresponding connecting pads.