公开(公告)号：EP2104136A4

公开(公告)日：2012-03-07

申请号：EP07850933

申请日：2007-12-19

Applicant: IBM

Inventor： OYAMA YUKIFUMI ,  TORIYAMA KAZUSHIGE ,  NISHIWAKI HIDETOSHI ,  ORII YASUMITSU ,  NISHIO TOSHIHIKO

IPC: H01L21/60

CPC classification number: H01L24/13 ,  B23K1/0016 ,  B23K3/0623 ,  B23K2201/40 ,  H01L23/498 ,  H01L23/49822 ,  H01L23/4985 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13016 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/7515 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3511 ,  H05K3/3478 ,  H05K2201/0367 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/049 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599

Abstract: After preliminary supply of an equal amount of solder to all of stud-bumps of a semiconductor part, establishing solder connection between the stud-bumps and connecting pads of a circuit substrate. A method for mounting a semiconductor part on a circuit substrate is provided, which includes the steps of preparing the semiconductor part (10) having a surface thereof provided with a plurality of stud-bumps (12), preparing a solder substrate (13) having a surface thereof on which solid-solders (14) corresponding to respective of the plurality of stud-bumps (12) are arranged, preparing the circuit substrate (20) having a surface thereof provided with connecting pads (21) corresponding to respective of the plurality of stud-bumps, attaching, to respective tip ends of the plurality of stud bumps, the corresponding solid-solders on the solder substrate, separating the solid-solders attached to the tip ends of the stud-bumps from the solder substrate, contacting the solid-solder attached to respective of the tip ends of the stud-bumps with the corresponding connecting pads, and melting the solid-solders contacted with the corresponding connecting pads thereby establishing solder connection between respective of the stud-bumps and the corresponding connecting pads.

公开(公告)号：JP2008078333A

公开(公告)日：2008-04-03

申请号：JP2006254969

申请日：2006-09-20

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： OYAMA YUKIFUMI ,  ORII YASUMITSU ,  NISHIO TOSHIHIKO

IPC: H01L21/304 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18

CPC classification number: H01L21/6835 ,  H01L24/16 ,  H01L24/48 ,  H01L25/16 ,  H01L2221/68359 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01065 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: PROBLEM TO BE SOLVED: To decrease the thickness of a semiconductor part (chip) on a substrate to a specified value, regardless of variation in thickness of a substrate, in a semiconductor product. SOLUTION: In a semiconductor component installed on a base plate 32, a surface 30 of a semiconductor part 29 on a substrate 28 is set at a specified height h from a surface 33 of the base plate 32. By machining the surface 30 of the semiconductor part 29 that has been adjusted to the specified height h, the thickness of the semiconductor part 29 on the substrate 28 is made to be a specified value without exception. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：在半导体产品中，将基板上的半导体部件（芯片）的厚度减小到规定值，而不管基板厚度的变化。 解决方案：在安装在基板32上的半导体部件中，将基板28上的半导体部件29的表面30从基板32的表面33设定在规定的高度h。通过机械加工表面30 已调整到规定高度h的半导体部件29的厚度使基板28上的半导体部件29的厚度成为规定值。 版权所有（C）2008，JPO＆INPIT