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公开(公告)号:JPH11176750A
公开(公告)日:1999-07-02
申请号:JP26220098
申请日:1998-09-17
Applicant: IBM
Inventor: AFZALI-ARDAKANI ALI , BRUNSVOLD WILLIAM ROSS , GELORME JEFFREY D , KOSBAR LAURA L , NANCY C RABIANKA , PATEL NIRANJAN M , PUSHUKARA RAAO VARAANASHII
IPC: G03F7/038 , G03F7/00 , H01L21/027
Abstract: PROBLEM TO BE SOLVED: To obtain high resolution which enables development by water base, by adding film formation polymer resin with phenol group by a specified formula, glycol uril derivative cross linking agent, radiolysis acid generation agent and organic base. SOLUTION: A photoresist composition comprises film formation polymer resin with phenol group. The phenol resin is copolymer of hydroxystyrene and hydroxycyclohexyl ethene shown by a formula I (n>1, 0
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公开(公告)号:JPH10168329A
公开(公告)日:1998-06-23
申请号:JP16405297
申请日:1997-06-20
Applicant: IBM
Inventor: ANGELOPOULOS MARIE , GELORME JEFFREY D , NEWMAN THOMAS H , PATEL NIRANJAN M , SEEGER DAVID E
IPC: C08G61/12 , C08G61/10 , C08G75/02 , C08G75/04 , C08J3/28 , C08L33/00 , C08L33/02 , C08L41/00 , C08L79/00 , C08L101/00 , C08L101/02 , C08L101/12 , G03F7/038 , G03F7/09 , H01B1/12
Abstract: PROBLEM TO BE SOLVED: To obtain a conductive polymer composition containing a specific polyacid and a specific polymer, capable of being cross-linked, improved in solubility in water, and useful for conductive electron beam resists, photoresists, etc. SOLUTION: This water-soluble conductive polymer composition comprises (A) a polyacid having acid groups selected from carboxyl groups, phosphate groups, phosphate groups, borate groups, sulfate groups and sulfonate groups, such as poly(styrenesulfonic acid), and (B) a polymer selected from the (non) substituted homopolymers or (non)substituted copolymers of aniline, thiophene, pyrrole or p-phenylene sulfide, having one or more conjugated parts constituting conjugated basic atom-containing repeating units. Therein, the number of acidic groups in the polyacid is larger than the number of proton-addable basic atoms in the polymer. An aqueous solution containing the composition in a concentration of 5-10wt.% is preferably prepared and further mixed with an oxidizing agent/a polymerization initiator.
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公开(公告)号:JPH0925167A
公开(公告)日:1997-01-28
申请号:JP33144795
申请日:1995-12-20
Applicant: IBM , CARBORUNDUM CO
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公开(公告)号:DE69313954D1
公开(公告)日:1997-10-23
申请号:DE69313954
申请日:1993-07-30
Applicant: IBM
Inventor: AFZALI ARDAKANI ALI , GOTRO JEFFREY T , HEDRICK JEFFREY C , PAPATHOMAS KONSTANTINOS , PATEL NIRANJAN M , SHAW JANE M , VIEHBECK ALFRED
IPC: B32B27/06 , C08G65/40 , C08G73/06 , C08G75/00 , C08G75/20 , C08G79/02 , C08G79/04 , C08J5/24 , C08L79/04 , C08L101/00 , C08L101/02 , C08L101/04 , H05K1/03
Abstract: A composition having enhanced fracture resistance comprising curable dicyanate ester resins having incorporated therein at least one thermoplastic polymer modifier which is soluble in the dicyanate ester resin. Said thermoplastic polymer undergoes an in-situ phase separation process during cure to form a microphase-separated multiphase thermoset material.
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公开(公告)号:DE69313954T2
公开(公告)日:1998-03-26
申请号:DE69313954
申请日:1993-07-30
Applicant: IBM
Inventor: AFZALI ARDAKANI ALI , GOTRO JEFFREY T , HEDRICK JEFFREY C , PAPATHOMAS KONSTANTINOS , PATEL NIRANJAN M , SHAW JANE M , VIEHBECK ALFRED
IPC: B32B27/06 , C08G65/40 , C08G73/06 , C08G75/00 , C08G75/20 , C08G79/02 , C08G79/04 , C08J5/24 , C08L79/04 , C08L101/00 , C08L101/02 , C08L101/04 , H05K1/03
Abstract: A composition having enhanced fracture resistance comprising curable dicyanate ester resins having incorporated therein at least one thermoplastic polymer modifier which is soluble in the dicyanate ester resin. Said thermoplastic polymer undergoes an in-situ phase separation process during cure to form a microphase-separated multiphase thermoset material.
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公开(公告)号:SG34299A1
公开(公告)日:1996-12-06
申请号:SG1995001804
申请日:1995-11-10
Applicant: IBM , CARBORUNDUM CO
Inventor: CASEY JON A , CORDERO CARLA N , FASANO BENJAMIN V , GOLAND DAVID B , HANNON ROBERT , HARRIS JONATHAN H , HERRON LESTER W , JOHNSON GREGORY M , PATEL NIRANJAN M , REITTER ANDREW M , SHINDE SUBHASH L , VALLABHANENI RAO V , YOUNGMAN ROBERT A
IPC: B22F7/02 , B32B18/00 , C04B35/581 , C04B37/02 , C04B41/51 , C04B41/52 , C04B41/88 , C04B41/89 , C22C29/16 , H01L21/48 , H01L23/373 , H05K1/03 , H05K3/24 , H05K3/40 , H05K3/46
Abstract: Disclosed is an aluminum nitride body having graded metallurgy and a method for making such a body. The aluminum nitride body has at least one via and includes a first layer in direct contact with the aluminum nitride body and a second layer in direct contact with, and that completely encapsulates, the first layer. The first layer includes 30 to 60 volume percent aluminum nitride and 40 to 70 volume percent tungsten and/or molybdenum while the second layer includes 90 to 100 volume percent of tungsten and/or molybdenum and 0 to 10 volume percent of aluminum nitride.
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