Abstract:
PROBLEM TO BE SOLVED: To provide a lithographic photoresist composition usable as a chemically amplifier photoresist. SOLUTION: The composition is substantially transparent to deep UV, that is, radiation of
Abstract:
PROBLEM TO BE SOLVED: To provide a polymerizable monomer which has an ethylenically unsaturated group and silicon-containing groups transparent at 193 nm. SOLUTION: This polymerizable monomer has a polymerizable ethylenically unsaturated group and a plurality of silicon-containing groups separated from each other by groups X having no reactivity and transparent at 193 nm. A polymer obtained from the monomer can be used in the process for forming an image of 100 nm or lower by using a chemically amplified radiation-sensitive bilayer resist. The bilayer resist is arranged on a substrate and comprises (1) an upper image formation layer containing a radiation-sensitive acid-generating agent and (2) an organic lower layer. This bilayer resist can be used for producing integrated circuits.
Abstract:
PROBLEM TO BE SOLVED: To obtain a polymerizable monomer having Si-containing groups, transparent at 193 nm and ethylenically unsaturated group. SOLUTION: The polymerizable monomer has the Si-containing groups separated each other by a group X transparent at 193 nm and having no reactivity and has the ethylenically unsaturated group. Polymers obtained from the monomer can be used in processes for forming sub-100 nm images by using a chemically amplified, radiation sensitive bilayer resist. The bilayer resist is disposed on a substrate and comprises (i) a top imaging layer comprising a radiation sensitive acid generator and (ii) an organic underlayer. The bilayer resist can be used in the production of integrated circuits. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a photoresist composition capable of ensuring suitability to high resolution lithography using imaging radiation of 193 nm and to provide a lithographic process using the photoresist composition. SOLUTION: An acid catalyzed positive photoresist composition is provided by using a resist composition containing a cycloolefin polymer with a cydoolefin monomer having a lactone moiety. The photoresist can be imaged with radiation of 193 nm and is developed to form a photoresist structure with improved development characteristics and improved etching resistance. The monomer has no oxygen atom between the lactone moiety and a cycloolefin ring. The lactone moiety is appropriately spirolactone (5- or 6-membered ring) which bonds directly to the cycloolefin ring.
Abstract:
PROBLEM TO BE SOLVED: To provide a photoresist composition having so improved resolution as to enable high resolution lithography performance using imaging radiation of 193 nm. SOLUTION: The photoresist composition is obtained by using an imaging copolymer so as to improve a known alternating copolymer-base photoresist. The imaging copolymer is characterized by the presence of at least a third monomer which enhances the resolution of the photoresist. The performance of the composition is further improved by using a bulky acid active protective group on the imaging copolymer. An alkyl functional cyclicolefin is particularly suitable for use as the third monomer.