公开(公告)号：WO2009092677A2

公开(公告)日：2009-07-30

申请号：PCT/EP2009050524

申请日：2009-01-19

Applicant: IBM ,  IBM UK ,  KACKER KARAN ,  POWELL DOUGLAS OLIVER ,  QUESTAD DAVID ,  RUSSELL DAVID JOHN ,  SRI-JAYANTHA SRI

Inventor： KACKER KARAN ,  POWELL DOUGLAS OLIVER ,  QUESTAD DAVID ,  RUSSELL DAVID JOHN ,  SRI-JAYANTHA SRI

IPC: H01L23/498

CPC classification number: H01L23/49827 ,  H01L23/49838 ,  H01L2224/05001 ,  H01L2224/05548 ,  H01L2224/05572 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K1/116 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/09454 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/0969 ,  Y10T29/49155 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: A stacked via structure for reducing vertical stiffness includes: a plurality of stacked vias, each via disposed on a disc-like structure. The disc-like structure includes a plated through hole landing supporting the plurality of stacked vias. The plated through hole landing includes a compliant center zone; and spring-like stiffness-reducing connectors for connecting the compliant center zone of the plated through hole landing.

Abstract translation: 用于减小垂直刚度的堆叠通孔结构包括：多个堆叠的通孔，每个通孔设置在盘状结构上。 盘状结构包括支撑多个堆叠通孔的电镀通孔着落。 电镀通孔着色包括顺应中心区; 以及用于连接电镀通孔底板的顺应中心区域的弹簧状刚度减小连接器。

公开(公告)号：AT521989T

公开(公告)日：2011-09-15

申请号：AT09731078

申请日：2009-01-20

Applicant: IBM

Inventor： SRI-JAYANTHA SRI ,  RUSSELL DAVID ,  KACKER KARAN C ,  QUESTAD DAVID ,  POWELL DOUGLAS

IPC: H01L23/498

Abstract: A substrate via structure for stacked vias includes: a plurality of stacked vias, wherein each via is disposed on a landing; and at least one constrainer disc surrounding at least one via, for constraining in-plane deformation of the substrate via structure. The constrainer disc is embedded such that the constrainer disc is disposed between two layers of resin. The constrainer discs may be made of copper. The constrainer disc may be circular or square-shaped. Preferably there is a dielectric gap between the constrainer disc and the via.