公开(公告)号：JP2002094328A

公开(公告)日：2002-03-29

申请号：JP2001180600

申请日：2001-06-14

Applicant: IBM

Inventor： CHAN KEVIN K ,  JHANES CHRISTOPHER ,  SHI LEATHEN ,  SPEIDELL JAMES L ,  ZIEGLER JAMES F

IPC: B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  H03D7/00 ,  H03H3/007 ,  H03H9/10 ,  H03H9/24 ,  H03H9/46 ,  H04B1/26

Abstract: PROBLEM TO BE SOLVED: To provide a communication signal mixing/filtering system that employs a capsulated microelectric mechanical system(MEMS) device, and to provide its manufacturing method. SOLUTION: The microelectric mechanical system(MEMS) of a simple single structure combines a signal mixing step and a filtering step. The MEMS device is further reduced in size and made less expensive, and has higher reliability in its structure and operation as compared with those of the existing device adopting the conventional technology.

公开(公告)号：JP2007294959A

公开(公告)日：2007-11-08

申请号：JP2007105961

申请日：2007-04-13

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： STEVEN ALAN CORDES ,  SPEIDELL JAMES L ,  GRUBER PETER ALFRED ,  KNICKERBOCKER JOHN U

IPC: H01L21/60 ,  B23K3/06

CPC classification number: B23K3/0638 ,  B23K35/02 ,  B23K2201/40 ,  H01L2224/11

Abstract: PROBLEM TO BE SOLVED: To provide a system and a method for injection molding of conductive bonding material to a plurality of cavities of a non-rectangular mold. SOLUTION: This method includes aligning a filling head with the non-rectangular mold. The non-rectangular mold includes a plurality of cavities. The filling head is arranged so as to substantially contact the non-rectangular mold. Rotational motion is given to at least any one of the non-rectangular mode and the filling head in a state where the filling head substantially contacts the non-rectangular mold. The conductive bonding material is forced out of the fill head toward the non-rectangular mold. The conductive bonding material is provided to at least any one of the plurality of cavities simultaneously with the approximation of at least the one cavity to the filling head. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供一种用于将导电接合材料注射成型到非矩形模具的多个空腔的系统和方法。

解决方案：该方法包括将填充头与非矩形模具对准。 非矩形模具包括多个空腔。 填充头被布置成基本接触非矩形模具。 在填充头基本上接触非矩形模具的状态下，对非矩形模式和填充头中的至少任何一个进行旋转运动。 导电接合材料被迫从非矩形模具中排出填料头。 导电接合材料被提供到多个空腔中的至少任一个同时与至少一个空腔近似到填充头。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2007294954A

公开(公告)日：2007-11-08

申请号：JP2007104611

申请日：2007-04-12

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： STEVEN ALAN CORDES ,  SPEIDELL JAMES L ,  GRUBER PETER ALFRED ,  KNICKERBOCKER JOHN U

IPC: H05K3/34 ,  H05K3/10

CPC classification number: H05K3/3484 ,  B23K3/0607 ,  B23K2201/42 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/09472 ,  H05K2203/0126 ,  H05K2203/043 ,  H05K2203/0568

Abstract: PROBLEM TO BE SOLVED: To provide a system and a method for feeding conductive bonding material into a plurality of cavities in a circuit support substrate.
SOLUTION: The system, the method and a device for feeding the conductive bonding material into the plurality of cavities in the circuit support substrate are disclosed. The method includes a step for setting up a filling head in a state that it contacts the circuit support substrate substantially. The circuit support substrate includes at least one cavity. While the filling head contacts the circuit support substrate substantially, straight-line motion or rotational movement is imparted to at least one of the circuit support substrate and the filling head. The conductive bonding material is extruded toward the circuit support substrate from the filling head. At the same time at least one cavity comes very close to the filling head, the conductive bonding material is fed into at least the one cavity.
COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供一种用于将导电接合材料馈送到电路支撑衬底中的多个空腔中的系统和方法。 公开了用于将导电接合材料馈送到电路支撑衬底中的多个空腔中的系统，方法和装置。 该方法包括基本上与电路支撑基板接触的状态下设置充填头的步骤。 电路支撑基板包括至少一个空腔。 当填充头基本上接触电路支撑衬底时，直线运动或旋转运动被赋予电路支撑衬底和填充头中的至少一个。 导电接合材料从填充头朝向电路支撑基板挤出。 同时，至少一个空腔非常靠近填充头，导电粘合材料被送入至少一个空腔。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2007294952A

公开(公告)日：2007-11-08

申请号：JP2007104499

申请日：2007-04-12

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： STEVEN ALAN CORDES ,  KNICKERBOCKER JOHN U ,  SPEIDELL JAMES L ,  GRUBER PETER ALFRED

IPC: H01L21/60

CPC classification number: B23K3/0638 ,  B23K1/20 ,  B23K2201/40 ,  H01L24/11 ,  H01L24/742 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a system, a method, and an apparatus for injection molding of a conductive boding material to a plurality of cavities on surface. SOLUTION: This method includes a step of aligning a filling head with the surface. A mold includes the plurality of cavities. This method further includes allowing the fill head to substantially contact the surface and arranging it. At least a first gas is flown through a channel about a first region of the filling head. At least the first gas has a temperature higher than a melting point of the conductive bonding material in a reservoir, thereby maintaining the conductive bonding material in a molten state. The conductive bonding material is forced from the fill head toward the surface. The conductive bonding material is provided to at least any one of the plurality of cavities simultaneously while the at least one cavity approximates to the filling head. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供一种用于将导电编码材料注射成型到表面上的多个空腔的系统，方法和装置。 解决方案：该方法包括将填充头与表面对齐的步骤。 模具包括多个空腔。 该方法还包括允许填充头基本上接触表面并进行排列。 至少第一气体围绕填充头的第一区域流过通道。 至少第一气体的温度高于储存器中的导电接合材料的熔点，从而保持导电接合材料处于熔融状态。 导电接合材料从填充头朝向表面被迫动。 导电接合材料同时被提供到多个空腔中的至少任一个，同时至少一个空腔近似于填充头。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：BR0101001A

公开(公告)日：2002-02-13

申请号：BR0101001

申请日：2001-03-16

Applicant: IBM

Inventor： CHAN KEVIN K ,  JHANES CHRISTOPHER ,  SHI LEATHEN ,  SPEIDELL JAMES L ,  ZIEGLER JAMES F

IPC: B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  H03D7/00 ,  H03H3/007 ,  H03H9/10 ,  H03H9/24 ,  H03H9/46 ,  H04B1/26

Abstract: Communication signal mixing and filtering systems and methods utilizing an encapsulated micro electro-mechanical system (MEMS) device. Furthermore, disclosed is a method of fabricating a simple, unitarily constructed micro electro-mechanical system (MEMS) device which combines the steps of signal mixing and filtering, and which is smaller, less expensive and more reliable in construction and operation than existing devices currently employed in the technology.

公开(公告)号：CA2344737C

公开(公告)日：2005-07-19

申请号：CA2344737

申请日：2001-04-20

Applicant: IBM

Inventor： SHI LEATHEN ,  JAHNES CHRISTOPHER ,  SPEIDELL JAMES L ,  ZIEGLER JAMES F ,  CHAN KEVIN K

IPC: B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  H03D7/00 ,  H03H3/007 ,  H03H9/10 ,  H03H9/24 ,  H03H9/46 ,  H04B1/26 ,  H03H11/34 ,  H03H9/02

Abstract: Communication signal mixing and filtering systems and methods utilizing an encapsulated micro electro- mechanical system (MEMS) device. Furthermore, disclosed is a method of fabricating a simple, unitarily constructed micro electro-mechanical system (MEMS) devic e which combines the steps of signal mixing and filtering, and which is smaller, less expensi ve and more reliable in construction and operation than existing devices currently employed in the technology.

公开(公告)号：BR0101001B1

公开(公告)日：2014-11-25

申请号：BR0101001

申请日：2001-03-16

Applicant: IBM

Inventor： CHAN KEVIN K ,  JHANES CHRISTOPHER ,  SHI LEATHEN ,  SPEIDELL JAMES L ,  ZIEGLER JAMES F

IPC: H04B1/26 ,  B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  H03D7/00 ,  H03H3/007 ,  H03H9/10 ,  H03H9/24 ,  H03H9/46

Abstract: Communication signal mixing and filtering systems and methods utilizing an encapsulated micro electro-mechanical system (MEMS) device. Furthermore, disclosed is a method of fabricating a simple, unitarily constructed micro electro-mechanical system (MEMS) device which combines the steps of signal mixing and filtering, and which is smaller, less expensive and more reliable in construction and operation than existing devices currently employed in the technology.

公开(公告)号：HK1041678A1

公开(公告)日：2002-07-19

申请号：HK02103371

申请日：2002-05-03

Applicant: IBM

Inventor： CHAN KEVIN K ,  JHANES CHRISTOPHER ,  SHI LEATHEN ,  SPEIDELL JAMES L ,  ZIEGLER JAMES F

IPC: B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  H03D7/00 ,  H03H3/007 ,  H03H9/10 ,  H03H9/24 ,  H03H9/46 ,  H04B1/26 ,  B81B ,  H01P

Abstract: Communication signal mixing and filtering systems and methods utilizing an encapsulated micro electro-mechanical system (MEMS) device. Furthermore, disclosed is a method of fabricating a simple, unitarily constructed micro electro-mechanical system (MEMS) device which combines the steps of signal mixing and filtering, and which is smaller, less expensive and more reliable in construction and operation than existing devices currently employed in the technology.

公开(公告)号：CA2344737A1

公开(公告)日：2001-12-19

申请号：CA2344737

申请日：2001-04-20

Applicant: IBM

Inventor： SPEIDELL JAMES L ,  ZIEGLER JAMES F ,  CHAN KEVIN K ,  SHI LEATHEN ,  JAHNES CHRISTOPHER

IPC: B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  H03D7/00 ,  H03H3/007 ,  H03H9/10 ,  H03H9/24 ,  H03H9/46 ,  H04B1/26 ,  H03H11/34 ,  H03H9/02

Abstract: Communication signal mixing and filtering systems and methods utilizing an encapsulated micro electro- mechanical system (MEMS) device. Furthermore, disclosed is a method of fabricating a simple, unitarily constructed micro electro-mechanical system (MEMS) devic e which combines the steps of signal mixing and filtering, and which is smaller, less expensi ve and more reliable in construction and operation than existing devices currently employed in the technology.