公开(公告)号：JP2002216606A

公开(公告)日：2002-08-02

申请号：JP2001355091

申请日：2001-11-20

Applicant: IBM

Inventor： PETRARCA KEVIN ,  ROBERT A GROVES ,  HERBST BRIAN ,  JAHNES CHRISTOPHER ,  VOLANT RICHARD

IPC: B81B3/00 ,  H01H59/00

Abstract: PROBLEM TO BE SOLVED: To provide a new micromini electromechanical(MEM) switch. SOLUTION: This MEM switch contains a guide post formed on a substrate. A signal transmission line having a gap to form an open-circuit is produced on the substrate. The switch also contains a switch body internally-provided with a via opening, which is movably-located along the length demarcated by the guide post. The guide post is partially enclosed with the via opening.

公开(公告)号：JP2001284454A

公开(公告)日：2001-10-12

申请号：JP2001047144

申请日：2001-02-22

Applicant: IBM

Inventor： DAVIS CHARLES R ,  EDELSTEIN DANIEL CHARLES ,  HAY JOHN C ,  HEDRICK JEFFREY C ,  JAHNES CHRISTOPHER ,  MC GAHAY VINCENT ,  NYE HENRY A

IPC: H01L21/768 ,  H01L21/3205 ,  H01L23/52 ,  H01L23/522 ,  H01L23/532

Abstract: PROBLEM TO BE SOLVED: To improve a rigidity of a backend-of-line structure. SOLUTION: The damascene structure of interconnecting multi-level coppers on an integrated circuit chip includes several line conductors which are on the integrated circuit and are separated by dielectric materials having quite low dielectric constant and high elastic modulus. A second flat interconnection layer 18 on the first flat interconnection layer 14, consists of a dielectric film 26 having a higher elastic modulus than that of a dielectric material in the first flat interconnection layer 14, and an electrical conduction via 28 passing through the dielectric film 26. Electrical conduction vias 28 contact line conductors 22 selectively. A third flat interconnection layer 20 on the second flat interconnection layer 18, has several line conductors 22 which are isolated by dielectric materials and contact electrical conduction vias selectively.

公开(公告)号：JP2001284453A

公开(公告)日：2001-10-12

申请号：JP2001033861

申请日：2001-02-09

Applicant: IBM

Inventor： JUDETH M RUBINO ,  JAHNES CHRISTOPHER ,  LINIGER ERIC G ,  RYAN JAMES G ,  CARLOS J SANBUSETEI ,  CARDONE FRANK ,  PURUSHOTHAMAN SAMPATH ,  PHIZHIMONS JOHN A ,  STEVEN M GATES

IPC: C22F1/10 ,  C22C19/00 ,  C22F1/00 ,  H01L21/28 ,  H01L21/31 ,  H01L21/314 ,  H01L21/316 ,  H01L21/3205 ,  H01L21/324 ,  H01L21/76 ,  H01L21/768 ,  H01L23/52 ,  H01L23/522 ,  H01L23/532

Abstract: PROBLEM TO BE SOLVED: To provide a method for forming a low dielectric barrier with a superior diffusion characteristic for copper and adhesion, on a copper conductor. SOLUTION: A method comprises; 1) preparing a substrate having a copper conductor, 2) putting a metal alloy film including phosphor or boron as a protective layer, on the copper conductor, 3) carrying out the first annealing process to diffuse a metal alloy including phosphor or boron into 2-4 atom layers at least, on the top of the copper conductor, then 4) putting a dielectric film with low dielectric constant on the metal alloy film including phosphor or boron, and 5) carrying out the second annealing process. The obtained structure has a double layer barrier which includes the metal alloy film including phosphor or boron on the copper conductor and the dielectric material film on the metal alloy film, and shows superior barrier and adhesive characteristics for the copper conductor.

公开(公告)号：AT388480T

公开(公告)日：2008-03-15

申请号：AT02768707

申请日：2002-08-26

Applicant: IBM

Inventor： JAHNES CHRISTOPHER ,  LUND JENNIFER ,  SAENGER KATHERINE ,  VOLANT RICHARD

IPC: B81B3/00 ,  H01H57/00 ,  B81C1/00 ,  G02B5/00 ,  G02B26/00 ,  G02B26/08 ,  H01H59/00

Abstract: A micro-electromechanical (MEM) RF switch provided with a deflectable membrane ( 60 ) activates a switch contact or plunger ( 40 ). The membrane incorporates interdigitated metal electrodes ( 70 ) which cause a stress gradient in the membrane when activated by way of a DC electric field. The stress gradient results in a predictable bending or displacement of the membrane ( 60 ), and is used to mechanically displace the switch contact ( 30 ). An RF gap area ( 25 ) located within the cavity ( 250 ) is totally segregated from the gaps ( 71 ) between the interdigitated metal electrodes ( 70 ). The membrane is electrostatically displaced in two opposing directions, thereby aiding to activate and deactivate the switch. The micro-electromechanical switch includes: a cavity ( 250 ); at least one conductive path ( 20 ) integral to a first surface bordering the cavity; a flexible membrane ( 60 ) parallel to the first surface bordering the cavity ( 250 ), the flexible membrane ( 60 ) having a plurality of actuating electrodes ( 70 ); and a plunger ( 40 ) attached to the flexible membrane ( 60 ) in a direction away from the actuating electrodes ( 70 ), the plunger ( 40 ) having a conductive surface that makes electric contact with the conductive paths, opening and closing the switch.

公开(公告)号：CA2344737A1

公开(公告)日：2001-12-19

申请号：CA2344737

申请日：2001-04-20

Applicant: IBM

Inventor： SPEIDELL JAMES L ,  ZIEGLER JAMES F ,  CHAN KEVIN K ,  SHI LEATHEN ,  JAHNES CHRISTOPHER

IPC: B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  H03D7/00 ,  H03H3/007 ,  H03H9/10 ,  H03H9/24 ,  H03H9/46 ,  H04B1/26 ,  H03H11/34 ,  H03H9/02

Abstract: Communication signal mixing and filtering systems and methods utilizing an encapsulated micro electro- mechanical system (MEMS) device. Furthermore, disclosed is a method of fabricating a simple, unitarily constructed micro electro-mechanical system (MEMS) devic e which combines the steps of signal mixing and filtering, and which is smaller, less expensi ve and more reliable in construction and operation than existing devices currently employed in the technology.

公开(公告)号：DE10106161A1

公开(公告)日：2001-09-13

申请号：DE10106161

申请日：2001-02-10

Applicant: IBM

Inventor： DAVIS CHARLES R ,  EDELSTEIN DANIEL CHARLES ,  HAY JOHN C ,  HEDRICK JEFFREY C ,  JAHNES CHRISTOPHER ,  MC GAHAY VINCENT ,  NYE HENRY

IPC: H01L21/768 ,  H01L21/3205 ,  H01L23/52 ,  H01L23/522 ,  H01L23/532

Abstract: Planar layer for conductors, includes numerous connecting lines separated from each other by dielectric. This has relatively low: dielectric constant and modulus of elasticity. A planar, perforated dielectric film layer included, has a higher modulus of elasticity. One of the conductor- and the perforated layers, is located on an integrated circuit substrate, defining a first layer. The other conductor- and perforated layer is located on the first, such that perforations make selective contact with conductors of the conductor layer.

公开(公告)号：AT368934T

公开(公告)日：2007-08-15

申请号：AT01126761

申请日：2001-11-09

Applicant: IBM

Inventor： GROVES ROBERT A ,  HERBST BRIAN ,  JAHNES CHRISTOPHER ,  PETRARCA KEVIN ,  VOLANT RICHARD

IPC: B81B3/00 ,  H01H59/00

Abstract: A micro electromechanical switch has a guidepost formed upon a substrate. A signal transmission line is formed on the substrate, with the signal transmission line having a gap and forming an open circuit. The switch further includes a switch body having a via opening formed therein, with the switch body being movably disposed along an length defined by the guide post. The guidepost is partially surrounded by the via opening.

公开(公告)号：CA2344737C

公开(公告)日：2005-07-19

申请号：CA2344737

申请日：2001-04-20

Applicant: IBM

Inventor： SHI LEATHEN ,  JAHNES CHRISTOPHER ,  SPEIDELL JAMES L ,  ZIEGLER JAMES F ,  CHAN KEVIN K

IPC: B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  H03D7/00 ,  H03H3/007 ,  H03H9/10 ,  H03H9/24 ,  H03H9/46 ,  H04B1/26 ,  H03H11/34 ,  H03H9/02

Abstract: Communication signal mixing and filtering systems and methods utilizing an encapsulated micro electro- mechanical system (MEMS) device. Furthermore, disclosed is a method of fabricating a simple, unitarily constructed micro electro-mechanical system (MEMS) devic e which combines the steps of signal mixing and filtering, and which is smaller, less expensi ve and more reliable in construction and operation than existing devices currently employed in the technology.

公开(公告)号：DE60129657T2

公开(公告)日：2008-05-21

申请号：DE60129657

申请日：2001-11-09

Applicant: IBM

Inventor： GROVES ROBERT A ,  HERBST BRIAN ,  JAHNES CHRISTOPHER ,  PETRARCA KEVIN ,  VOLANT RICHARD

IPC: B81B3/00 ,  H01H59/00

Abstract: A micro electromechanical switch has a guidepost formed upon a substrate. A signal transmission line is formed on the substrate, with the signal transmission line having a gap and forming an open circuit. The switch further includes a switch body having a via opening formed therein, with the switch body being movably disposed along an length defined by the guide post. The guidepost is partially surrounded by the via opening.

公开(公告)号：DE60129657D1

公开(公告)日：2007-09-13

申请号：DE60129657

申请日：2001-11-09

Applicant: IBM

Inventor： GROVES ROBERT A ,  HERBST BRIAN ,  JAHNES CHRISTOPHER ,  PETRARCA KEVIN ,  VOLANT RICHARD

IPC: B81B3/00 ,  H01H59/00

Abstract: A micro electromechanical switch has a guidepost formed upon a substrate. A signal transmission line is formed on the substrate, with the signal transmission line having a gap and forming an open circuit. The switch further includes a switch body having a via opening formed therein, with the switch body being movably disposed along an length defined by the guide post. The guidepost is partially surrounded by the via opening.