RADIATION-SENSITIVE RESIN COMPOSITION
    1.
    发明专利

    公开(公告)号:JP2004012551A

    公开(公告)日:2004-01-15

    申请号:JP2002162110

    申请日:2002-06-03

    Applicant: JSR CORP IBM

    Abstract: PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition having high transparency to a radiation, excellent in basic properties as a resist, such as sensitivity, resolution, dry etching resistance and pattern shape and suitable for use as a chemically amplified resist. SOLUTION: The radiation-sensitive resin composition comprises (A) a resin which contains a repeating unit derived from α-perfluoroalkylacrylic esters typified by t-butyl α-trifluoromethylacrylate and a repeating unit derived from a norbornene compound typified by 5-ä2-hydroxy-2, 2-di(trifluoromethyl)ethyl}bicyclo[2.2.1]hept-2-ene or a compound of formula 7 as essential units and becomes alkali-soluble by the action of an acid and (B) a radiation-sensitive acid generator. COPYRIGHT: (C)2004,JPO

    RADIATION-SENSITIVE RESIN COMPOSITION
    3.
    发明专利

    公开(公告)号:JP2003255539A

    公开(公告)日:2003-09-10

    申请号:JP2002056522

    申请日:2002-03-01

    Applicant: JSR CORP IBM

    Abstract: PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition having high transparency to a radiation and suitable for use as a chemically amplified resist excellent in basic performances as a resist, such as sensitivity, resolution, dry etching resistance and pattern shape. SOLUTION: The radiation-sensitive resin composition comprises (A) an alkali-insoluble or slightly alkali-soluble resin which has a repeating unit represented by formula (1-1) (where R 1 is H or methyl) and a (meth)acrylic repeating unit typified by 2-ethyl-2-adamantyl (meth)acrylate, 2-norbornyl-2-(meth) acryloyloxypropane or 1-methylcyclopentyl (meth)acrylate as essential units and becomes alkali-soluble under the action of an acid and (B) a radiation- sensitive acid generator. COPYRIGHT: (C)2003,JPO

    RADIATION-SENSITIVE RESIN COMPOSITION
    4.
    发明专利

    公开(公告)号:JP2003248313A

    公开(公告)日:2003-09-05

    申请号:JP2002046974

    申请日:2002-02-22

    Applicant: JSR CORP IBM

    Abstract: PROBLEM TO BE SOLVED: To provide a new radiation-sensitive resin composition having high transparency to a radiation, excellent in basic physical properties as a resist, such as sensitivity, resolution, pattern shape and adhesion to a substrate, causing no development defect in microfabrication and capable of producing semiconductor devices in a high yield. SOLUTION: The radiation-sensitive resin composition comprises (A) an acid-dissociable group-containing resin having a repeating unit represented by formula (I) and a repeating unit represented by formula (II) and (B) a radiation-sensitive acid generator. In the formula (I), X is methylene or carbonyl; R 1 and R 2 are each H, a 1-4C alkyl, a monovalent O-containing polar group or a monovalent N-containing polar group; R 3 is H, a 1-6C alkyl, a 1-6C alkoxyl or a 2-7C alkoxycarbonyl; and n is an integer of 0-2. COPYRIGHT: (C)2003,JPO

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