公开(公告)号：JPH0661606A

公开(公告)日：1994-03-04

申请号：JP11746793

申请日：1993-05-19

Applicant: IBM

Inventor： TOMASU MARIO SAIPOORA ,  POORU UIRIAMU KOTEUSU ,  IOANISU DAMIANAKISU ,  GUREN UORUDEN JIYONSON ,  PIITAA JIERARUDO REDAAMAN ,  RINDA KARORIN MASHIYUU ,  ROORENSU SHIYANGUUEI MOTSUKU

IPC: H01L25/18 ,  H01L25/065 ,  H01L25/07 ,  H05K1/14 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40

Abstract: PURPOSE: To form a cubic structure by laminating integrated circuit chips to make a three-dimensional packaging. CONSTITUTION: A first substrate 14 to which a chip 11 is mounted has conductors, one end of each conductor is electrically connected to a chip contact 206 and the other end forms pin-like electric connection mounts 444. The pin-like structure may be formed by a protrusion of the first substrate 14 having the conductors extending to the surface, or otherwise formed as a structure having parts extending like a cantilever from both faces of the end of the first substrate and solder charged in the space therebetween. The pin-like structure may be soldered directly to the conductors on the surface of a second substrate 21 or inserted and coupled in a hole of this substrate.

公开(公告)号：JPH04277639A

公开(公告)日：1992-10-02

申请号：JP28980791

申请日：1991-11-06

Applicant: IBM

Inventor： TOOMASU MARIO SHIPORA ,  POORU UIRIAMU KOTEUSU ,  ROBAATO HENRII KATEIRU ,  ROBAATO JIYOSEFU KERUHAA ,  POORU ANDORIYUU MOSUKOUITSUTSU

IPC: H01L21/60 ,  H01L23/485

Abstract: PURPOSE: To provide a mount structure which connects conductors fitted to a carrier at difference height positions to contact places on a flat substrate. CONSTITUTION: On a surface 1 of the substrate, connection parts 5, 6, and 7 in a swelled shape are formed and made tall enough to reach the height position of individual conductors 15, 17, and 19 to which their connection parts fitted to the carrier 11 are bonded. In the extension plane of the conductors, the conductor and connection parts are bonded. To form the connection part in the swelled shape, sticking bodies of solder are stuck and formed on a pad formed on the surface of the substrate and the connection parts are made spherical by surface tension by performing a reflow process for the sticking bodies. The heights of the connection parts after the reflow process can be controlled by the area of the pad and the volumetric amount of the solder which is stuck and formed.

公开(公告)号：JPH06224362A

公开(公告)日：1994-08-12

申请号：JP24662493

申请日：1993-10-01

Applicant: IBM

Inventor： TOMASU MARIO SAIPOORA ,  POORU UIRIAMU KOTEUSU

IPC: H01L21/60 ,  H01L23/495 ,  H01L23/50 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18

Abstract: PURPOSE: To provide a new and improved electronic element packaging constitution for packaging an integrated circuit chip and a conductive coated dielectric substrate or the like. CONSTITUTION: An electronic element 30 is provided with a contact at one side edge. A lead frame 32 is provided with a lead 36 extended under an electronic element, and a lead 10 extends from the outside to the inside. A wire wire-bonds an electronic element contact 44 and lead terminals 12 and 40. Two electronic elements are laminated so as to be shifted from each other, and the contact is exposed on the surface at one side edge of each electronic element, so that a stepwise surface on which the plural electronic element contacts are exposed can be formed. The several leads of the lead frame in a multiple density memory are continuously extended under the layered product, and a signal is inputted through a bit, address, control, power source, and ground input to the electronic element. These inputs are common between the adjacent chips. The wire connects the contact on each chip with a common lead.

公开(公告)号：JPH05211281A

公开(公告)日：1993-08-20

申请号：JP18924292

申请日：1992-07-16

Applicant: IBM

Inventor： POORU UIRIAMU KOTEUSU ,  POORU ANDORIYUU MOSUKOUITSUTSU ,  FUIRITSUPU MAFUII ,  MAAKU BII RITSUTAA ,  JIYOOJI FUREDERITSUKU UOOKAA

IPC: H01L25/18 ,  H01L25/065 ,  H01L25/07 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K7/20

Abstract: PURPOSE: To provide an electronic device package which can stack electronic devices with high density, can secure electrical interconnection of the electronic devices and can have superior heat radiation effect. CONSTITUTION: A plurality of electronic devices 40 are arranged in a stacked manner, and each has a contact position 24 close to one end of each device. The electronic devices are arranged as in steps, so that the lower contact positions of the devices are exposed and are arranged along contact positions 46 on a substrate as opposite thereto, whereby the devices are electrically connected with the substrate. Thereby a large number of electronic devices of the step-like structure can be packaged with a high density and can easily radiate heat, generated in the electronic devices when combined with a heat radiating means 50.

公开(公告)号：JPH09232940A

公开(公告)日：1997-09-05

申请号：JP1539897

申请日：1997-01-29

Applicant: IBM

Inventor： HARII RANDOORU BITSUKUFUOODO ,  CHIN AN CHIYAN ,  POORU UIRIAMU KOTEUSU ,  ROBAATO HIISU DENAADO ,  DANIERU MAAKU DOREPUSU ,  JIRAADO BUINSENTO KOPUCHIYAI

IPC: H01L21/8238 ,  G11C11/407 ,  H01L27/092 ,  H03K19/00 ,  H03K19/0185

Abstract: PROBLEM TO BE SOLVED: To arrange plural electronic devices using a set such as a bus in common by connecting chips whose internal voltage is the same or different altogether on a common bus. SOLUTION: Chips 101, 102, 103 send/receive data by using an external voltage OVDD. The external voltage or a communication voltage OVDD is equal to a minimum voltage of internal voltages of all chips on a common bus. In this case, the internal voltage of the chip 103 is equal to the external voltage. Control signals VM1, VM2 are sent through nets 104, 105 altogether as buses. Furthermore, a driver is made up of a logic element connecting to an output device and a pre-drive circuit. The driver is active in the high output impedance mode or the low output impedance mode.

公开(公告)号：JPH0637418A

公开(公告)日：1994-02-10

申请号：JP12268893

申请日：1993-05-25

Applicant: IBM

Inventor： TOMASU MARIO SAIPOORA ,  POORU UIRIAMU KOTEUSU

IPC: H01R12/50 ,  H01R12/52 ,  H01R12/88 ,  H05K1/14 ,  H05K3/36 ,  H05K7/14

Abstract: PURPOSE: To allow changing of contact interval on a card and that in a socket by placing an intermediate card comprising a contact along one end and a contact of different interval at one end, between a socket and one or more cards. CONSTITUTION: An intermediate card 1 is positioned between a standard card on which a part and a circuit are placed and an external wiring including a socket 3. The socket 3 is connected to a wiring board 4. On both surfaces 6 and 7 of one card 2 a part 5 is placed, while a printed wiring connects, arrayed at the end of the card 2. A conductor 8 from the part 5 passes a card through the contacts arrayed tightly along an end 9, while the array of contacts connect to the corresponding one on the intermediate card 1. On surfaces 12 and 13 of the intermediate card 1, a spatial margin is provided with a part and a circuit 11, so that an interval between contacts can be changed.