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公开(公告)号:DE2860511D1
公开(公告)日:1981-04-02
申请号:DE2860511
申请日:1978-12-22
Applicant: IBM
Inventor: DAVIS DONALD EUGENE , WEBER EDWARD VICTOR , WILLIAMS MAURICE CARMEN , WOODARD OLLIE CLIFTON
IPC: G01B15/00 , H01J37/304 , H01L21/027 , H01L21/302 , H01J37/30 , H01L21/66
Abstract: A method and apparatus is described for performing automatic overlay measurements on wafers utilized in semiconductor manufacturing. The overlay measurements are made at selected sites on a given wafer where a single bar pattern has been overlaid over a double bar pattern. The position of the single bar center line with respect to the center line between the double bars is a direct indication of the overlay error of the two patterns. The overlay error is measured in both the X and Y dimensions and is utilized to monitor the overlay error or to produce statistics and correlations to system parameters so that the sources of overlay errors may be identified and the errors eliminated or minimized on subsequent wafers being processed.
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公开(公告)号:DE3173738D1
公开(公告)日:1986-03-20
申请号:DE3173738
申请日:1981-10-29
Applicant: IBM
Inventor: BENJAMIN CHARLES EPHRAIM , CRAWFORD DAVID JAMES , DAVIS DONALD EUGENE , MOORE RICHARD DAVID , RYAN PHILIP MEADE , WEBER EDWARD VICTOR
IPC: G03F1/00 , H01J37/304 , G03B41/00
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公开(公告)号:DE3578261D1
公开(公告)日:1990-07-19
申请号:DE3578261
申请日:1985-03-21
Applicant: IBM
Inventor: GUILLAUME WALLACE JOSEPH , LOUGHRAN JOHN FARLEY , ROGOYSKI JAN , WEBER EDWARD VICTOR , SIMPSON ROBERT ARTHUR
Abstract: A method of forming inspection patterns for inspecting a workpiece, e.g., for electron beam inspection of optical photomasks. The inspection patterns (Figure 5E) are formed from the workpiece patterns (Figure 5B) themselves by applying a first positive windage (Figure 5C) to the workpiece patterns, inverting (Figure 5D) the first positive windaged workpiece patterns and applying a second positive windage to the inverted first positive windaged workpiece patterns. The inspection patterns so produced will contain the requisite guard band and the requisite overlap of abutting patterns.
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公开(公告)号:DE2805371A1
公开(公告)日:1978-08-24
申请号:DE2805371
申请日:1978-02-09
Applicant: IBM
Inventor: PFEIFFER HANS CHRISTIAN , RYAN PHILIP MEADE , WEBER EDWARD VICTOR
IPC: H01J37/147 , H01J37/09 , H01J37/30 , H01L21/027
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