Abstract:
Apparatus and methods for optimizing a toggle window for a magnetic tunnel junction (MTJ) having a multicomponent free layer are provided. In accordance with an aspect of the invention, a MTJ comprises a free layer, a pinned layer, and a barrier layer formed between the free layer and the pinned layer. The free layer, in turn, includes a plurality of free magnetic sublayers while the pinned layer includes a plurality of pinned magnetic sublayers. Each of the pinned magnetic sublayers exerts a magnetic field on the free magnetic sublayers. To optimize the toggle window for the device, the dimensions of each of the pinned magnetic sublayers are selected to substantially equalize average magnetic fields acting on each of the free magnetic sublayers.
Abstract:
PROBLEM TO BE SOLVED: To provide a toggle type magnetic tunnel junction configured to be capable of precisely controlling the magnetic anisotropy axis of a ferromagnetic layer. SOLUTION: A semiconductor device formed between a word line and bit line has a growth layer, antiferromagnetic layer formed on the growth layer, a pin layer formed on the antiferromagnetic layer, a tunnel barrier layer formed on the pin layer, and a free layer formed on the tunnel barrier layer. The word line and bit line are arranged so that the two lines may become almost orthogonal to each other. Meanwhile, the growth layer has tantulum with thickness of more than about 75 Å. Furthermore, the pin layer has one or more pin ferromagnetic sublayers. The tunnel barrier layer has magnesium oxide. Lastly, the free layer has two or more free ferromagnetic sublayers having a magnetic anisotropy axis oriented to about 45 degrees from the word line and bit line, respectively. The semiconductor device can have a magnetic tunnel junction to be used in an MRAM circuit for example. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a structure, a device, and a memory which are adapted to change the direction of the magnetic moment of a free magnetic layer by using a writing current that is smaller than before, and a method for forming them. SOLUTION: In the magnetoresistive structure, the device, and the memory, and the method for forming them, the magnetoresistive structure includes a first ferromagnetic layer, a first non-magnetic spacer layer adjoining to the first ferromagnetic layer, a second ferromagnetic layer adjoining to the first non-magnetic spacer layer, and a first antiferromagnetic layer adjoining to the second layer where the first ferromagnetic layer can include a first fixed ferromagnetic layer, the second ferromagnetic layer can include a free ferromagnetic layer, and the first antiferromagnetic layer can include a free antiferromagnetic layer. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
Magnetic tunnel junction transistor devices and methods for operating and forming magnetic tunnel junction transistor devices. In one aspect, a magnetic tunnel junction transistor device includes a first source/drain electrode, a second source/drain electrode, a gate electrode, and a magnetic tunnel junction disposed between the gate electrode and the second source/drain electrode. The magnetic tunnel junction includes a magnetic free layer that longitudinally extends between, and is overlapped by, the first and second source/drain electrodes. The gate electrode completely overlaps the magnetic free layer between the first and second source/drain electrodes. The magnetic tunnel junction transistor device switches a magnetization orientation of the magnetic free layer by application of a gate voltage to the gate electrode, thereby changing a resistance between the first and second source/drain electrodes through the magnetic free layer.
Abstract:
Apparatus and methods for optimizing a toggle window for a magnetic tunnel junction (MTJ) having a multicomponent free layer are provided. In accordance with an aspect of the invention, a MTJ comprises a free layer, a pinned layer, and a barrier layer formed between the free layer and the pinned layer. The free layer, in turn, includes a plurality of free magnetic sublayers while the pinned layer includes a plurality of pinned magnetic sublayers. Each of the pinned magnetic sublayers exerts a magnetic field on the free magnetic sublayers. To optimize the toggle window for the device, the dimensions of each of the pinned magnetic sublayers are selected to substantially equalize average magnetic fields acting on each of the free magnetic sublayers.
Abstract:
A thermally assisted magnetoresistive random access memory device (TAS-MRAM or Thermal MRAM). The device operates as a magnetic tunnel junction (MTJ) which comprises a tunnel barrier junction 14 sandwiched between a sense ferromagnetic layer 16 and a synthetic antiferromagnetic layer (SAF) 12 which acts as a storage layer. SAF layer comprises two proximate ferromagnetic layers 11, 13 separated by a non magnetic coupling layer 15 (ruthenium Ru). Adjacent to the SAF layer is a pinning layer 30 which fixes the magnetic orientation of the antiferromagnetic layers in normal operation but when electrically heated during the write cycle, unpins the magnetic orientations of the SAF ferromagnetic layers allowing programming of the TAS-MRAM MTJ device, by an adjacent magnetic filed 80. The ferromagnetic material may comprise Co, Fe, Ni or any alloys of these elements. At least one of the ferromagnetic layers in the ferromagnetic sense layer or in the constituents of the synthetic antiferromagnetic layer may comprise a non magnetic material acting as dopants, for example Ta, Ti, Hf, Cr, Nb, Mo or Zr or alloys of these elements. The doped ferromagnetic layers may be formed from sputtering, co-sputtering and may also form layers or a laminate (figures 8A-C). The ensuing reduction in the magnetostatic interaction dispersions between the relative ferromagnetic sense and storage layers leads to a reduction in reading or writing power consumption. It also allows a relatively larger thickness for each or any of the ferromagnetic layers, which may within the range 10Ã -60Ã .
Abstract:
A thermally assisted magnetoresistive random access memory device (TAS-MRAM) with reduced power for reading and writing; the memory device comprising a tunnel barrier 14 sandwiched between a ferromagnetic sense layer 16 and a ferromagnetic storage layer 12. An antiferromagnetic pinning layer 30 is disposed adjacent to the ferromagnetic storage layer 12. The pinning layer 30 pins a magnetic moment of the storage layer until heating is applied. Either or both of the storage and sense ferromagnetic layers includes a non-magnetic material to reduce the magnetization of the respective layers. The reduction in the storage layer magnetization and sense layer magnetization reduces the magnetostatic interaction between the storage layer and sense layer, resulting in less read/write power. The ferromagnetic materials in the sense and storage layers may include at least one of Co, Fe, Ni, and any alloy including Co, Fe, Ni, whilst the non-magnetic material includes at least one of Ta, Ti, Hf, Cr, Nb, Mo, Zr and any alloy containing Ta, Ti, Hf, Cr, Nb, Mo, Zr. The antiferromagnetic pinning layer may have a diameter less than 250nm based on the reduction in magnetization of at least one of the storage or sense layer. The ferromagnetic storage layer may be formed by sputtering ,chemical vapour (vapor) deposition CVD or physical vapour deposition PVD , and may involve co-sputtering the ferromagnetic and non magnetic material, or forming multi-layers of ferromagnetic and non magnetic material. The ferromagnetic sense layer may also be formed by co-sputtering of ferromagnetic and non magnetic material or forming multilayers of the two materials. An alternative embodiment (figures 7A/B) comprises a tunnel barrier layer 14 sandwiched between a ferromagnetic storage layer 16 and a synthetic antiferromagnetic storage layer 12, which includes a first ferromagnetic storage layer 11 adjacent to the tunnel barrier layer and a non magnetic coupling layer 15 sandwiched between the first ferromagnetic storage layer 11 and a second ferromagnetic storage layer 13. The alternative structure further allows for a relative increase in the thickness of the first ferromagnetic layer 11.
Abstract:
Magnetoresistive structures, devices, memories, and methods for forming the same are presented. For example, a magnetoresistive structure includes a ferromagnetic layer, a ferrimagnetic layer coupled to the ferromagnetic layer, a pinned layer and a nonmagnetic spacer layer. A free side of the magnetoresistive structure comprises the ferromagnetic layer and the ferrimagnetic layer. The nonmagnetic spacer layer is at least partly between the free side and the pinned layer. A saturation magnetization of the ferromagnetic layer opposes a saturation magnetization of the ferrimagnetic layer. The nonmagnetic spacer layer may include a tunnel barrier layer, such as one composed of magnesium oxide (MgO), or a nonmagnetic metal layer.
Abstract:
Methods of manufacturing MTJ memory cells and structures thereof. A diffusion barrier is disposed between an anti-ferromagnetic layer and a pinned layer of an MTJ memory cell to improve thermal stability of the MTJ memory cell. The diffusion barrier may comprise an amorphous material or a NiFe alloy. An amorphous material may be disposed adjacent a bottom surface of a tunnel junction, within a free layer, or both. An MTJ memory cell with improved thermal stability and decreased Neel coupling is achieved.
Abstract:
Transistoreinheit mit einem magnetischen Tunnelübergang, die aufweist:eine erste Source-/Drain-Elektrode;eine zweite Source-/Drain-Elektrode;eine Gate-Elektrode;einen magnetischen Tunnelübergang, der zwischen der Gate-Elektrode und der zweiten Source-/Drain-Elektrode angeordnet ist, wobei der magnetische Tunnelübergang eine magnetische freie Schicht aufweist, die sich der Länge nach zwischen der ersten und der zweiten Source-/Drain-Elektrode erstreckt und von diesen überlagert ist;wobei die Gate-Elektrode die magnetische freie Schicht zwischen der ersten und der zweiten Source-/Drain-Elektrode vollständig überlagert,dadurch gekennzeichnet, dassdie Transistoreinheit des Weiteren eine Gate-Dielektrikum-Schicht aufweist, die zwischen die Gate-Elektrode und die magnetische freie Schicht eingefügt ist.