Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor arrangement plate having an optical fuse in which its component can be repaired through the baking of the fuse. SOLUTION: A semiconductor arrangement plate which has an optical fuse is provided. In this semiconductor, the package material (1) is made of a material which has transparency of the radiation energy that is absorbed by the material of the adjoining fuse (2).
Abstract:
PROBLEM TO BE SOLVED: To provide an inductance which can be integrated monolithically and can be utilized profitably especially in an MRAM mechanism. SOLUTION: This inductance can be integrated monolithically and comprises continuous layers in which conduction layers (P1-P4) and insulation layers (I1-I3) are laminated upward and downward alternately. This constitution of the conduction layers (P1-P4) has a coil-like structure in which a center region (M) being able to provide GMR materials (WM, TB, HM) is centered.
Abstract:
The invention relates to a memory system, in particular for network broadcasting applications such as video/audio applications. Said system comprises at least one memory (PM, PM1 to PMi), which is subdivided into several addressable memory units (M1 to Mx), each with its own output (A1 to Ax) for exchanging data. Each input (I1 to Ix) of a matrix switch is connected to a respective output (A1 to Ax) of a different memory unit. The matrix switch is operated in such a way that several of the memory units (M1 to Mx) are connected in sequential order to its outputs (OP1 to OPy), whereby a first sequence of memory units and a second sequence of memory units are connected independently to its outputs. The invention thus provides a memory system, which can service a number of requests to the same server in a deferred manner, whereby the interaction of the individual memory units (M1 to Mx) and the matrix switch (MS) enables a higher data throughput and a short access period.
Abstract:
A temperature sensor (1) is integrated on the chip together with the integrated circuit. Said temperature sensor supplies a temperature-dependent measuring signal or at least releases a signal when the chip temperature falls below a particular predetermined value. A special circuit device is provided on the chip for this purpose. Said circuit device enables a current flow to be produced through a structure of electrical conductors (2) that is available. The temperature of the integrated circuit is kept above a predetermined minimum temperature with this current flow.
Abstract:
A test configuration that includes a device and a method for testing the device in which test results determined during the testing of the device are stored in a memory in the device. In this way, the test results are connected with the device and available at any time for later evaluations.
Abstract:
The present invention relates to an interconnect structure for an integrated circuit (1) having a first interconnect (B1; B1'; B1''), which is composed of a plurality of interconnect sections (A11-A16; A11'-A16'; A11''-A14'') lying in a first and a second interconnect plane (M0, M1); and a second interconnect (B2; B2'; B2''), which runs adjacent to the first interconnect (B1; B1'; B1'') and which is composed of a plurality of interconnect sections (A21-A25; A21'-A25'; A21''-A23'') lying in the first and second interconnect planes (M0, M1); the first and second interconnects (B1; B1'; B1''; B2; B2'; B2'') being offset with respect to one another in the longitudinal direction in such a way that the interconnect sections (A12, A14, A16; A12', A14', A16'; A12'', A14'') of the first interconnect (B1; B1'; B1'') which lie in the first interconnect plane (M0) run at least in sections beside the interconnect sections (A22, A24; A22'; A24'; A21'', A23'') of the second interconnect (B2; B2'; B2'') which lie in the second interconnection plane (M1), and that the interconnect sections (A11, A13, A
Abstract:
A method for replacing defective memory cells of a random access memory device of a data processing apparatus, in which, during the operation of the data processing apparatus, a defective memory cell is replaced by a replacement memory cell in the random access memory device by using a control instruction.
Abstract:
The method involves selecting a first configuration parameter set, configuring system components accordingly, processing a first program code, determining a first assessment of processing efficiency, selecting a second parameter set, processing a second program code, determining a second efficiency assessment, comparing the assessments, selecting the more efficient parameter set and configuring system components accordingly. The method involves providing a computer system (5) with functionally configurable components (10), selecting a first configuration parameter set (15), configuring the system components accordingly, processing a first program code (20), determining a first assessment of processing efficiency, selecting a second parameter set (30), processing a second program code (35), determining a second efficiency assessment, comparing the assessments, selecting the more efficient parameter set and configuring accordingly. Independent claims are also included for the following: a computer system and a computer program product.