Abstract:
PROBLEM TO BE SOLVED: To reduce an electric current consumption in an operation time of an electronic circuit caused by a test module for testing the electronic circuit. SOLUTION: The present invention relates to a method of reducing the electric current consumption in the electronic circuit. The electronic circuit has the at least one test module 30 provided for testing the electronic circuit, and connected to at least one wire 38, 40 and/or one terminal of the electronic circuit. One test control signal 34 is generated, the at least one test module 30 is electrically separated at least partially from the at least one wire 38, 40 and/or the at least one terminal in an operation mode of the electronic circuit, using the test control signal, and a switching current is evaded in the at least one test module. COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide an inductance which can be integrated monolithically and can be utilized profitably especially in an MRAM mechanism. SOLUTION: This inductance can be integrated monolithically and comprises continuous layers in which conduction layers (P1-P4) and insulation layers (I1-I3) are laminated upward and downward alternately. This constitution of the conduction layers (P1-P4) has a coil-like structure in which a center region (M) being able to provide GMR materials (WM, TB, HM) is centered.
Abstract:
PROBLEM TO BE SOLVED: To improve an integrated circuit by selecting a MOS transistor and supplying stable voltage. SOLUTION: A differential amplifier 1 has two input transistors T1, T2, a load element 2, and a current source 3 having a N channel MOS transistor T3, a section to be controlled of the transistor is connected to an input transistor and a current source supply connection terminal 31, and a control connection terminal G is connected to a connection terminal of a potential V3 being positive for a reference potential GND. An integrated circuit is inclined in a circuit device of a dynamic memory, the supply connection terminal of the current source is connected to a voltage source 4 for cutting off an array panel transistor of an integrated dynamic memory, and the voltage source has a negative potential V2 for the reference potential.
Abstract:
The invention relates to an integrated DRAM memory chip comprising sense amplifiers, each configured for the integrated module from a large number of transistor structures and signal conduction pathway structures that are arranged in a regular pattern in cell fields. Said structures comprise amplifier transistors for amplifying the bit line signal, which are structurally identical and lie opposite one another in pairs in neighbouring transistor rows, and signal conduction pathways that are assigned to the transistor rows, running parallel with the latter, for supplying control signals. According to the invention, the signal conduction pathways for the control signals have the same configuration symmetry as the amplifier transistors, in such a way that the amplifier transistors of neighbouring transistor rows have the same proximity to the signal conduction pathway.
Abstract:
The invention relates to a semiconductor memory wherein the substantially parallel bit lines (38, 39) are capacitatively coupled with one another. Outer sections (13, 14, 36, 37) of said bit lines are linked with an interposed sense amplifier (10) via respective switches (27, 28, 29, 30). The aim of the invention is to keep to a minimum the capacitative coupling of other bit lines into the bit line (39) not coupled to the memory cell (15) to be read out during read-out of a memory cell (15) before the sense amplifier (10) starts amplification. To this end, the switches (28, 29) in said bit line (39) are in the position in which they are conducting. During the amplification phase the remote outer section (37) of said bit line (39) is switched off via the respective switch (29). In an embodiment of the invention, the capacity of the bit line (39) linked with the memory cell (15) to be read out is increased even further by additionally activating a precharge circuit (31).
Abstract:
An RC network is integrated in a semiconductor circuit chip and is connected between an input pad or pin and a ground node coupled to a substrate of the chip. The RC network has a plurality of resistance elements, a plurality of capacitance elements and a plurality of connection/isolation elements, which are provided in each case between at least one of the resistance elements and the individual capacitive elements. The inventive circuit configuration enables an optional and independent setting of the input capacitance and of the input resistance of the semiconductor circuit chip, depending on the connection/isolation state of the connection/isolation elements.
Abstract:
A semiconductor memory includes: at least two memory banks that each have a memory cell matrix, an address decoding unit which includes a bank address decoding unit, a row address decoding unit and a column address decoding unit. At least one demultiplexer is connected upstream of the address buffer memories provided in the row address decoding unit and/or in the column address decoding unit. This demultiplexer is connected to the bank address decoder in order, on the basis of the decoded bank address, to activate the corresponding address buffer memory.
Abstract:
ESD protection (100) limits voltage heterodyned to useful voltage to permissible level and comprises numerous series-connected diodes (106), which are poled in flow direction, related to useful voltage, with sum of activating voltages of diodes corresponding to permissible voltage. Preferably permissible voltage is of same polarity as useful voltage. Typically number of series-connected diodes is so chosen that permissible voltage is less than blocking voltage of individual diode.