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公开(公告)号:WO2006050690A3
公开(公告)日:2006-08-31
申请号:PCT/DE2005001921
申请日:2005-10-26
Applicant: INFINEON TECHNOLOGIES AG , DANGELMAIER JOCHEN , FOWLKES DONALD , GUENGERICH VOLKER , HOYER HENRIK , PAULUS STEFAN , PETZ MARTIN
Inventor: DANGELMAIER JOCHEN , FOWLKES DONALD , GUENGERICH VOLKER , HOYER HENRIK , PAULUS STEFAN , PETZ MARTIN
IPC: H01L23/10 , H01L21/48 , H01L23/047
CPC classification number: H01L23/047 , H01L23/10 , H01L23/49861 , H01L23/66 , H01L24/29 , H01L24/48 , H01L24/49 , H01L25/072 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48472 , H01L2224/49 , H01L2224/73265 , H01L2224/85205 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01046 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/16195 , H01L2924/16315 , H01L2924/166 , H01L2924/181 , H01L2924/18301 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
Abstract: Disclosed is an electronic component (1), especially a high frequency power module (2), comprising a hollow housing (3) with a housing frame (4), plastic walls (5), and a metallic housing bottom (9) with at least one chip island (10) and at least one semiconductor chip (11) which is disposed on said chip island (10). The plastic walls (5) are made of a thermosetting material while being provided with surfaces (36) that are connected to surfaces (37) of the metallic housing bottom (9) via a soldered joint.
Abstract translation: 一种电子部件(1),特别是射频功率模块(2)具有空腔壳体(3)与壳体框架(4)与塑料壁(5)和金属外壳的底部(9)与至少一种芯片岛(10)和中的至少一个 所述芯片岛(10)布置有半导体芯片(11),其中所述塑料壁(5)由热固性塑料制成并且具有经由焊接连接与所述金属外壳底部(9)的表面(37)连接的表面(36)。
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公开(公告)号:DE102004054597A1
公开(公告)日:2006-05-24
申请号:DE102004054597
申请日:2004-11-11
Applicant: INFINEON TECHNOLOGIES AG
Inventor: GUENGERICH VOLKER , PETZ MARTIN , DANGELMAIER JOCHEN , PAULUS STEFAN , FOWLKES DONALD , HOYER HENRIK
IPC: H01L23/053 , H01L23/06
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公开(公告)号:DE19938998B4
公开(公告)日:2008-01-17
申请号:DE19938998
申请日:1999-08-17
Applicant: INFINEON TECHNOLOGIES AG
Inventor: SCHRAUD GERHARD , REINER ROBERT , EICHNER DIERK , GUENGERICH VOLKER
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公开(公告)号:DE59908482D1
公开(公告)日:2004-03-11
申请号:DE59908482
申请日:1999-11-03
Applicant: INFINEON TECHNOLOGIES AG
Inventor: NEBEL GERHARD , GUENGERICH VOLKER , BLUM ANDREAS , WEDER UWE , EICHNER DIERK , REINER ROBERT , SCHRAUD GERHARD
Abstract: A method for demodulating a voltage which has been ASK modulated by changing the amplitude between a low level and a high level, in particular for use during contactless data transmission from a card reader/writer to a smart card, is described. The method is distinguished, in that, in an initialization phase, a first mean value is produced from the high voltage level and a stored partial voltage derived therefrom in order to detect a change to a low voltage level. The change to the low voltage level represents a start value and is detected by a subsequent comparison of the modulated voltage with the first mean value. In a subsequent demodulation phase, a second mean value is produced from the detected low voltage level and the high voltage level in order to demodulate the modulated voltage by comparing the modulated voltage with the second mean value.
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公开(公告)号:DE102005002707B4
公开(公告)日:2007-07-26
申请号:DE102005002707
申请日:2005-01-19
Applicant: INFINEON TECHNOLOGIES AG
Inventor: THEUSS HORST , GUENGERICH VOLKER
IPC: H01L23/50 , H01L21/60 , H01L23/498 , H01L23/64
Abstract: The component has a micro connecting unit (3) to provide high frequency coupling of components (5) of the semiconductor component. The unit has a three ply structure with two layers (6, 8) made up of conductive material and a layer (7) made up of insulating material. The layers (6, 8) extend along a common middle line protecting against interfering fields and fixed on contact surface pairs of the components (5). An independent claim is also included for a method for creating an electrical connection between components of a semiconductor component and micro-connection unit.
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公开(公告)号:DE102005008600A1
公开(公告)日:2006-08-31
申请号:DE102005008600
申请日:2005-02-23
Applicant: INFINEON TECHNOLOGIES AG
Inventor: AUBURGER ALBERT , STADLER BERND , DANGELMAIER JOCHEN , GUENGERICH VOLKER
Abstract: A chip carrier (1) comprises two opposing surfaces (2, 3); and two recesses (4, 5) provided in the respective surface, where the chip carrier is configured to provide a heat sink for semiconductor chips arranged on the chip carrier, and the recesses are dimensioned to receive two semiconductor chips (10, 10'). Independent claims are also included for: (1) a system comprising a chip carrier and two semiconductor chips supported by the chip carrier, the chip carrier comprising two opposing surfaces, and two recesses in the respective surface, where the semiconductor chips are received within the respective recess, and the chip carrier is configured to provide a heat sink for the semiconductor chips supported by the chip carrier; and (2) a method for producing a chip carrier to support semiconductor chips, comprising forming a first recess in a first surface of the chip carrier; and forming a second recess in a second surface of the chip carrier, the second surface opposing the first surface, where the recesses are configured to receive the semiconductor chips in the respective recesses, and the chip carrier is configured to provide a heat sink for the semiconductor chips.
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公开(公告)号:AT259128T
公开(公告)日:2004-02-15
申请号:AT99955954
申请日:1999-11-03
Applicant: INFINEON TECHNOLOGIES AG
Inventor: NEBEL GERHARD , GUENGERICH VOLKER , BLUM ANDREAS , WEDER UWE , EICHNER DIERK , REINER ROBERT , SCHRAUD GERHARD
Abstract: A method for demodulating a voltage which has been ASK modulated by changing the amplitude between a low level and a high level, in particular for use during contactless data transmission from a card reader/writer to a smart card, is described. The method is distinguished, in that, in an initialization phase, a first mean value is produced from the high voltage level and a stored partial voltage derived therefrom in order to detect a change to a low voltage level. The change to the low voltage level represents a start value and is detected by a subsequent comparison of the modulated voltage with the first mean value. In a subsequent demodulation phase, a second mean value is produced from the detected low voltage level and the high voltage level in order to demodulate the modulated voltage by comparing the modulated voltage with the second mean value.
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公开(公告)号:BR9915115A
公开(公告)日:2001-07-31
申请号:BR9915115
申请日:1999-11-03
Applicant: INFINEON TECHNOLOGIES AG
Inventor: NEBEL GERHARD , GUENGERICH VOLKER , BLUM ANDREAS , WEDER UWE , EICHNER DIERK , REINER ROBERT , SCHRAUD GERHARD
Abstract: A method for demodulating a voltage which has been ASK modulated by changing the amplitude between a low level and a high level, in particular for use during contactless data transmission from a card reader/writer to a smart card, is described. The method is distinguished, in that, in an initialization phase, a first mean value is produced from the high voltage level and a stored partial voltage derived therefrom in order to detect a change to a low voltage level. The change to the low voltage level represents a start value and is detected by a subsequent comparison of the modulated voltage with the first mean value. In a subsequent demodulation phase, a second mean value is produced from the detected low voltage level and the high voltage level in order to demodulate the modulated voltage by comparing the modulated voltage with the second mean value.
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公开(公告)号:DE102005006281A1
公开(公告)日:2006-08-24
申请号:DE102005006281
申请日:2005-02-10
Applicant: INFINEON TECHNOLOGIES AG
Inventor: GUENGERICH VOLKER , DANGELMAIER JOCHEN , FOWLKES DONALD , HOYER HENRIK
IPC: H01L21/3205 , H01L23/06 , H01L23/485 , H01L23/498 , H01L23/532
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公开(公告)号:DE102005002707A1
公开(公告)日:2006-07-27
申请号:DE102005002707
申请日:2005-01-19
Applicant: INFINEON TECHNOLOGIES AG
Inventor: THEUSS HORST , GUENGERICH VOLKER
Abstract: The component has a micro connecting unit (3) to provide high frequency coupling of components (5) of the semiconductor component. The unit has a three ply structure with two layers (6, 8) made up of conductive material and a layer (7) made up of insulating material. The layers (6, 8) extend along a common middle line protecting against interfering fields and fixed on contact surface pairs of the components (5). An independent claim is also included for a method for creating an electrical connection between components of a semiconductor component and micro-connection unit.
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