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公开(公告)号：DE10259057A1
公开(公告)日：2004-07-15
申请号：DE10259057
申请日：2002-12-17
Applicant: INFINEON TECHNOLOGIES AG
Inventor： ELIAN KLAUS , ESCHBAUMER CHRISTIAN , JUTGLA ANGELA , HEUSINGER NICOLE , KERN MARION
Abstract: A photoresist composition containing, as carrier polymer, a copolymer of tert.-butyl methacrylate and 3-heptaisobutyl-POSS-propyl methacrylate (RTM: acrylic monomer with a polycyclic octasiloxane group in the side chain). A photo-resist composition (I) containing (a) a carrier polymer of formula (II), (b) a selected photo-acid generator and (c) a solvent. R = alkyl; x, y = 0.1-0.9 An Independent claim is also included for a method for the production of a photo-mask by coating a mask blank with composition (I), inscribing the blank, developing the composition on the blank and then plasma-etching the blank, preferably using a gas mixture containing oxygen and chlorine for the plasma.
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公开(公告)号：DE10208786B4
公开(公告)日：2006-02-09
申请号：DE10208786
申请日：2002-02-28
Applicant: INFINEON TECHNOLOGIES AG
Inventor： YIP SIEW SIEW , ROTTSTEGGE JOERG , RICHTER ERNST , FALK GERTRUD , SEBALD MICHAEL , SEIBOLD KERSTIN , KERN MARION
IPC: G03F7/40
Abstract: Amplification of structurized resist uses chemical amplification photoresist (CAR) containing film-forming polymer (I) with acid-labile groups releasing groups that increase solubility in aqueous alkaline developer and anchor groups for coupling with amplification agent (II) containing reactive groups, photoacid and solvent for (I). The structurized CAR is amplified by applying (II) as liquid phase in solvent, then washed with water. Amplification of a structurized resist uses a chemical amplification photoresist (CAR) to a substrate, in which the CAR contains a film-forming polymer (I) with acid-labile groups releasing groups that increase its solubility in aqueous alkaline developers and also (protected) anchor groups for coupling with amplification agent (II), a photoacid (III) and a solvent (IV) for (I). This is applied to a substrate, dried to form resist film, exposed selectively to release acid from (III) in the exposed sections; heated to remove the acid-labile groups from (I) and release polar groups, giving a contrasted resist with polar and unpolar sections; and developed with an alkaline developer, which has higher polarity than (IV) and does not dissolve (I), so that the polar sections are removed. The structurized resist is then treated with (II), which has reactive group(s) that can react with the reactive anchor groups of (I), as liquid phase in solvent(s) in which (I) is insoluble and leaving the (II) solution on the structurized resist so that it couples with (I) to give an amplified resist; then washed with a medium containing water as solvent to remove excess (II).
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公开(公告)号：DE10208786A1
公开(公告)日：2003-10-09
申请号：DE10208786
申请日：2002-02-28
Applicant: INFINEON TECHNOLOGIES AG
Inventor： YIP SIEW SIEW , ROTTSTEGGE JOERG , RICHTER ERNST , FALK GERTRUD , SEBALD MICHAEL , SEIBOLD KERSTIN , KERN MARION
IPC: G03F7/40
Abstract: Amplification of structurized resist uses chemical amplification photoresist (CAR) containing film-forming polymer (I) with acid-labile groups releasing groups that increase solubility in aqueous alkaline developer and anchor groups for coupling with amplification agent (II) containing reactive groups, photoacid and solvent for (I). The structurized CAR is amplified by applying (II) as liquid phase in solvent, then washed with water. Amplification of a structurized resist uses a chemical amplification photoresist (CAR) to a substrate, in which the CAR contains a film-forming polymer (I) with acid-labile groups releasing groups that increase its solubility in aqueous alkaline developers and also (protected) anchor groups for coupling with amplification agent (II), a photoacid (III) and a solvent (IV) for (I). This is applied to a substrate, dried to form resist film, exposed selectively to release acid from (III) in the exposed sections; heated to remove the acid-labile groups from (I) and release polar groups, giving a contrasted resist with polar and unpolar sections; and developed with an alkaline developer, which has higher polarity than (IV) and does not dissolve (I), so that the polar sections are removed. The structurized resist is then treated with (II), which has reactive group(s) that can react with the reactive anchor groups of (I), as liquid phase in solvent(s) in which (I) is insoluble and leaving the (II) solution on the structurized resist so that it couples with (I) to give an amplified resist; then washed with a medium containing water as solvent to remove excess (II).
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