2.
    发明专利
    未知

    公开(公告)号:DE10302224B4

    公开(公告)日:2007-09-13

    申请号:DE10302224

    申请日:2003-01-20

    Abstract: An integrated memory has a memory cell array having word lines and bit lines. The bit lines are organized in bit line pairs. The bit lines of the bit line pairs cross one another at a crossing location and run parallel to one another. A sense amplifier is connected to one of the bit line pairs at one end. Two precharge circuits are provided. One precharge circuit is arranged on a side of the crossing location and the other precharge circuit is arranged on a side of the crossing location. The precharge circuit facing the sense amplifier is arranged at a first distance from the crossing location and at a second distance from the sense amplifier. The RC constant of the bit lines, which is effective during the precharge operation, is reduced, so that the time period required for a precharge operation is reduced.

    6.
    发明专利
    未知

    公开(公告)号:DE10323865B4

    公开(公告)日:2005-04-21

    申请号:DE10323865

    申请日:2003-05-26

    Abstract: An integrated circuit, in particular, an integrated memory, contains a control circuit for ascertaining an operating state of the circuit. A self-repair circuit, which is connected to the control circuit, is used to implement self-test and self-repair operation for checking the functioning of, and repairing, defective circuit sections of the integrated circuit. After a supply voltage has been applied to the integrated circuit, the control circuit ascertains an operating state of the integrated circuit and, in a manner dependent thereon, the self-repair circuit is activated by the control circuit in a self-controlling manner in order to put the integrated circuit into a self-repair mode for implementing self-test and self-repair operation. The integrated circuit can be tested for its functionality and repaired even after being soldered onto a module substrate.

    7.
    发明专利
    未知

    公开(公告)号:DE10313605A1

    公开(公告)日:2004-10-21

    申请号:DE10313605

    申请日:2003-03-26

    Abstract: The device according to the invention in each case has a temperature sensor for detecting the temperatures of the memory modules, which is arranged in the memory modules. In addition, a memory control module is provided, which, in order to evaluate the temperatures, is connected to the memory modules via a measurer or means for determining the highest operating temperature of the memory modules. The memory control module is designed and can be operated such that an adaptation operation is initiated, if the highest operating temperature exceeds a specific value.

Patent Agency Ranking