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公开(公告)号:DE10330593A1
公开(公告)日:2005-02-10
申请号:DE10330593
申请日:2003-07-07
Applicant: INFINEON TECHNOLOGIES AG
Inventor: PROELL MANFRED , TASKIN NAZIF , RESCH GERALD , DOBLER MANFRED
IPC: G11C7/22 , G11C11/4076 , G11C29/14 , G11C29/00
Abstract: An integrated clock-pulse supply module has a clock-pulse input (1.1) for applying a first clock signal (clk1) and a clock signal output (1.2-1.5), a phase control loop (2) connected on the input-side to the clock signal input (1.1) and generating a second clock signal (clk2), a multiplexer (MUX) for selective switching the clock signals (clk1,clk2) to the clock signal output, and a unit for frequency monitoring connected on the input side to the clock signal input (1.1) and with under-achieving of a threshold frequency (fmin) the multiplexer is made to switch the first clock signal (clk1) on to the clock signal output (1.2-1.5). Independent claims are included for (a) application of the integrated clock-pulse supply and for (b) a memory module and for (c) a method of driving a memory module under test conditions.
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公开(公告)号:DE10152916B4
公开(公告)日:2006-11-30
申请号:DE10152916
申请日:2001-10-26
Applicant: INFINEON TECHNOLOGIES AG
Inventor: STOCKEN CHRISTIAN , CORDES ERIC , WIRTH NORBERT , TASKIN NAZIF
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公开(公告)号:DE10161044A1
公开(公告)日:2003-03-13
申请号:DE10161044
申请日:2001-12-12
Applicant: INFINEON TECHNOLOGIES AG
Inventor: STOCKEN CHRISTIAN , CORDES ERIC , WIRTH NORBERT , TASKIN NAZIF
IPC: H01L23/525 , H01L23/58
Abstract: An integrated semiconductor chip comprises a substrate (1) with a circuit (3) contact surfaces (4) connected to a chip housing (5) connections (6). An electrically switchable device (7) in a connection between the circuit and housing can be switched in to select one of many operational modes of the chip.
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公开(公告)号:DE10152916A1
公开(公告)日:2003-05-22
申请号:DE10152916
申请日:2001-10-26
Applicant: INFINEON TECHNOLOGIES AG
Inventor: STOCKEN CHRISTIAN , CORDES ERIC , WIRTH NORBERT , TASKIN NAZIF
Abstract: The module (52) incorporating an EEPROM, has an information containing unit (56) that contains information relating to the memory module. A memory chip (54) arranged on the memory module has the information containing unit arranged in a distributed way. The information containing unit has flip flops for permanently programming information that relates to operational parameters of the memory module.
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