Abstract:
The invention relates to a test method for testing, on a testing device (PA), semiconductor devices (P) that have a bi-directional data strobe link for a data strobe signal (DQS) whereby the data strobe signal is tested by transferring data between the semiconductor memory device (P) to be tested and a second semiconductor memory device of the same type (R). The invention also relates to a device for carrying out the inventive method.
Abstract:
The component (5) can be connected to a burn-in voltage, which is higher than its internal voltage, which is impressed across a switchable regulator (6) integrated in the component. An element (1,2) integrated in the component has a different characteristic, e.g. degradation, from the regulator under the burn-in voltage after the burn-in test duration. The element may be a fuse.
Abstract:
The invention relates to a test method for testing, on a testing device (PA), semiconductor devices (P) that have a bi-directional data strobe link for a data strobe signal (DQS) whereby the data strobe signal is tested by transferring data between the semiconductor memory device (P) to be tested and a second semiconductor memory device of the same type (R). The invention also relates to a device for carrying out the inventive method.
Abstract:
A memory circuit includes a plurality of memory cells, an input/output area for addressing or writing onto the plurality of memory cells by means of electrical signals, and an optical-electrical converter for converting optical signals into the electrical signals, the plurality of memory cells and the input/output area being integrated on a chip, and the optical-electrical converter being mechanically connected to the chip or being integrated into the chip.
Abstract:
A test method for a semiconductor memory device having a bidirectional data strobe terminal for a data strobe signal, and having at least one data terminal for a data signal at a test apparatus, which can at least generate data strobe and data signals and also transfer and evaluate data signals. The memory device is connected to a test apparatus, which generates data strobe and data signals, and transfers and evaluates data signals. In the course of the test using the data strobe and data signals, data are transferred from the first semiconductor memory device to a second semiconductor memory device of identical type and are evaluated after a read-out from the second semiconductor memory device by the test apparatus.
Abstract:
During attachment, the temperature of memory components (especially micro-capacitors) of the chip, is held below that reached during soldering in a soldering oven.
Abstract:
An integrated semiconductor chip comprises a substrate (1) with a circuit (3) contact surfaces (4) connected to a chip housing (5) connections (6). An electrically switchable device (7) in a connection between the circuit and housing can be switched in to select one of many operational modes of the chip.
Abstract:
A test method for a semiconductor memory device having a bidirectional data strobe terminal for a data strobe signal, and having at least one data terminal for a data signal at a test apparatus, which can at least generate data strobe and data signals and also transfer and evaluate data signals. The memory device is connected to a test apparatus, which generates data strobe and data signals, and transfers and evaluates data signals. In the course of the test using the data strobe and data signals, data are transferred from the first semiconductor memory device to a second semiconductor memory device of identical type and are evaluated after a read-out from the second semiconductor memory device by the test apparatus.
Abstract:
The module (52) incorporating an EEPROM, has an information containing unit (56) that contains information relating to the memory module. A memory chip (54) arranged on the memory module has the information containing unit arranged in a distributed way. The information containing unit has flip flops for permanently programming information that relates to operational parameters of the memory module.