CMOS DEVICE AND METHOD FOR MANUFACTURING THE SAME
    2.
    发明申请
    CMOS DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
    CMOS器件及其制造方法

    公开(公告)号:US20160086946A1

    公开(公告)日:2016-03-24

    申请号:US14721386

    申请日:2015-05-26

    Abstract: An CMOS device comprises a plurality of NMOS transistors and a plurality of PMOS transistors, each of which comprises a gate stack constituted of a gate insulating layer and a gate metal layer on a substrate, a source/drain region in the substrate on both sides of the gate stack and a channel region below the gate stack, wherein the gate metal layer of each NMOS transistor comprising a first barrier layer, an NMOS work function adjusting layer, a second barrier layer, and a filling layer, and wherein the gate metal layer of each PMOS transistor comprising a first barrier layer, a PMOS work function adjusting layer, an NMOS work function adjusting layer, a second barrier layer, and a filling layer, and wherein the first barrier layer in the gate metal layer of the NMOS transistor and the first barrier layer in the gate metal layer of the PMOS transistor contain a doping ion to finely adjust the work function. The semiconductor device and the method for manufacturing the same according to the present disclosure utilize the sacrificial layer to diffuse impurity to the barrier layer so that the adjusting accuracy of the threshold voltage may be effectively improved, thereby facilitating in improving the whole performance of the device.

    Abstract translation: CMOS器件包括多个NMOS晶体管和多个PMOS晶体管,每个PMOS晶体管包括由衬底上的栅极绝缘层和栅极金属层构成的栅极堆叠,在衬底的两侧的衬底中的源极/漏极区域 栅极堆叠和栅极堆叠下方的沟道区,其中每个NMOS晶体管的栅极金属层包括第一势垒层,NMOS功函数调节层,第二势垒层和填充层,并且其中栅极金属层 每个PMOS晶体管包括第一阻挡层,PMOS功函数调整层,NMOS功函数调整层,第二势垒层和填充层,并且其中NMOS晶体管的栅极金属层中的第一势垒层和 PMOS晶体管的栅极金属层中的第一势垒层含有掺杂离子以微调功函数。 根据本公开的半导体器件及其制造方法利用牺牲层将杂质扩散到阻挡层,从而可以有效地提高阈值电压的调整精度,从而有助于提高器件的整体性能 。

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