公开(公告)号：DE60200679T2

公开(公告)日：2005-08-25

申请号：DE60200679

申请日：2002-04-25

Applicant: JSR CORP

Inventor： OKADA TAKASHI ,  SINOHARA NORIYASU ,  SHIRATO KAORI ,  EBISAWA MASAHIKO ,  NISHIKAWA MICHINORI ,  YAMADA KINJI

IPC: C08J5/18 ,  C08F38/02 ,  C08G61/00 ,  C08G61/02 ,  C08G61/12 ,  C09D165/00 ,  C09D201/00 ,  C08F38/00 ,  C08F238/00

Abstract: a composition for film formation which can be cured in a short time period and give a film having a low dielectric constant and excellent in heat resistance, adhesion and cracking resistance, a polymer for use in the composition and a process for producing the polymer. The composition prepared by dissolving the polymer having specific repeating units in a solvent has excellent film-forming properties. The polymer has repeating units represented by the following general formula (1): wherein Z and Y are as defined hereinabove.t

公开(公告)号：DE60329741D1

公开(公告)日：2009-12-03

申请号：DE60329741

申请日：2003-10-28

Applicant: JSR CORP

Inventor： KUROSAWA TAKAHIKO ,  SHIRATO KAORI

IPC: C08G73/10 ,  H01L21/764 ,  H01L21/768 ,  H01L23/482 ,  H01L23/522 ,  H01L23/532

Abstract: A method that can readily form a cavity structure between metallic wirings in, for example, semiconductors using a polyamic acid and/or a polyimide obtained by reacting a specific alicyclic tetracarboxylic acid dianhydride and a specific alicyclic diamine. The method includes a step of coating the surface of a first dielectric film formed on a semiconductor substrate with a polyamic acid and/or a polyimide, a step of patterning a cavity-forming polymer between the multilayered wirings, a step of forming a second dielectric film on the cavity-forming polymer between the multilayered wirings containing a metallic wiring, and a step of removing the cavity-forming polymer between the multilayered wirings by heating to form a cavity between the metallic wirings.

公开(公告)号：DE60230830D1

公开(公告)日：2009-03-05

申请号：DE60230830

申请日：2002-03-25

Applicant: JSR CORP

Inventor： SHINOHARA NORIYASU ,  SHIRATO KAORI ,  NISHIKAWA MICHINORI ,  OKADA TAKASHI ,  YAMADA KINJI

IPC: C08L65/00 ,  C09D165/00 ,  C08G61/02 ,  C08G61/12 ,  C08L71/12 ,  C09D171/00 ,  C09D171/12 ,  C09D183/07 ,  H01L21/312 ,  H05K1/00

Abstract: A composition for film formation capable of forming a coating film excellent in low dielectric constant characteristics, cracking resistance, modulus of elasticity, and adhesion to substrates and useful as an interlayer insulating film material in semiconductor devices, etc. The composition for film formation contains (A) at least one member selected from an aromatic polyarylene and an aromatic poly (arylene ether), (B) a polyvinylsiloxane, and (C) an organic solvent.

公开(公告)号：SG145657A1

公开(公告)日：2008-09-29

申请号：SG2008013559

申请日：2008-02-18

Applicant: JSR CORP

Inventor： KOIDE TOSHIYUKI ,  MINOWA TAKAKI ,  MATOBA TAKUMI ,  SHIRATO KAORI ,  HATANO SUGURU

Abstract: RADIATION SENSITIVE COMPOSITION FOR FORMING A COLORED LAYER,COLOR FILTER AND COLOR LIQUID CRYSTAL DISPLAY DEVICE

公开(公告)号：SG139651A1

公开(公告)日：2008-02-29

申请号：SG2007050909

申请日：2007-07-09

Applicant: JSR CORP

Inventor： SHIRATO KAORI ,  HIRAI TSUYOSHI ,  IIJIMA TAKAHIRO

Abstract: RADIATION SENSITIVE COMPOSITION FOR FORMING A COLORED LAYER, COLOR FILTER AND COLOR LIQUID CRYSTAL DISPLAY DEVICE A radiation sensitive composition for forming a colored layer, comprising (A) a colorant, (B) an alkali-soluble resin, (C) a polyfunctional monomer and (D) a photoradical generator, wherein the alkali-soluble resin (B) comprises a polyester having an alicyclic hydrocarbon skeleton in the main chain and a polymerizable unsaturated bond in the side chain.The radiation sensitive composition for forming a colored layer does not produce the residual undissolved product or scum on the pattern edge at the time of development and provides a colored layer without a missing part of the pattern edge or an undercut even when the amount of exposure is small.

公开(公告)号：DE60200679D1

公开(公告)日：2004-08-05

申请号：DE60200679

申请日：2002-04-25

Applicant: JSR CORP

Inventor： OKADA TAKASHI ,  SINOHARA NORIYASU ,  SHIRATO KAORI ,  EBISAWA MASAHIKO ,  NISHIKAWA MICHINORI ,  YAMADA KINJI

IPC: C08J5/18 ,  C08F38/02 ,  C08G61/00 ,  C08G61/02 ,  C08G61/12 ,  C09D165/00 ,  C09D201/00 ,  C08F38/00 ,  C08F238/00

Abstract: a composition for film formation which can be cured in a short time period and give a film having a low dielectric constant and excellent in heat resistance, adhesion and cracking resistance, a polymer for use in the composition and a process for producing the polymer. The composition prepared by dissolving the polymer having specific repeating units in a solvent has excellent film-forming properties. The polymer has repeating units represented by the following general formula (1): wherein Z and Y are as defined hereinabove.t

公开(公告)号：EP1760774A4

公开(公告)日：2011-08-03

申请号：EP05744109

申请日：2005-05-20

Applicant: JSR CORP ,  SUMITOMO BAKELITE CO

Inventor： SHIRATO KAORI ,  SHIOTA ATSUSHI ,  TADA MASAHIRO ,  ASAKUMA SUMITOSHI

IPC: H01L21/768 ,  C08G73/22 ,  C08L79/04 ,  H01L21/312

CPC classification number: H01L21/76834 ,  C08G73/22 ,  H01L21/312 ,  H01L21/3121 ,  H01L21/31608 ,  H01L21/76813 ,  H01L21/76829 ,  H01L21/76835 ,  H01L2221/1036 ,  Y10T428/31678

Abstract: A laminate includes a copper wiring layer (20) provided over a semiconductor layer and having a specific pattern, a protective layer (30) formed of a polybenzoxazole resin layer provided on the copper wiring layer (20), and an insulating layer (40) provided on the protective layer.

公开(公告)号：JP2002285080A

公开(公告)日：2002-10-03

申请号：JP2001088033

申请日：2001-03-26

Applicant: JSR CORP

Inventor： SHINOHARA NOBUYASU ,  SHIRATO KAORI ,  OKADA TAKASHI ,  NISHIKAWA MICHINORI ,  YAMADA KINJI

IPC: C09D165/00 ,  C08G61/02 ,  C08G61/12 ,  C08L65/00 ,  C08L71/12 ,  C09D171/00 ,  C09D171/12 ,  C09D183/07 ,  H01L21/312 ,  H05K1/00

Abstract: PROBLEM TO BE SOLVED: To obtain a composition for forming a film, as a material for the interlayer insulating film in semiconductor devices, which can make a coating film that has low dielectric property and excels in crack resistance, elastic modulus of film, and adhesiveness to a substrate. SOLUTION: A composition for forming a film containing an aromatic polyarylene and/or an aromatic polyarylene ether (A), a polyvinylsiloxane (B), and an organic solvent (C).

公开(公告)号：JP2008019293A

公开(公告)日：2008-01-31

申请号：JP2006189871

申请日：2006-07-10

Applicant: Dai Ichi Kogyo Seiyaku Co Ltd ,  Jsr Corp ,  Jsr株式会社 ,  第一工業製薬株式会社

Inventor： SHIRATO KAORI ,  HIRAI TAKESHI ,  IIJIMA TAKAHIRO ,  TAKAMURA NAOHIRO ,  SUGAWARA TERUAKI

IPC: C08G63/56 ,  C08F290/00 ,  G03F7/027

CPC classification number: C08F290/14 ,  C08G63/54 ,  C08G63/918 ,  G03F7/0388

Abstract: PROBLEM TO BE SOLVED: To provide a new polyester used as a photosensitive resin having flexibility. SOLUTION: The polyester has a terpene skeleton represented by general formula (1) (wherein, X represents a terpene diphenoxy group; Y represents a residue after removing carboxy groups from a tetrabasic acid dianhydride; R represents an H or a CH 3 ; R' represents an H or a residue of a carboxy group-blocking agent; and n represents an integer of 1-40). COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供用作具有柔性的感光性树脂的新型聚酯。 解决方案：聚酯具有由通式（1）表示的萜烯骨架（其中X表示萜烯二苯氧基; Y表示从四元酸二酐除去羧基后的残基; R表示H或CH < SB> 3 ; R'表示H或羧基封闭剂的残基，n表示1-40的整数）。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2005311069A

公开(公告)日：2005-11-04

申请号：JP2004125901

申请日：2004-04-21

Applicant: Jsr Corp ,  Jsr株式会社

Inventor： SHIRATO KAORI ,  SHIODA ATSUSHI

IPC: H01L21/768 ,  H01L21/312 ,  H01L23/522

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device having a barrier layer which can fully suppress diffusion of copper on a conductive layer containing copper.
SOLUTION: The semiconductor device includes a substrate, the conductive layer 20 arranged on the substrate, and the barrier film 30 disposed above the conductive layer 20. The barrier film 30 is obtained by heating polybenzoxazole.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种具有阻挡层的半导体器件，其能够完全抑制铜在含铜导电层上的扩散。 解决方案：半导体器件包括衬底，布置在衬底上的导电层20和设置在导电层20上方的阻挡膜30.阻挡膜30通过加热聚苯并恶唑获得。 版权所有（C）2006，JPO＆NCIPI