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公开(公告)号:SG11201906423YA
公开(公告)日:2019-08-27
申请号:SG11201906423Y
申请日:2018-02-07
Applicant: KLA TENCOR CORP
Inventor: GRUNZWEIG TZAHI , GUTMAN NADAV , STANIUNAS CLAIRE E , MARCIANO TAL , SHUALL NIMROD
Abstract: r Controller 140 150 141 130 Focus Detector 03 1 -1 Polarizer Ring Aperture Field Stop 143 Analysis unit 100 — N o. 153 110 105 Camera 151 Spectrometer 127 127 123 128 124 > 7 136 137 135 Wafer I 103 FIG. 'IA 104 4 To imaging system (FIG. 1B) 1-1 00 (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 16 August 2018 (16.08.2018) WIP0 1 PCT ill~~~~~~~~ 0111111010VIIIOH olo DID mil mum ono iflo oimIE (10) International Publication Number WO 2018/148318 Al (51) International Patent Classification: H01L 21/02 (2006.01) HOlL 21/67 (2006.01) (21) International Application Number: PCT/US2018/017273 (22) International Filing Date: 07 February 2018 (07.02.2018) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/457,781 10 February 2017 (10.02.2017) US 62/591,088 27 November 2017 (27.11.2017) US (71) Applicant: KLA-TENCOR CORPORATION [US/US]; Legal Department, One Technology Drive, Milpitas, Cali- fornia 95035 (US). (72) Inventors: GRUNZWEIG, Tzahi; 203 NE 55th Avenue, Hillsboro, Oregon 97124 (US). GUTMAN, Nadav; 11 Dror Unit 12, 3091784 Zichron Ya'agov (IL). STANIU- NAS, Claire E.; 2461 Falls Street, Forest Grove, Ore- gon 97116 (US). MARCIANO, Tal; Yaar Odem 32/10, 2069200 Yokneam (IL). SHUALL, Nimrod; 10773 SW Heron Circle, Beaverton, Oregon 97007 (US). (74) Agent: MCANDREWS, Kevin et al.; KLA-TENCOR CORPORATION, Legal Department, One Technology Dri- ve, Milpitas, California 95035 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, (54) Title: IDENTIFYING PROCESS VARIATIONS DURING PRODUCT MANUFACTURE (57) : Systems and method are presented for identifying process variations during manufacture of products such as semicon- ductor wafers. At a predetermined stage during manufacture of a first products, images of an area of the first product are obtained using different values of at least one imaging parameter. The images are then analyzed to generate a first contrast signature for said first product indicating variations of contrast with said at least one imaging parameter. At the same predetermined stage during manufacture of a second product, images of an area of said second product are obtained corresponding to said area of said first product using different values of said at least one imaging parameter. The images are analyzed to generate a second contrast signature for said second product indicating variations of contrast with said at least one imaging parameter. The first and second contrast signatures are compared to identify whether a variation in process occurred between manufacture of said first and second products. [Continued on next page] WO 2018/148318 Al MIDEDIMOMOIDEIREEMOMOIOHIMMIOMMOIMEN MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3))
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公开(公告)号:DE112018000764T5
公开(公告)日:2019-12-19
申请号:DE112018000764
申请日:2018-02-07
Applicant: KLA TENCOR CORP
Inventor: GRUNZWEIG TZAHI , GUTMAN NADAV , STANIUNAS CLAIRE E , MARCIANO TAL , SHUALL NIMROD
Abstract: Es werden Systeme und Verfahren zum Identifizieren von Prozessvariationen während der Herstellung von Produkten, wie z.B. Halbleiterwafern, vorgestellt. In einem vorbestimmten Stadium während der Herstellung eines ersten Produkts werden Bilder eines Bereichs des ersten Produkts unter Verwendung unterschiedlicher Werte mindestens eines Bildgebungsparameters erhalten. Die Bilder werden dann analysiert, um eine erste Kontrastsignatur für das erste Produkt zu erzeugen, die Variationen des Kontrasts mit dem mindestens einen Bildgebungsparameter anzeigt. In dem gleichen vorbestimmten Stadium während der Herstellung eines zweiten Produkts werden Bilder eines Bereichs des zweiten Produkts erhalten, der dem Bereich des ersten Produkts entspricht, wobei unterschiedliche Werte des mindestens einen Bildgebungsparameters verwendet werden. Die Bilder werden analysiert, um eine zweite Kontrastsignatur für das zweite Produkt zu erzeugen. Die Variationen des Kontrasts werden mit dem mindestens einen Bildgebungsparameter angezeigt. Die erste und die zweite Kontrastsignatur werden verglichen, um festzustellen, ob zwischen der Herstellung des ersten und des zweiten Produkts eine Variation im Prozess aufgetreten ist.
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公开(公告)号:SG11201703585RA
公开(公告)日:2017-06-29
申请号:SG11201703585R
申请日:2015-11-24
Applicant: KLA TENCOR CORP
Inventor: MARCIANO TAL , BRINGOLTZ BARAK , GUREVICH EVGENI , ADAM IDO , LINDENFELD ZA'EV , ZHAO ZENG , FELER YOEL , KANDEL DANIEL , CARMEL NADAV , MANASSEN AMNON , AMIR NURIEL , KAMINSKY ODED , YAZIV TAL , ZAHARAN OFER , COOPER MOSHE , SULIMARSKI ROEE , LEVIANT TOM , SELLA NOGA , EFRATY BORIS , SALTOUN LILACH , HANDELMAN AMIR , ASHWAL ELTSAFON , BACHAR OHAD
IPC: H01L21/66
Abstract: Methods are provided for deriving a partially continuous dependency of metrology metric(s) on recipe parameter(s), analyzing the derived dependency, determining a metrology recipe according to the analysis, and conducting metrology measurement(s) according to the determined recipe. The dependency may be analyzed in form of a landscape such as a sensitivity landscape in which regions of low sensitivity and/or points or contours of low or zero inaccuracy are detected, analytically, numerically or experimentally, and used to configure parameters of measurement, hardware and targets to achieve high measurement accuracy. Process variation is analyzed in terms of its effects on the sensitivity landscape, and these effects are used to characterize the process variation further, to optimize the measurements and make the metrology both more robust to inaccuracy sources and more flexible with respect to different targets on the wafer and available measurement conditions.
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公开(公告)号:SG11201708135YA
公开(公告)日:2017-11-29
申请号:SG11201708135Y
申请日:2016-04-05
Applicant: KLA TENCOR CORP
Inventor: LEVY ADY , KANDEL DANIEL , ADEL MICHAEL E , POSLAVSKY LEONID , ROBINSON JOHN , MARCIANO TAL , BRINGOLTZ BARAK , GRUNZWEIG TZAHI , KLEIN DANA , ITZKOVICH TAL , CARMEL NADAV , AMIR NURIEL , RAMANATHAN VIDYA , CAMP JANAY , WAGNER MARK
Abstract: A metrology performance analysis system includes a metrology tool including one or more detectors and a controller communicatively coupled to the one or more detectors. The controller is configured to receive one or more metrology data sets associated with a metrology target from the metrology tool in which the one or more metrology data sets include one or more measured metrology metrics and the one or more measured metrology metrics indicate deviations from nominal values. The controller is further configured to determine relationships between the deviations from the nominal values and one or more selected semiconductor process variations, and determine one or more root causes of the deviations from the nominal values based on the relationships between values of the one or more metrology metrics and the one or more selected semiconductor process variations.
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