Abstract:
PURPOSE: An apparatus for generating plasma and a method thereof are provided to supply a small vacuum chamber using atmospheric pressure plasma by using metal tunneling of an electronic beam. CONSTITUTION: An apparatus for generating plasma includes a vacuum container(110) and an electron emission unit(120) generating electronics inside the vacuum container. The apparatus for generating plasma includes an acceleration part(130) accelerating an emitted electronics in the electron emission unit inside the vacuum container and a metal foil(140) tunneling accelerated electronics. The electronics tunneling the metal foil forms plasma outside the vacuum container. The vacuum container is able to be formed into metal or a dielectric.
Abstract:
PURPOSE: A single crystal manufacturing method, a single crystal manufacturing apparatus, and a single crystal are provided to be single crystallized while an original component is maintained by preventing a content of a sample from being escaped by partially or completely covering an amorphous or polycrystalline sample by using a graphene. CONSTITUTION: A graphene layer partially or completely covering an amorphous or polycrystalline sample is formed(S100). The amorphous or polycrystalline sample is floated in the air in a treatment container(S110). Provided is a nitrogen-containing gas decomposed by using plasma for the treatment container(S120). Energy is applied to the sample(S130). The sample is crystallized by getting heat(S140).
Abstract:
PURPOSE: A photoelectric device and a forming method thereof are provided to fundamentally eliminate deformity due to lattice mismatch by forming a thick GaN(Gallium nitride) layer on different kinds of substrates. CONSTITUTION: A first semiconductor layer(13) is formed on a substrate(12). A second semiconductor layer(15) is formed on a semiconductor layer. An active layer(14) is interposed between the first semiconductor layer and the second semiconductor layer. An active layer has a multiple quantum well structure. A first contact hole(18) exposes the first semiconductor layer. A first electrode(16) is arranged in a first contact hole.