Apparatus and system for cleaning substrate
    2.
    发明专利
    Apparatus and system for cleaning substrate 审中-公开
    用于清洁基板的装置和系统

    公开(公告)号:JP2007208247A

    公开(公告)日:2007-08-16

    申请号:JP2006353540

    申请日:2006-12-28

    CPC classification number: H01L21/67051 B08B3/003 B08B3/02

    Abstract: PROBLEM TO BE SOLVED: To provide a cleaning apparatus and a method thereof which can remove particulate contamination substance of a sufficiently small size, even if the substance has a shape of a high aspect ratio.
    SOLUTION: The apparatus for cleaning a substrate 116 is disclosed. The apparatus is provided with a first head unit 110 and a second head unit 112. The first head unit 110 is arranged proximate to the surface of the substrate and is provided with a first row of channels configured to supply a foam to the surface of the substrate. The second head unit 112 is arranged substantially adjacent to the first head unit and proximate to the surface of the substrate. The second head unit is provided with a second and a third row of channels. The second row of channels 112 is configured to supply a fluid to the surface of the substrate. The third row of channels 114 is configured to cause a vacuum to work on the surface of the substrate.
    COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题:即使该物质具有高纵横比的形状,也可提供能够去除足够小尺寸的微粒污染物质的清洁装置及其方法。 解决方案:公开了一种用于清洁衬底116的设备。 该设备设置有第一头单元110和第二头单元112.第一头单元110布置成靠近基底的表面,并且设置有第一排通道,其构造成将泡沫供应到 基质。 第二头单元112被布置成基本上与第一头单元相邻并且靠近衬底的表面。 第二头单元设置有第二和第三排通道。 第二排通道112构造成将流体供应到基板的表面。 第三排通道114构造成使真空在基板的表面上起作用。 版权所有(C)2007,JPO&INPIT

    APPARATUS AND SYSTEM FOR CLEANING A SUBSTRATE

    公开(公告)号:SG133543A1

    公开(公告)日:2007-07-30

    申请号:SG2006087423

    申请日:2006-12-15

    Applicant: LAM RES CORP

    Abstract: An apparatus for cleaning a substrate is disclosed. The apparatus having a first head unit and a second head unit. The first head unit is positioned proximate to the surface of the substrate and has a first row of channels defined within configured to supply a foam to the surface of the substrate. The second head unit is positioned substantially adjacent to the first head unit and proximate to the surface of the substrate. A second and a third row of channels are defined within the second head unit. The second row of channels is configured to supply a fluid to the surface of the substrate. The third row of channels is configured to apply a vacuum to the surface of the substrate.

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