MANUFACTURE OF MOS SILICON DEVICE

    公开(公告)号:JPH11260938A

    公开(公告)日:1999-09-24

    申请号:JP1568499

    申请日:1999-01-25

    Abstract: PROBLEM TO BE SOLVED: To produce a floating gate structure having a gate made of polysilicon and dielectric characteristics suitable particularly for a flash memory device, by changing dielectric material composing a gate structure and by setting the thickness of layer of a laminated structure in a predetermined range in manufacturing the floating gate structure. SOLUTION: A gate structure has a second dielectric layer 34 between a floating gate 32 made of polysilicon and a control gate 33 made of polysilicon. The second dielectric layer 34 has a laminated structure comprising a first SiO2 layer 35 having a thickness of 10 to 35 Å, a Ta2 O5 layer having a thickness of 30 to 100 Å, and a second SiO2 layer 37 having a thickness of 5 to 30 Å, and the thickness of second dielectric layer 34 is set in a range of 45 to 150 Å. This can produce a floating gate structure having a gate made of polysilicon and dielectric characteristics suitable for a flush memory device.

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