Abstract:
PROBLEM TO BE SOLVED: To form a semiconductor element for radiation reception such that protection against obstacle or error of a signal to be detected is further improved, and production does not need much cost technically. SOLUTION: The semiconductor substrate for radiation reception has a radiation-absorbing active-area 2, and receives electromagnetic radiation within a wavelength range between λ 1 and λ 2 , wherein λ 2 is larger than λ 1 . A filter layer 5 is provided between the active area 2 and a radiation-input coupling face 9. The active area 2 detects electromagnetic radiation having a shorter wavelength than λ 2 . A filter layer 5 absorbs electromagnetic radiation having a shorter wavelength than λ 1 , and transmits electromagnetic radiation having a longer wavelength than λ 1 . COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To make beam-generating and receiving elements spatially compact, and to perform mutual adjustments between the elements to be as proper as is possible. SOLUTION: The region to generate electromagnetic beams for the semiconductor component elements is configured, to have a different composition portion from that of the region for absorbing the electromagnetic beams. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
A light-emitting semiconductor element comprises multilayers (2) on a semiconductor with a pn junction (5a,5b) between two layers that is separated into light-emitting (7) and protective diode (8) sections by insulation (6), the protective section being larger. A second pn junction in this section connects to the p-layer in the light-emitting section.
Abstract:
A thin-film LED comprising a barrier layer (3), a first mirror layer (2) succeeding the barrier layer (3), a layer stack (5) succeeding the first mirror layer (2), and at least one contact structure (6) succeeding the layer stack (5). The layer stack (5) has at least one active layer (5a) which emits electromagnetic radiation. The contact structure (6) is arranged on a radiation exit area (4) and has a contact area (7). The first mirror layer (2) has, in a region lying opposite the contact area of the contact structure (6), a cutout which is larger than the contact area (7) of the contact structure (6). The efficiency of the thin-film LED is increased as a result.
Abstract:
The method involves carrying out mask exposure of a photoresist layer (4). Portions of the layer within areas between trenches (3) are removed for surmounting a residual portion of the photoresist layer to the trenches. A metallization is fabricated from an upper side of a semiconductor layer (20) on a substrate (1). The metallization is formed thinly so that residual portion lies freely on top and portions of metallization are separated according to the partition into semiconductor components by residual portion, which is removed. The semiconductor layer is a gallium nitride.
Abstract:
A semiconductor laser, contains at least one absorbing layer ( 8 ) in its laser resonator, said absorbing layer reducing the transmission T Res of the laser radiation ( 10 ) in the laser resonator for the purpose of decreasing the sensitivity of the semiconductor laser to disturbances created by radiation ( 9 ) fed back into the laser resonator. This reduces fluctuations in the output power due to fed-back radiation ( 9 ).
Abstract:
A light-emitting semiconductor element comprises multilayers (2) on a semiconductor with a pn junction (5a,5b) between two layers that is separated into light-emitting (7) and protective diode (8) sections by insulation (6), the protective section being larger. A second pn junction in this section connects to the p-layer in the light-emitting section.
Abstract:
A semiconductor laser, contains at least one absorbing layer ( 8 ) in its laser resonator, said absorbing layer reducing the transmission T Res of the laser radiation ( 10 ) in the laser resonator for the purpose of decreasing the sensitivity of the semiconductor laser to disturbances created by radiation ( 9 ) fed back into the laser resonator. This reduces fluctuations in the output power due to fed-back radiation ( 9 ).
Abstract:
A light-emitting semiconductor element comprises multilayers (2) on a semiconductor with a pn junction (5a,5b) between two layers that is separated into light-emitting (7) and protective diode (8) sections by insulation (6), the protective section being larger. A second pn junction in this section connects to the p-layer in the light-emitting section.