公开(公告)号：JP2009194389A

公开(公告)日：2009-08-27

申请号：JP2009032915

申请日：2009-02-16

Applicant: Osram Opto Semiconductors Gmbh ,  オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH

Inventor： DACHS JUERGEN ,  KUEHNELT MICHAEL ,  SCHULZ ROLAND ,  SCHWARZ THOMAS ,  UNOLD HEIKO ,  STEEGMUELLER ULRICH

IPC: H01S5/022

CPC classification number: H01S5/141 ,  H01S3/0815 ,  H01S3/109 ,  H01S5/005 ,  H01S5/02248 ,  H01S5/041 ,  H01S5/183 ,  H01S5/4056

Abstract: PROBLEM TO BE SOLVED: To provide an especially compact semiconductor laser module.
SOLUTION: The semiconductor laser module includes a module carrier with a fixing surface, a pumping device arranged on the fixing surface, a surface emission semiconductor laser arranged on the fixing surface, and a frequency converter arranged on the fixing surface, wherein the maximum fixing surface of the module carrier is 100 m
2 , the surface emission semiconductor laser includes a fixing block having an upper surface and a fixing surface, and at least one semiconductor laser chip arranged on the upper surface of the fixing block, the fixing surface of the fixing block extends substantially perpendicularly to the upper surface of the fixing block, and the surface emission semiconductor laser is fixed onto the fixing surface of the module carrier by the fixing surface of the module carrier.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供特别紧凑的半导体激光器模块。 解决方案：半导体激光器模块包括具有固定表面的模块载体，布置在固定表面上的泵送装置，布置在固定表面上的表面发射半导体激光器和布置在固定表面上的变频器，其中 模块载体的最大固定面为100微米，表面发射半导体激光器包括具有上表面和固定表面的固定块，以及至少一个半导体激光芯片，其布置在 固定块，固定块的固定表面基本上垂直于固定块的上表面延伸，并且表面发射半导体激光器通过模块载体的固定表面固定到模块载体的固定表面上。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2009194388A

公开(公告)日：2009-08-27

申请号：JP2009031414

申请日：2009-02-13

Applicant: Osram Opto Semiconductors Gmbh ,  オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH

Inventor： DACHS JUERGEN ,  ILLEK STEFAN ,  SCHULZ ROLAND ,  SCHWARZ THOMAS ,  SINGER FRANK ,  UNOLD HEIKO

IPC: H01S5/022

CPC classification number: H01S5/0201

Abstract: PROBLEM TO BE SOLVED: To manufacture exceptionally compact semiconductor lasers in high-volume. SOLUTION: A method of manufacturing a plurality of semiconductor lasers 100 includes (a) a step of preparing a supporting wafer 30, (b) a step of forming a complex 70 by fixing a plurality of semiconductor laser chips 4 to the surface 31 of the supporting wafer 30, and (c) a step of forming a plurality of semiconductor lasers 100 by dividing the complex 70. The semiconductor laser 100 has a fixing block 3 and at least one semiconductor laser chip 4. The fixing block 3 has a fixing surface 13, and the fixing surface 13 is extended substantially perpendicularly to the surface 12 of the fixing block 3. The semiconductor laser chip 4 is arranged on the fixing block 3, and the fixing surface 13 is formed when the complex 70 is divided. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：制造大容量的非常紧凑的半导体激光器。 解决方案：制造多个半导体激光器100的方法包括（a）制备支撑晶片30的步骤，（b）通过将多个半导体激光芯片4固定在表面上来形成复合体70的步骤 31，并且（c）通过分开复合体70形成多个半导体激光器100的步骤。半导体激光器100具有固定块3和至少一个半导体激光芯片4.固定块3具有 固定表面13和固定表面13基本上垂直于固定块3的表面12延伸。半导体激光芯片4设置在固定块3上，并且当复合体70被分割时形成固定表面13 。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：DE102008009108A1

公开(公告)日：2009-08-20

申请号：DE102008009108

申请日：2008-02-14

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： DACHS JUERGEN ,  ILLEK STEFAN ,  SINGER FRANK ,  SCHWARZ THOMAS ,  SCHULZ ROLAND ,  UNOLD HEIKO

IPC: H01S5/02 ,  H01S5/022

Abstract: The method involves preparing a supporting disk made of ceramic material, and producing wafer interconnections (40) by a set of semiconductor laser chips (4) on an upper surface of the supporting disk. The interconnections are isolated by a set of semiconductor lasers (100) that includes a mounting block (3) with a mounting surface, which runs perpendicular to an upper surface (12) of the mounting block. One of the chips is arranged on the upper surface of the mounting block, where the mounting surface is manufactured during the isolation of the interconnections. An independent claim is also included for a semiconductor laser comprising a mounting block.

公开(公告)号：DE102008009110A1

公开(公告)日：2009-08-20

申请号：DE102008009110

申请日：2008-02-14

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： SCHWARZ THOMAS ,  SCHULZ ROLAND ,  UNOLD HEIKO ,  STEEGMUELLER ULRICH ,  KUEHNELT MICHAEL ,  DACHS JUERGEN

IPC: H01S5/18

Abstract: The semiconductor laser module has a module carrier (20) with a mounting surface (21), a pumping device (1) arranged on the mounting surface, and a surface-emitting diode laser, which is also arranged on the mounting surface. A frequency converting device (6) is arranged on the mounting surface. The mounting surface of the module carrier has an area of 100 millimeter. The surface-emitting diode laser is fixed with a mounting surface of a mounting block (3) on the mounting surface of the module carrier.