Method of manufacturing semiconductor laser, and semiconductor laser
    3.
    发明专利
    Method of manufacturing semiconductor laser, and semiconductor laser 有权
    制造半导体激光的方法和半导体激光器

    公开(公告)号:JP2009194388A

    公开(公告)日:2009-08-27

    申请号:JP2009031414

    申请日:2009-02-13

    CPC classification number: H01S5/0201

    Abstract: PROBLEM TO BE SOLVED: To manufacture exceptionally compact semiconductor lasers in high-volume. SOLUTION: A method of manufacturing a plurality of semiconductor lasers 100 includes (a) a step of preparing a supporting wafer 30, (b) a step of forming a complex 70 by fixing a plurality of semiconductor laser chips 4 to the surface 31 of the supporting wafer 30, and (c) a step of forming a plurality of semiconductor lasers 100 by dividing the complex 70. The semiconductor laser 100 has a fixing block 3 and at least one semiconductor laser chip 4. The fixing block 3 has a fixing surface 13, and the fixing surface 13 is extended substantially perpendicularly to the surface 12 of the fixing block 3. The semiconductor laser chip 4 is arranged on the fixing block 3, and the fixing surface 13 is formed when the complex 70 is divided. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题:制造大容量的非常紧凑的半导体激光器。 解决方案:制造多个半导体激光器100的方法包括(a)制备支撑晶片30的步骤,(b)通过将多个半导体激光芯片4固定在表面上来形成复合体70的步骤 31,并且(c)通过分开复合体70形成多个半导体激光器100的步骤。半导体激光器100具有固定块3和至少一个半导体激光芯片4.固定块3具有 固定表面13和固定表面13基本上垂直于固定块3的表面12延伸。半导体激光芯片4设置在固定块3上,并且当复合体70被分割时形成固定表面13 。 版权所有(C)2009,JPO&INPIT

    HEADLIGHT DEVICE
    6.
    发明申请
    HEADLIGHT DEVICE 审中-公开
    照明灯装置,

    公开(公告)号:WO2014095906A3

    公开(公告)日:2014-08-14

    申请号:PCT/EP2013076957

    申请日:2013-12-17

    Abstract: The invention relates to a headlight device (1) comprising: a laser light source (2) for emitting collimated primary radiation (3); a conversion element (4) having conversion regions (5) which are provided for at least partly converting the collimated primary radiation (3) into secondary radiation (6) and form luminous regions during operation, and separating webs (7) which separate the conversion regions (5) from one another and are opaque to the primary radiation (3) and secondary radiation (6); and a deflection unit (8), which is provided for directing the collimated primary radiation (3) coming from the laser light source (2) during operation onto the conversion element (4) and for guiding it as the scanning beam (9) over partial regions of the conversion element (4).

    Abstract translation: 它是一种前照灯装置(1)中指定的,包括:一个激光光源(2),用于发射准直的初级辐射(3),(4),其包括转换区域的转换元件(5),用于在所述二次辐射的准直的初级辐射(3)的至少部分转化(6 )被提供,以形成操作的发光区域,和分隔片(7),该分离转换区域(5)彼此,和(对于初级辐射3)和次级辐射(6)是不透明的,一个偏转装置(8),其被提供给 从在操作中,激光光源引导(2)来准直的初级辐射用于引导(3)的转换元件(4)上,并作为扫描光束(9)在所述转换元件的部分区域(4)。

    LIGHT-EMITTING DIODE ASSEMBLY AND METHOD FOR PRODUCING A LIGHT-EMITTING DIODE ASSEMBLY
    7.
    发明申请
    LIGHT-EMITTING DIODE ASSEMBLY AND METHOD FOR PRODUCING A LIGHT-EMITTING DIODE ASSEMBLY 审中-公开
    LUMINESZENZDIODENANORDNUNG及其制造方法LUMINESZENZDIODENANORDNUNG

    公开(公告)号:WO2016170151A3

    公开(公告)日:2016-12-15

    申请号:PCT/EP2016059073

    申请日:2016-04-22

    Abstract: The invention relates to a light-emitting diode assembly (1) having: at least one first light-emitting diode chip (2) with a first radiation output surface (3), the chip being designed to emit radiation via the radiation output surface (3); and at least one hybrid polymer (4) positioned in the beam path of the first light-emitting diode chip (2), the hybrid polymer (4) having organic and inorganic regions covalently bonded to one another and said hybrid polymer (4) being thermally- and/or radiation cross-linked. The first radiation output surface (3) and the hybrid polymer (4) are in direct mechanical contact.

    Abstract translation: 本发明涉及一种Lumineszenzdiodenanordnung(1),包括至少一个第一LED芯片(2),具有第一辐射出射表面(3),其被布置在所述辐射出射表面(3)上对辐射的发射,至少一个杂化聚合物(4),在第一的光束路径 LED芯片(2)布置,所述混合聚合物(4),其共价连接在一起的有机和无机的区域,所述混合聚合物(4)是热和/或通过辐射交联,所述第一辐射出射表面(3)和所述的杂化聚合物 (4)在直接机械接触。

Patent Agency Ranking