公开(公告)号：JP2007103935A

公开(公告)日：2007-04-19

申请号：JP2006267780

申请日：2006-09-29

Applicant: Osram Opto Semiconductors Gmbh ,  オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH

Inventor： WINTER MATTHIAS ,  JAEGER HARALD

IPC: B22F3/02 ,  H01L33/48 ,  H01L33/62 ,  H01L33/64

CPC classification number: B22F3/225 ,  B22F7/062 ,  B22F2998/00 ,  H01L33/486 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01068 ,  H01L2924/12044 ,  B22F3/1021 ,  H01L2924/00014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a method suitable for easily manufacturing a support for a light emitting constituent element, and a light emitting constituent element having the support that can be manufactured easily as much as possible. SOLUTION: A support (2) is manufactured by injection molding method from a molding material (34) including metal. Further, a light emitting constituent element (1) has a casing (3) and the support (2), and this support (2) includes an injection-molded metal. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供一种适合容易地制造发光构成元件的支撑体的方法，以及具有可以容易地制造的具有支撑体的发光构成元件。 解决方案：通过注射成型方法从包括金属的成型材料（34）制造支撑体（2）。 此外，发光构成元件（1）具有壳体（3）和支撑体（2），该支撑体（2）包括注射成型金属。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2004260178A

公开(公告)日：2004-09-16

申请号：JP2004046959

申请日：2004-02-23

Applicant: Osram Opto Semiconductors Gmbh ,  オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH

Inventor： STEIN WILHELM ,  FEHRER MICHAEL ,  BAUR JOHANNES ,  WINTER MATTHIAS ,  PLOESSL ANDREAS ,  KAISER STEPHAN ,  HAHN BERTHOLD ,  EBERHARD FRANZ

IPC: H01L33/32 ,  H01L33/40 ,  H01L33/00

CPC classification number: H01L33/40 ,  H01L33/32

Abstract: PROBLEM TO BE SOLVED: To provide an enhanced electric contact in a high reflection factor, excellent ohmic contact to a semiconductor, each other's excellent adhesion between layers which form excellent adhesion and contact on the semiconductor, good thermal stability, high stability to the environmental-impact factor, and soldering possibility and structuring possibility. SOLUTION: This electric contact of the photoelectron semiconductor chip 1 comprises a mirror layer 2 made of metal or metal alloy, a protective layer 3 for reducing the corrosion of the mirror layer 2, a barrier layer 4, an adhesion intermediate layer 5, and a solder layer 8. COPYRIGHT: (C)2004,JPO&NCIPI

公开(公告)号：JP2005109506A

公开(公告)日：2005-04-21

申请号：JP2004288291

申请日：2004-09-30

Applicant: Osram Opto Semiconductors Gmbh ,  オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH

Inventor： WINTER MATTHIAS ,  BOGNER GEORG DIPL PHYS ,  GRUBER STEFAN

IPC: H01L21/60 ,  H01L29/08 ,  H01L33/62 ,  H01S5/02 ,  H01L33/00

CPC classification number: H01S5/02272 ,  H01L24/32 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/83001 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01S5/0213 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a photoelectric element by a thin film technique and/or a flip-chip technology, having high reliability, and improved in the metallization of a support body, in particular.
SOLUTION: In a photoelectric element, having a semiconductor base material including a substrate and a layer system deposited on the substrate, the semiconductor base material, is fixed on the support body by a soldered connection part, with a main surface opposed to the substrate, and in a form of a support body having a metallization part on a surface facing toward the semiconductor base material, a metallization part does not contain silver.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：特别是通过薄膜技术和/或倒装芯片技术提供光电元件，具有高可靠性和改进的支撑体的金属化。 解决方案：在具有包括基板和沉积在基板上的层系统的半导体基材的光电元件中，半导体基材通过焊接连接部固定在支撑体上，主表面与 基板，并且在面向半导体基材的表面上具有金属化部分的支撑体的形式，金属化部分不含银。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：WO2004051757A3

公开(公告)日：2004-12-23

申请号：PCT/DE0303923

申请日：2003-11-27

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  ARNDT KARLHEINZ ,  BOGNER GEORG ,  WAITL GUENTER ,  WINTER MATTHIAS

Inventor： ARNDT KARLHEINZ ,  BOGNER GEORG ,  WAITL GUENTER ,  WINTER MATTHIAS

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/00 ,  H01L31/0203

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00

Abstract: The invention relates to an optoelectronic component containing an optoelectronic chip (1), a chip carrier (2) with a central region (3), on which the chip is fixed and terminals (41, 42, 43, 44), which run from the central region of the chip carrier (2) to the exterior of said chip. The chip and sections of the chip carrier are surrounded by a body (5). The respective projection of the body, in addition to that of the longitudinal axes of the terminals on the contact plane between the chip and the chip carrier are essentially point-symmetrical in relation to the central point of the chip. The invention also relates to an assembly comprising said component. The advantage of the symmetrical configuration of the component is that the risk of thermomechanically induced malfunctions of the components is reduced.

Abstract translation: 本发明涉及一种包括光电芯片（1），一个芯片载体的光电元件（2），其具有一个中心区域（3），在其上的芯片被固定，并用连接件（41，42，43，44）从中心区 点对称-从向外的芯片载体（2），其中由主体（5）的芯片和芯片载体的部分是有包膜的延伸，并且其中所述主体的所述突起和在芯片和芯片载体之间的接触面的连接器的纵向轴线各自基本上 到芯片的中心。 此外，本发明涉及具有该部件的布置。 由于设备的对称设计，这具有减小设备的热机械故障的风险的优点。

公开(公告)号：WO2004032249A2

公开(公告)日：2004-04-15

申请号：PCT/DE0303240

申请日：2003-09-29

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  SIEMENS AG ,  BOGNER GEORG ,  KROMOTIS PATRICK ,  MAYER RALF ,  NOLL HEINRICH ,  WINTER MATTHIAS

Inventor： BOGNER GEORG ,  KROMOTIS PATRICK ,  MAYER RALF ,  NOLL HEINRICH ,  WINTER MATTHIAS

IPC: H01L33/48 ,  H01L33/64 ,  H01L33/00 ,  H01L31/0203

CPC classification number: H01L33/64 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to an optoelectronic component (1) comprising a semiconducting assembly (4) which emits and receives electromagnetic radiation and is arranged on a support (22) connecting a thermocunductor to a heat sink (12). The inventive optoelectronic component also comprises external electrical connections (9) which are connected to the semiconducting assembly (4) and disposed in an electrically insulated manner on the heat sink (12) at a distance from the support (22). Said invention makes it possible to produce an optimised component for evacuating waste heat and light emission and providing an electrical contact and components density in modules.

Abstract translation: 提出了具有光电子器件（1）的电磁辐射发射和/或在载体上的接收半导体装置（4）（22）被布置，所述Kühlkör每次是导热地连接到一个连接（12），和外部电 布置与半导体器件（4）连接的端子（9），其中外部电连接（9）在与载体（22）隔开的散热器（12）上电隔离。 这导致了关于损耗散热和光发射以及模块中的电接触和封装密度的优化组件。

公开(公告)号：DE102017108362A1

公开(公告)日：2018-10-25

申请号：DE102017108362

申请日：2017-04-20

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： PERÄLÄ MIKKO ,  WINTER MATTHIAS ,  STRASSBURG MARTIN

IPC: H01L25/16 ,  H01L31/12

Abstract: Das optoelektronische Bauelement weist Leuchtdiodenchips auf, die auf einer Oberfläche angeordnet sind. Die Leuchtdiodenchips sind voneinander beabstandet. Der nicht von den Leuchtdiodenchips abgedeckte Teil der Oberfläche weist Solarzellen auf. Dabei können Solarzellenchips zwischen den Leuchtdiodenchips auf der Oberfläche angeordnet sein. Alternativ können die Leuchtdiodenchips auf der Oberfläche eines Solarmoduls angeordnet sein.

公开(公告)号：DE102006060408A1

公开(公告)日：2008-06-26

申请号：DE102006060408

申请日：2006-12-20

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： SORG JOERG ERICH ,  WINTER MATTHIAS

IPC: G02B1/10 ,  B32B15/00 ,  G02B5/08 ,  H01L33/46

Abstract: The method involves providing metal layers (3,4). The metal of metal layer (3) has high resistance against the chemical action or corrosion than the metal of another layer (4) , and coming from an initial state, by increasing temperature, atoms of the former metal layer (3) are brought into latter metal layer (4) so that the free upper side has a high resistance against the chemical action or corrosion than in the initial state.

公开(公告)号：DE50307780D1

公开(公告)日：2007-09-06

申请号：DE50307780

申请日：2003-09-29

Applicant: SIEMENS AG ,  OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： BOGNER GEORG ,  KROMOTIS PATRICK ,  MAYER RALF ,  NOLL HEINRICH ,  WINTER MATTHIAS

IPC: H01L31/0203 ,  H01L33/48 ,  H01L33/64

公开(公告)号：DE10347737A1

公开(公告)日：2005-05-04

申请号：DE10347737

申请日：2003-10-14

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： WINTER MATTHIAS ,  GRUBER STEFAN ,  BOGNER GEORG

IPC: H01L33/62 ,  H01S5/02 ,  H01S5/323 ,  H01L33/00

Abstract: Optoelectronic structural element with a semiconductor body (SCB) (1), including a substrate (2) and a layer system (3) deposited on the substrate, where the SCB is fixed to a carrier (4) with the main surface opposite the substrate by a solder bond (7) and the carrier (4) is metallized with silver-free metal on the side opposite the SCB.

公开(公告)号：DE10319782A1

公开(公告)日：2004-11-25

申请号：DE10319782

申请日：2003-04-30

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： WINTER MATTHIAS ,  GRUBER STEFAN ,  SCHMID JOSEF ,  BOGNER GEORG

IPC: H01L23/13 ,  H01L23/498 ,  H01L33/62 ,  H01S5/022 ,  H01L23/04

Abstract: A chip carrier element (1) with a chip mounting surface (2) comprises a recessed region (3) adjacent to the surface to receive the chip fixing unit. An independent claim is also included for a component housing with a chip carrier element as above.