公开(公告)号：JP2005109506A

公开(公告)日：2005-04-21

申请号：JP2004288291

申请日：2004-09-30

Applicant: Osram Opto Semiconductors Gmbh ,  オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH

Inventor： WINTER MATTHIAS ,  BOGNER GEORG DIPL PHYS ,  GRUBER STEFAN

IPC: H01L21/60 ,  H01L29/08 ,  H01L33/62 ,  H01S5/02 ,  H01L33/00

CPC classification number: H01S5/02272 ,  H01L24/32 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/83001 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01S5/0213 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a photoelectric element by a thin film technique and/or a flip-chip technology, having high reliability, and improved in the metallization of a support body, in particular.
SOLUTION: In a photoelectric element, having a semiconductor base material including a substrate and a layer system deposited on the substrate, the semiconductor base material, is fixed on the support body by a soldered connection part, with a main surface opposed to the substrate, and in a form of a support body having a metallization part on a surface facing toward the semiconductor base material, a metallization part does not contain silver.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：特别是通过薄膜技术和/或倒装芯片技术提供光电元件，具有高可靠性和改进的支撑体的金属化。 解决方案：在具有包括基板和沉积在基板上的层系统的半导体基材的光电元件中，半导体基材通过焊接连接部固定在支撑体上，主表面与 基板，并且在面向半导体基材的表面上具有金属化部分的支撑体的形式，金属化部分不含银。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：WO2014079939A2

公开(公告)日：2014-05-30

申请号：PCT/EP2013074400

申请日：2013-11-21

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： GRÖTSCH STEFAN ,  KIESSLING MATTHIAS ,  WITTMANN MICHAEL ,  GRUBER STEFAN

CPC classification number: H01L27/15 ,  H05B33/0803 ,  H05B33/0815 ,  H05B33/083

Abstract: An optoelectronic semiconductor component comprises a first functional region (1) having an active zone provided for generating radiation or for receiving radiation, and a second functional region (2), which is suitable for contributing to the driving of the first functional region (1), wherein the first functional region (1) and the second functional region (2) are integrated on the same carrier substrate (3).

Abstract translation: 的光电子半导体器件，包括用活性区，其被设置用于生成辐射或辐射接收和第二功能区域（3），其是适用于驱动所述第一功能区域（1）有助于，其中，所述第一功能区域（第一功能区域（1） 1）和第二功能区域（2）集成在同一载体衬底（3）上。

公开(公告)号：WO02052615A3

公开(公告)日：2002-12-19

申请号：PCT/DE0104880

申请日：2001-12-21

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  BRAUNE BERT ,  GRUBER STEFAN ,  WAITL GUENTER ,  ZEHNDER ULRICH

Inventor： BRAUNE BERT ,  GRUBER STEFAN ,  WAITL GUENTER ,  ZEHNDER ULRICH

IPC: H01L33/48 ,  H01L33/50 ,  H01L33/00

CPC classification number: H01L33/507 ,  H01L24/32 ,  H01L33/405 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: The invention relates to a radiation-emitting semiconductor component with a luminescence conversion element (8). A reflector (7) is connected downstream of a semiconductor body (3), this reflector being coated with a luminescence conversion element (8) or containing a luminescence conversion element (8). Said luminescence conversion element (8) converts part of the radiation (6) that is emitted by the semiconductor body during operation in a first wavelength range into radiation (9) in a second wavelength range. The semiconductor body (3) and the luminescence conversion element (8) are preferably tuned to each other in such a way that mixed-colour white light is emitted.

Abstract translation: 本发明涉及一种具有发射辐射的半导体元件的发光转换元件（8）。 在这种情况下，反射器（7）的半导体主体（3），其下游设置涂有发光转换元件（8）或包含发光转换元件（8）。 发光转换元件（8）转换的操作中的半导体主体（3）的生成（6）在第一波长范围中的第二波长范围左右（9）的一部分辐射转换成辐射。 优选地，半导体主体（3）和发光转换元件（8）匹配，使得混合色的白色发光。

公开(公告)号：WO2008040315A3

公开(公告)日：2008-11-20

申请号：PCT/DE2007001733

申请日：2007-09-25

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  SORG JOERG ERICH ,  GRUBER STEFAN ,  HERRMANN SIEGFRIED ,  HAHN BERTHOLD

Inventor： SORG JOERG ERICH ,  GRUBER STEFAN ,  HERRMANN SIEGFRIED ,  HAHN BERTHOLD

IPC: H01L25/075 ,  H01L33/00 ,  H01L33/50 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L24/24 ,  H01L24/82 ,  H01L33/0079 ,  H01L33/508 ,  H01L33/62 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/48091 ,  H01L2224/76155 ,  H01L2224/82039 ,  H01L2224/82102 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to a light-emitting diode arrangement comprising a plurality of semiconductor chips which are provided for emitting electromagnetic radiation from their front side (101) and which are fixed by their rear side (102) - opposite the front side - on a first main area (201) of a common carrier (2), wherein the semiconductor chips are composed of a respective substrateless semiconductor layer stack (1) and are fixed to the common carrier body without an auxiliary carrier, and to a method for producing such a light-emitting diode arrangement.

Abstract translation: 本发明涉及一种具有多个半导体芯片，其被设置成从电磁辐射的其前侧（101），用于发出光的发光二极管阵列，将其相反它们在共同的支撑体的第一主表面（201）正面背面（102）（2 ）被安装，其中，所述半导体芯片（一个衬底的半导体层堆叠体1）和被固定到共同的支撑体无副载波，以及用于制造这样的发光二极管装置的方法。

公开(公告)号：WO0150553A3

公开(公告)日：2002-11-28

申请号：PCT/DE0004592

申请日：2000-12-22

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  GRUBER STEFAN ,  HEERLEIN JOERG ,  UNGER PETER

Inventor： GRUBER STEFAN ,  HEERLEIN JOERG ,  UNGER PETER

IPC: H01S5/20 ,  H01S5/22 ,  H01S5/223 ,  H01S5/227

CPC classification number: H01S5/227 ,  H01S5/0655 ,  H01S5/2063 ,  H01S5/2205 ,  H01S5/2215 ,  H01S5/2218 ,  H01S5/2219 ,  H01S5/2231

Abstract: The invention concerns a stripe laser diode element exhibiting longitudinal direction of propagation in the main direction of propagation of a laser light and having contacts in longitudinal direction of propagation on one surface with the purpose of impressing a current on the element. The surface in defined by edges crosswise to the longitudinal direction. An absorption region is formed in the area of said edges.

Abstract translation: 它是提供一种条形激光二极管元件，其包括在激光光传播的纵向方向的主传播方向，并且为了在元件打动的电流具有触点的传播的纵向方向的表面上。 表面横向界定于由边缘的长度方向，形成在区域中的吸收区。

公开(公告)号：DE102019100491A1

公开(公告)日：2020-06-18

申请号：DE102019100491

申请日：2019-01-10

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： WIRTH RALPH ,  DIENER CLAUS ,  GROLIER VINCENT ,  KNITTL PETER ,  HARTMANN STEPHAN ,  GRUBER STEFAN ,  FREI ULRICH

IPC: B60Q1/00

Abstract: Es wird unter anderem angegeben ein Beleuchtungssystem (1) mit- mehreren einzeln ansteuerbaren Lichtquellen (2) oder einzeln ansteuerbaren Gruppen von Lichtquellen (2),- mindestens einer Ansteuereinheit (3) zum Ansteuern der Lichtquellen (2),- einer Freigabeeinheit (4), und- mindestens einer Speichereinheit (51), wobei die Freigabeeinheit (4) dazu eingerichtet ist, bestimmte Lichtfunktionen oder Ansteuermodi für die Lichtquellen (2) erst nach Eingabe eines Freigabecodes freizugeben.

公开(公告)号：DE102008025756A1

公开(公告)日：2009-12-03

申请号：DE102008025756

申请日：2008-05-29

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： WINDISCH REINER ,  ZEILER THOMAS ,  GRUBER STEFAN ,  KIRSCH MARKUS ,  MUSCHAWECK JULIUS ,  BAADE TORSTEN ,  BRUNNER HERBERT ,  KOEHLER STEFFEN

IPC: H01L31/0203 ,  H01L33/38 ,  H01L33/50 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01S5/02

Abstract: According to at least one embodiment of the semiconductor arrangement, the latter comprises a mounting side, at least one optoelectronic semiconductor chip with mutually opposing chip top and bottom, and at least one at least partially radiation-transmissive body with a body bottom, on which the semiconductor chip is mounted such that the chip top faces the body bottom. Moreover, the semiconductor arrangement comprises at least two electrical connection points for electrical contacting of the optoelectronic semiconductor chip, wherein the connection points do not project laterally beyond the body and with their side remote from the semiconductor chip delimit the semiconductor arrangement on the mounting side thereof.

公开(公告)号：DE10220583A1

公开(公告)日：2003-10-23

申请号：DE10220583

申请日：2002-05-08

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： SORG JOERG ,  ARNDT KARLHEINZ ,  GRUBER STEFAN ,  HOEHN KLAUS

IPC: H01L31/0232 ,  H01L33/44 ,  H01L33/56 ,  H01L33/58 ,  H01L33/00

Abstract: The optoelectronic component comprises a transparent sender and/or receiver encapsulating element (3) which is provided with a transparent cover layer (4) whose refraction index lies between the refraction indices of the surrounding medium (6) and the encapsulating element.

公开(公告)号：WO2008106915A3

公开(公告)日：2009-01-22

申请号：PCT/DE2008000124

申请日：2008-01-23

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  HERRMANN SIEGFRIED ,  HAHN BERTHOLD ,  SORG JOERG ,  GRUBER STEFAN

Inventor： HERRMANN SIEGFRIED ,  HAHN BERTHOLD ,  SORG JOERG ,  GRUBER STEFAN

IPC: G02B6/00 ,  F21V8/00

CPC classification number: G02B6/0055 ,  G02B6/0018 ,  G02B6/0051 ,  G02B6/0073 ,  G02B6/0076

Abstract: The invention relates to an arrangement comprising a semiconductor chip (1) which is designed to emit light during operation as well as a cover layer (2) that lies across from a light-emitting surface of the semiconductor chip (1) such that light emitted by the semiconductor chip (1) penetrates into the cover layer (2). According to the invention, said arrangement is characterized in that a light-deflecting structure is provided in an area of the cover layer (2) that overlaps the chip (1). Said light-deflecting structure deflects the light that penetrates into the cover layer (2) in the direction of the longitudinal extension of the cover layer (2). Furthermore, the coating (2) acts as an optical waveguide and is designed to emit the light in a distributed manner across the top surface of the cover layer (2).

Abstract translation: 本发明涉及一种与适于工作时发射光的半导体芯片（1）的布置，和覆盖（2），其上，使得（1）的半导体芯片是半导体芯片（1）的发光面 发射的光渗透到覆盖层（2）。 根据本发明的装置其特征在于在所涉及的重叠与芯片覆盖层（1）的领域（2）偏转结构提供了一种光，通过该覆盖层（2）在所述覆盖层的纵向延伸的方向上已经穿透光（2） 被偏转和覆盖层（2）用作一个导光体和被配置为使得光被分布在所述覆盖层（2）到辐射的上侧。

公开(公告)号：WO2008083672A3

公开(公告)日：2008-12-18

申请号：PCT/DE2008000029

申请日：2008-01-09

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  BOGNER GEORG ,  GRUBER STEFAN ,  ZEILER THOMAS ,  KIRSCH MARKUS

Inventor： BOGNER GEORG ,  GRUBER STEFAN ,  ZEILER THOMAS ,  KIRSCH MARKUS

IPC: H01L25/16 ,  H01L33/48 ,  H01L33/60

CPC classification number: H01L33/483 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A plastic housing (2) is disposed on a support element (1) and comprises a recess (3) in which an optoelectronic component (12) is arranged. The recess (3) has an opening to the exterior (9) on the side facing away from the support element (1), which can be provided with a transparent cover. One or several structures (5, 6) can be provided at the plastic housing (2) in order to align the cover and/or the optical components relative to the optoelectronic component.

Abstract translation: 塑料外壳（2）布置在承载元件（1）上，并且设置有凹部（3），在该光电器件（12）布置。 在载体元件的从所述凹部（3）背向（1）侧具有到外部，其可以设置有透明盖的开口（9）。 一个或多个结构（5,6）可被设置在塑料外壳（2）上以对准相对于所述光电子器件的覆盖物和/或光学部件。