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公开(公告)号：WO2004109813A3
公开(公告)日：2005-04-21
申请号：PCT/DE2004000829
申请日：2004-04-21
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH , BOGNER GEORG , BRAUNE BERT , SCHMID JOSEF
Inventor： BOGNER GEORG , BRAUNE BERT , SCHMID JOSEF
CPC classification number: H01L33/56 , H01L33/58 , H01L33/641 , H01L2224/48091 , H01L2924/00014
Abstract: The invention relates to a light-emitting diode which comprises, embedded in a casting compound (3) and fastened on a support (1), a radiation-emitting semiconductor chip (4) and a lens body (2), whereby the support (1) contains silicon or a ceramic material and the lens body (2) contains a glass. The casting compound (3) is preferably enclosed by the support (1) and the lens body (2) and preferably does not contain any ultraviolet radiation-sensitive polymers.
Abstract translation: 一种发光二极管包括：在一个密封的化合物（3）嵌入在承载体（1）固定于发射辐射的半导体芯片（4），和一个透镜体（2），其中，所述承载体（1）的硅或陶瓷和透镜体（2）是玻璃 包含的内容。 密封化合物（3）优选地通过在支撑体（1）和所述透镜体（2）封闭，并且有利地不包含聚合物，其是对紫外辐射敏感。
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公开(公告)号：DE10214208B4
公开(公告)日：2006-07-13
申请号：DE10214208
申请日：2002-03-28
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： BRUNNER HERBERT , JAEGER HARALD , SCHMID JOSEF
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公开(公告)号：DE102004031391A1
公开(公告)日：2006-01-26
申请号：DE102004031391
申请日：2004-06-29
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： HIEGLER MICHAEL , SCHMID JOSEF , ENGL MORITZ , GROETSCH STEFAN , ARNDT KARLHEINZ , SCHNEIDER MARKUS , BOGNER GEORG
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公开(公告)号：DE10319782A1
公开(公告)日：2004-11-25
申请号：DE10319782
申请日：2003-04-30
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： WINTER MATTHIAS , GRUBER STEFAN , SCHMID JOSEF , BOGNER GEORG
IPC: H01L23/13 , H01L23/498 , H01L33/62 , H01S5/022 , H01L23/04
Abstract: A chip carrier element (1) with a chip mounting surface (2) comprises a recessed region (3) adjacent to the surface to receive the chip fixing unit. An independent claim is also included for a component housing with a chip carrier element as above.
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公开(公告)号：DE102004031391B4
公开(公告)日：2009-06-04
申请号：DE102004031391
申请日：2004-06-29
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： HIEGLER MICHAEL , SCHMID JOSEF , ENGL MORITZ , GROETSCH STEFAN , ARNDT KARLHEINZ , SCHNEIDER MARKUS , BOGNER GEORG
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Patent Agency Ranking
公开(公告)号：DE102004064150B4
公开(公告)日：2010-04-29
申请号：DE102004064150
申请日：2004-06-29
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： ARNDT KARLHEINZ , HIEGLER MICHAEL , GROETSCH STEFAN , ENGL MORITZ , SCHNEIDER MARKUS , SCHMID JOSEF , BOGNER GEORG
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公开(公告)号：DE10319782B4
公开(公告)日：2009-01-02
申请号：DE10319782
申请日：2003-04-30
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： WINTER MATTHIAS , GRUBER STEFAN , SCHMID JOSEF , BOGNER GEORG
IPC: H01L23/13 , H01L23/04 , H01L23/495 , H01L23/498 , H01L33/62 , H01S5/022
Abstract: A chip carrier element (1) with a chip mounting surface (2) comprises a recessed region (3) adjacent to the surface to receive the chip fixing unit. An independent claim is also included for a component housing with a chip carrier element as above.
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公开(公告)号：DE10329081A1
公开(公告)日：2004-12-30
申请号：DE10329081
申请日：2003-06-27
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： BRAUNE BERT , SCHMID JOSEF , BOGNER GEORG
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公开(公告)号：DE10131698A1
公开(公告)日：2003-01-30
申请号：DE10131698
申请日：2001-06-29
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： BRUNNER HERBERT , HOEHN KLAUS , JAEGER HARALD , SCHMID JOSEF
Abstract: A radiation-emitting surface-mountable component has a light-emitting diode chip mounted on a leadframe. A molding material encapsulates the leadframe and the light emitting diode chip.
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公开(公告)号：DE10214208B9
公开(公告)日：2006-12-28
申请号：DE10214208
申请日：2002-03-28
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： BRUNNER HERBERT , JAEGER HARALD , SCHMID JOSEF
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