公开(公告)号：WO2022174021A1

公开(公告)日：2022-08-18

申请号：PCT/US2022/016090

申请日：2022-02-11

Applicant: R&D CIRCUITS, INC.

Inventor： THOMPSON, Donald, Eric ,  SMITH, Thomas

IPC: H05K3/00

Abstract: The present invention provides a method for detecting failed back-drills in PCBs in the process of fabricating a PCB so that the failed back-drill can be screened out or repaired. The present invention accomplishes this by adding a short to ground connection for every back- drill via that will be cut when the back-drill removes the via stub. If the back-drill is bad or failed the short to ground will fail the subsequent electrical tests. The PCB can be repaired by re- drilling the hole or via. The present invention allows for detecting failed back-drills with easy detection in the manufacturing stage using standard equipment and test procedures. This process creates a simple pass-fail measurement that uses an existing common test process to catch failed back drills in the PCB fabrication facility. This allows for easy and cost- effective repair and guarantees back-drill failures do not pass into the field.

公开(公告)号：WO2015168370A1

公开(公告)日：2015-11-05

申请号：PCT/US2015/028453

申请日：2015-04-30

Applicant: R&D CIRCUITS, INC

Inventor： TURPUSEEMA, Dhanonjaya ,  WARWICK, Thomas, P. ,  SMITH, Thomas ,  RUSSELL, James, V.

IPC: H05K3/30 ,  H05K3/46 ,  H05K3/40 ,  G06K19/077 ,  H05K1/18

CPC classification number: H05K1/188 ,  H05K1/144 ,  H05K1/183 ,  H05K1/186 ,  H05K3/0026 ,  H05K3/0094 ,  H05K3/321 ,  H05K3/366 ,  H05K3/4655 ,  H05K3/4679 ,  H05K2201/032 ,  H05K2201/0355 ,  H05K2201/042 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09545 ,  H05K2201/09572 ,  H05K2203/0485 ,  H05K2203/063 ,  H05K2203/11 ,  Y10T29/49128 ,  Y10T29/4914

Abstract: A method and electrical interconnect structure internal to a printed circuit board for the purposes of creating a reliable, high performing connection method between embedded component terminals, signal traces and or power/ground planes which may occupy the same vertical space as the embedded components, such as a capacitor or resistor. Further easing the assembly and reliability through the manufacturing process of said embedded component structures. In one structure castellated drilled, plated vias connect the trace or plane within the printed circuit board to the electrical terminals of the embedded component using a permanent and highly conductive attach material. In another structure, the trace or plane connect by selective side-wall plating, which surrounds the electrical terminal of the component This structure also uses a permanent and highly conductive attach material to electrically connect the component terminal to the plated side-wall and in a final embodiment the terminals are connected through a conductive attach material through a via in the z axis to a conductive pad.

Abstract translation: 印刷电路板内部的方法和电互连结构，用于在嵌入式组件端子，信号迹线和/或电源/接地平面之间建立可靠的，高性能的连接方法，其可能占据与嵌入式组件相同的垂直空间，例如 作为电容器或电阻器。 通过所述嵌入式组件结构的制造过程进一步减轻组装和可靠性。 在一种结构化的钻孔中，电镀通孔使用永久且高度导电的附着材料将印刷电路板中的迹线或平面连接到嵌入式部件的电气端子。 在另一种结构中，轨迹或平面通过选择性侧壁电镀连接，其围绕部件的电端子。该结构还使用永久且高度导电的附着材料将部件端子电连接到电镀侧壁 最终实施例中，端子通过导电附着材料通过z轴中的通孔连接到导电垫。