公开(公告)号：SE7607677L

公开(公告)日：1977-01-12

申请号：SE7607677

申请日：1976-07-05

Applicant: SIEMENS AG

Inventor： ANDRASCEK E ,  HADERSBECK H

IPC: B23K1/20 ,  H01H11/04 ,  B23K35/36 ,  C23G1/00 ,  H05K3/22 ,  H05K3/34 ,  H05K3/38 ,  C23G1/02

Abstract: 1484542 Cleaning and activating circuit boards for soldering SIEMENS A G 4 May 1976 [11 July 1975] 18120/76 Heading C7U [Also in Division B3] The solderability of electric circuit boards with Cu or Cu alloy conductor paths is improved by cleaning the boards in an aqueous solution containing a non ionic surfactant and an organic acid and then activating in an aqueous solution containing potassium peroxy disulphate (persulphate) and an acid. The preferred cleaning solution contains 20-100g/l of an hydroxyethylated alkyl phenol and 15-80g/l of an organic acid such as formic acid. The activating solution is preferably saturated with the potassium peroxydisulphate the pH adjusted to 2-4 with H 2 SO 4 and stabilized with phosphoric acid. The boards may be rinsed with water between treatments and also retreated in the cleaning solution after treating in the activating solution. Colophony or soldering lacquers may then be applied and dried.

公开(公告)号：SE413329B

公开(公告)日：1980-05-19

申请号：SE7607677

申请日：1976-07-05

Applicant: SIEMENS AG

Inventor： ANDRASCEK E ,  HADERSBECK H

IPC: B23K1/20 ,  B23K35/36 ,  H01H11/04 ,  C23G1/00 ,  H05K3/22 ,  H05K3/34 ,  H05K3/38 ,  C23G1/02 ,  C23G1/10

Abstract: 1484542 Cleaning and activating circuit boards for soldering SIEMENS A G 4 May 1976 [11 July 1975] 18120/76 Heading C7U [Also in Division B3] The solderability of electric circuit boards with Cu or Cu alloy conductor paths is improved by cleaning the boards in an aqueous solution containing a non ionic surfactant and an organic acid and then activating in an aqueous solution containing potassium peroxy disulphate (persulphate) and an acid. The preferred cleaning solution contains 20-100g/l of an hydroxyethylated alkyl phenol and 15-80g/l of an organic acid such as formic acid. The activating solution is preferably saturated with the potassium peroxydisulphate the pH adjusted to 2-4 with H 2 SO 4 and stabilized with phosphoric acid. The boards may be rinsed with water between treatments and also retreated in the cleaning solution after treating in the activating solution. Colophony or soldering lacquers may then be applied and dried.

公开(公告)号：SE7606217A

公开(公告)日：1976-12-04

申请号：SE7606217

申请日：1976-06-02

Applicant: SIEMENS AG

Inventor： HADERSBECK H ,  ANDRASCEK E ,  GROBER A

IPC: H01R12/04 ,  H05K1/11 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K1/08

CPC classification number: H05K3/326 ,  H05K1/118 ,  H05K3/306 ,  H05K3/3447 ,  H05K3/3468 ,  H05K3/4038 ,  H05K3/4084 ,  H05K2201/0305 ,  H05K2201/09081 ,  H05K2201/1059 ,  H05K2203/0195 ,  Y10T29/49139

公开(公告)号：SE7804192L

公开(公告)日：1978-10-15

申请号：SE7804192

申请日：1978-04-13

Applicant: SIEMENS AG

Inventor： HADERSBECK H ,  ZUKIER H ,  ANDRASCEK E ,  GROBER A ,  HAASE W ,  HACKE H-J

IPC: H05K3/34 ,  H05K3/40 ,  H05K3/46 ,  H05K3/00

公开(公告)号：SE7709857A

公开(公告)日：1978-03-16

申请号：SE7709857

申请日：1977-09-01

Applicant: SIEMENS AG

Inventor： ANDRASCEK E ,  HEDERSBECK H ,  HACKE H-J ,  KULIGOWSKI G

IPC: G09F9/33 ,  H01L25/04 ,  H01L25/075 ,  H01L31/00

CPC classification number: H01L25/0753 ,  G09F9/33 ,  H01L25/042 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/00

Abstract: For recording or indicating purposes, a novel row arrangement, provided with a very fine width spacing, for the low loss utilisation of the light (6) radiated by GaP luminescent diodes has been created. The semiconductor platelets (1) of the luminescent diodes are arranged at the edge of a carrier (2) with which they form a level surface. As a result, the emerging radiation can be used directly - undisturbed by contacting wires - at the side face (11) of the semiconductor platelets (1) which is perpendicular to the pn-junction area. This makes it possible to remove the emitted light with high intensity and defined contour and without flare phenomena.

公开(公告)号：SE345557B

公开(公告)日：1972-05-29

申请号：SE1374768

申请日：1968-10-11

Applicant: SIEMENS AG

Inventor： ANDRASCEK E ,  ROSSHAUPTER E

IPC: H01P3/18

公开(公告)号：SE7804192A

公开(公告)日：1978-10-15

申请号：SE7804192

申请日：1978-04-13

Applicant: SIEMENS AG

Inventor： HADERSBECK H ,  ZUKIER H ,  ANDRASCEK E ,  GROBER A ,  HAASE W ,  HACKE H-J

IPC: H05K3/34 ,  H05K3/40 ,  H05K3/46 ,  H05K3/00

CPC classification number: H05K3/4652 ,  H05K3/3447 ,  H05K3/4038 ,  H05K3/4084 ,  H05K2201/0305 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/091 ,  H05K2201/09827 ,  H05K2203/033 ,  H05K2203/063

公开(公告)号：SE7709857L

公开(公告)日：1978-03-16

申请号：SE7709857

申请日：1977-09-01

Applicant: SIEMENS AG

Inventor： ANDRASCEK E ,  HEDERSBECK H ,  HACKE H-J ,  KULIGOWSKI G

IPC: G09F9/33 ,  H01L25/04 ,  H01L25/075 ,  H01L31/00

公开(公告)号：SE7607677A

公开(公告)日：1977-01-12

申请号：SE7607677

申请日：1976-07-05

Applicant: SIEMENS AG

Inventor： ANDRASCEK E ,  HADERSBECK H

IPC: H01H11/04 ,  B23K1/20 ,  B23K35/36 ,  C23G1/00 ,  H05K3/22 ,  H05K3/34 ,  H05K3/38 ,  C23G1/02

CPC classification number: B23K1/206 ,  B23K35/3612 ,  B23K2201/40 ,  B23K2201/42 ,  B23K2203/12 ,  C23G1/00 ,  H05K3/22 ,  H05K3/3489 ,  H05K3/383 ,  H05K2203/0315 ,  H05K2203/0392 ,  H05K2203/1157 ,  H05K2203/122

公开(公告)号：SE7606217L

公开(公告)日：1976-12-04

申请号：SE7606217

申请日：1976-06-02

Applicant: SIEMENS AG

Inventor： HADERSBECK H ,  ANDRASCEK E ,  GROBER A

IPC: H01R12/04 ,  H05K1/11 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K1/08

Abstract: A flexible printed circuit board has conductors on opposite sides thereof which are through-contacted by die-punching the board to form an angularly-displaced tongue portion about which solder is flowed to contact both conductors. A terminal pin is optionally inserted through the board to connect a component, the pin being engaged by the angularly-displaced tongue to ensure reliable mechanical and electrical contact in the soldered joint. The through-contact is formed with a bevel-faced die in conjunction with a cutting plate.