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公开(公告)号:ITUB20152264A1
公开(公告)日:2017-01-17
申请号:ITUB20152264
申请日:2015-07-17
Applicant: ST MICROELECTRONICS SRL , ST MICROELECTRONICS SRL
Inventor: MORELLI MARCO , TOIA FABRIZIO FAUSTO RENZO , BARILLARO GIUSEPPE , SAMBI MARCO
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公开(公告)号:EP2958144B1
公开(公告)日:2017-05-03
申请号:EP15172272
申请日:2015-06-16
Applicant: ST MICROELECTRONICS SRL
Inventor: PALUMBO VINCENZO , GHIDINI GABRIELLA , CAROLLO ENZO , TOIA FABRIZIO FAUSTO RENZO
IPC: H01L27/08 , H01F17/00 , H01F27/28 , H01F27/32 , H01F41/063 , H01L23/522 , H01L23/64
CPC classification number: H01F27/32 , H01F27/2804 , H01F27/323 , H01F41/063 , H01F2027/2809 , H01L23/5227 , H01L23/645 , H01L27/08 , H01L2924/0002 , Y10T29/49021 , H01L2924/00
Abstract: An integrated transformer (105; 205) integrated transformer comprises a primary winding (135) and a secondary winding (140), of metallic material and having a spiral planar arrangement comprising a corresponding plurality of coils (137; 142). A dielectric portion (145) of dielectric material is arranged between the primary winding and the secondary winding. A field plate winding (150) is electrically coupled with the primary winding. The field plate winding comprises at least one field plate coil (152a) having a lateral extension ( xa ) greater than a lateral extension (xb) of a primary outer coil (137a) of the primary winding with the at least one field plate coil superimposed, in plan view, to the primary outer coil of the primary winding. The field plate winding is configured to mutually separate equipotential surfaces of an operating electric field ( E1; E2 ) at a secondary winding facing edge (139) of the primary outer coil of the primary winding.
Abstract translation: 集成变压器(105; 205)集成变压器包括金属材料的初级绕组(135)和次级绕组(140)并且具有包括对应的多个线圈(137; 142)的螺旋平面布置。 介电材料的介电部分(145)被布置在初级绕组和次级绕组之间。 场板绕组(150)与初级绕组电耦合。 场板绕组包括至少一个场板线圈(152a),其具有大于初级绕组的初级外线圈(137a)的横向延伸(xb)的横向延伸(xa),其中至少一个场板线圈叠加 在平面图中,与初级绕组的初级外线圈相连。 场板绕组被配置为在初级绕组的初级外线圈的次级绕组面对边缘(139)处相互分离工作电场(E1; E2)的等电位面。
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公开(公告)号:ITUA20163033A1
公开(公告)日:2017-10-29
申请号:ITUA20163033
申请日:2016-04-29
Applicant: ST MICROELECTRONICS SRL
Inventor: MORELLI MARCO , QUAGLIA FABIO , TOIA FABRIZIO FAUSTO RENZO , BARILLARO GIUSEPPE , SAMBI MARCO
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公开(公告)号:ITUB20161081A1
公开(公告)日:2017-08-25
申请号:ITUB20161081
申请日:2016-02-25
Applicant: ST MICROELECTRONICS SRL
IPC: H01L21/74 , H01L23/535
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公开(公告)号:ITVI20090302A1
公开(公告)日:2011-06-22
申请号:ITVI20090302
申请日:2009-12-21
Applicant: ST MICROELECTRONICS SRL
Inventor: TOIA FABRIZIO FAUSTO RENZO
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公开(公告)号:IT201800000947A1
公开(公告)日:2019-07-15
申请号:IT201800000947
申请日:2018-01-15
Applicant: ST MICROELECTRONICS SRL
Inventor: VILLA FLAVIO FRANCESCO , MORELLI MARCO , MARCHESI MARCO , MARIANI SIMONE DARIO , TOIA FABRIZIO FAUSTO RENZO
IPC: H10N97/00
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7.
公开(公告)号:IT201600098500A1
公开(公告)日:2018-03-30
申请号:IT201600098500
申请日:2016-09-30
Applicant: ST MICROELECTRONICS SRL
Inventor: PIZZI ELISABETTA , TOIA FABRIZIO FAUSTO RENZO , MARCHESI MARCO , PALUMBO VINCENZO
IPC: H01F41/04 , H01L23/522 , H01L27/08
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公开(公告)号:ITMI20121123A1
公开(公告)日:2013-12-27
申请号:ITMI20121123
申请日:2012-06-26
Applicant: ST MICROELECTRONICS SRL
Inventor: MARIANI SIMONE DARIO , MERLINI DANIELE , TOIA FABRIZIO FAUSTO RENZO
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9.
公开(公告)号:IT201800000928A1
公开(公告)日:2019-07-15
申请号:IT201800000928
申请日:2018-01-15
Applicant: ST MICROELECTRONICS SRL
Inventor: PATTI DAVIDE GIUSEPPE , SAMBI MARCO , TOIA FABRIZIO FAUSTO RENZO , MARIANI SIMONE DARIO , PIZZI ELISABETTA , BARILLARO GIUSEPPE
IPC: H01L20060101
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公开(公告)号:IT201600088211A1
公开(公告)日:2018-03-02
申请号:IT201600088211
申请日:2016-08-30
Applicant: ST MICROELECTRONICS SRL
Inventor: SAMBI MARCO , TOIA FABRIZIO FAUSTO RENZO , MARCHESI MARCO , MORELLI MARCO , DEPETRO RICCARDO , BARILLARO GIUSEPPE , STRAMBINI LUCANOS MARSILIO
IPC: H01L29/32 , H01L29/06 , H01L29/66 , H01L29/78 , H01L29/861
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