Abstract:
PROBLEM TO BE SOLVED: To make a micro-actuator to function sufficiently by connecting the micro-actuator to a first surface of a suspension plate so that an R/W converter is projected from a second surface opposite to the first surface of the suspension plate. SOLUTION: A assembly body to be finally assembled is provided with a gimbal 8, the R/W converter and a die 25. The gimbal 8 (forming a thin layer of a suspension) is provided with a first surface 43 facing to the die 25 and a second surface 44 opposite to this surface, and the R/W converter 6 is projected from the second surface 44. A central circular hole 41 provided on the gimbal 8 has a diameter sufficient to allow the R/W converter 6 beforehand stuck to a rotor to passes through. An adhesive material member 42 is arranged between a member 12 to be suspended and the R/W converter 6. A strip 40 is stuck to the first surface 43 of the gimbal 8, and the die 25 is connected solidly with the R/W converter 6.
Abstract:
PROBLEM TO BE SOLVED: To manufacture a read/write unit without generating offset and residual stress as much as possible. SOLUTION: An integrated device 54 having a micro-actuator 10 is formed on a semiconductor material wafer 29, and immovable structures 45, 47 consisting of organic material are formed on the wafer 29, a fixing flange 51 integrated with the micro-actuator 10 and an electric connection part for connecting the integrated device 54 to a read/write head are formed simultaneously, a converter 6 supporting the read/write head is connected to the fixing flange 51, the electric connection part is connected to the read/write head, and the wafer is cut to a dice, an actuator unit is connected to a suspension, and the immovable structures 45, 47 are removed.
Abstract:
PROBLEM TO BE SOLVED: To provide an electromechanical microstructure which is insensitive to a mechanical stress. SOLUTION: This electromechanical microstructure is an electromechanical microstructure provided with a rotor member which comprises a center-of- gravity shaft and which comprises a suspension region arranged at a distance from the center-of-gravity shaft. The rotor member is connected to a single fixation part which is extended along the center-of-gravity shaft.
Abstract:
PROBLEM TO BE SOLVED: To prevent a microactuator from external dust by providing an actuator element being a different body and a transmission structure to be arranged between the actuator element and a motor element and allowing the transmission structure to transmit the motion of the motor element to a motion corresponding to the actuator element to prevent damage and static electric interference. SOLUTION: A microactuator 30 is integrated with the die 31 firmly fixed to gymbals. The microactuator 30 is provided with a motor element 32, an actuator element 34 which is separated from the motor element 32 and also to which R/W transducers 6 are firmly fixed and a transmission structure 36 which is arranged between the motor element 32 and the actuator element 34. The transmission structure 36 transmits the rotational motion of the motor element 32 to the actuator element 34 and the R/W transducers 6 fixed to the element 34. The motor element 32 is provided with the stator 38 of an inner side which is integrated with the die 31 and the rotor 40 of an outer side. The rotor 40 is connected to the actuator element 34 with the transmission structure 36.
Abstract:
PROBLEM TO BE SOLVED: To provide a capacitive sensor and a method for correcting the position offset of the capacitive inertia sensor. SOLUTION: An inertial sensor (1') of this invention is made of semiconductive material, and contains a stator (2) and a rotor (4) connected to each other electrostatically, and a microactuator (24) which is made of semiconductive material also, connected to the rotor 4, and controlled so as to move the rotor 4 itself and correct the position offset of the rotor (4).
Abstract:
PROBLEM TO BE SOLVED: To form an integrated semiconductor inertia sensor having a calibration microactuator. SOLUTION: An inertia sensor of this invention is a sensor integrated inside a body of semiconductor material, and comprises a stator element and a rotor element united into one electrostatically. The rotor element of the inertia sensor comprises a moving body and a microactuator means integrated inside the body of semiconductor material. The microactuator means is connected to the moving element of the rotor element, or is on the same plane.
Abstract:
PROBLEM TO BE SOLVED: To provide a method of assembling a microactuator for a data storage hard disk with simplicity, accuracy at low cost. SOLUTION: A first wafer, provided with a plurality of microactuators, including a suspension region 15 and a fixed region 22 which are separated a first groove 24, and a second wafer 25 provided with a inhibition region 27 for connecting a movable intermediate region 29' and a fixed intermediate region 29" are formed. A complex wafer 39 is formed, in which the suspension region 15 of the first wafer 11 is connected to the movable intermediate region 29' of the second wafer 25, and a fixed region 22 of the first wafer 11 is connected to the fixed intermediate region 29". The inhibition region 27 corresponding to the movable intermediate 29' is removed to fix a R/W transducer. The complex wafer 39 is sliced into chips.
Abstract:
A detection, structure (1) for a z-axis resonant accelerometer (24) is provided with an inertial mass (2) anchored to a substrate (20) by means of elastic anchorage elements (6) so as to be suspended above the substrate (20) and perform an inertial movement of rotation about a first axis of rotation (A) belonging to a plane (xy) of main extension of the inertial mass (2), in response to an external acceleration (az) acting along a vertical axis (z) transverse with respect to the plane (xy); and a first resonator element (10a) and a second resonator element (10b), which are mechanically coupled to the inertial mass (2) by respective elastic supporting elements (16), which enable a movement of rotation about a second axis of rotation (B) and a third axis of rotation (C), in a resonance condition. In particular, the second axis of rotation (B) and the third axis of rotation (C) are parallel to one another, and are moreover parallel to the first axis of rotation (A) of the inertial mass (2).