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    Circuit module system and method
    1.
    发明专利
    Circuit module system and method 审中-公开
    电路模块系统和方法

    公开(公告)号：JP2006074031A

    公开(公告)日：2006-03-16

    申请号：JP2005235451

    申请日：2005-08-15

    Applicant: Staktek Group Lp ,  スタクテック・グループ・エルピー

    Inventor： GOODWIN PAUL ,  CADY JAMES W ,  WEHRLY JAMES DOUGLAS JR

    IPC: H05K1/14 ,  G11C5/00 ,  H01L25/065 ,  H01L25/07 ,  H01L25/10 ,  H01L25/18 ,  H05K1/02 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K7/20

    CPC classification number: H05K1/189 ,  G11C5/04 ,  H01L25/105 ,  H01L2224/16 ,  H01L2924/00014 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2224/0401

    Abstract: PROBLEM TO BE SOLVED: To provide a packaging technology which reduces an increase in packaging volume accompanied by an increase in capacity. SOLUTION: Each flexible circuit is arranged with integrated circuits (ICs) disposed along one or both of its major sides, and bent around the edge of a rigid thermally-conductive substrate, thus placing ICs on one or both sides of the substrate with one or two layers of ICs on one or both sides of the substrate. On the side of the flexible circuit closest to the substrate, ICs are disposed at least partially in places which are windows, pockets, or cutaway areas in the substrate. The substrate material can be removed to reduce a module profile. An extension of the substrate reduces a thermal module load and encourages reduction in thermal variation among the ICs of the module during operation. COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：提供一种包装技术，其随着容量的增加而减少包装体积的增加。

    解决方案：每个柔性电路布置有沿着其主要侧面中的一个或两个侧面设置的集成电路（IC），并且围绕刚性导热基板的边缘弯曲，从而将IC放置在基板的一侧或两侧 在衬底的一侧或两侧上具有一层或两层IC。 在靠近基板的柔性电路的一侧，IC至少部分地设置在基板中的窗口，凹穴或切口区域的位置。 可以去除衬底材料以减少模块轮廓。 衬底的延伸减少了热模块的负载，并且有助于在操作期间模块的IC之间的热变化减小。 版权所有（C）2006，JPO＆NCIPI

    Circuit module system and method
    2.
    发明专利
    Circuit module system and method 未知

    公开(公告)号：GB2452880B

    公开(公告)日：2009-07-29

    申请号：GB0822085

    申请日：2005-08-12

    Applicant: STAKTEK GROUP LP

    Inventor： GOODWIN PAUL ,  CADY JAMES W ,  WEHRLY JAMES DOUGLAS

    IPC: H05K1/18 ,  G11C5/00 ,  H01L25/10 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14

    Abstract: A circuit module comprises a rigid, preferably thermally conductive, substrate 14, a flexible circuit 12 wrapped around an edge of the substrate, a plurality of chip scale packages (CSPs) attached to the flexible circuit and expansion board contacts 20 formed on the flexible circuit adjacent to the edge. The CSPs may be standard memory modules and are connected to the contacts 20 by means of conductive traces in the flexible circuit 16. The contacts 20 are arranged so that the circuit module may be plugged at its edge into a standard circuit board expansion slot in e.g. a computer. The substrate may assist in heat dissipation from the attached CSPs.

    COMPACT MODULE SYSTEM AND METHOD
    5.
    发明申请
    COMPACT MODULE SYSTEM AND METHOD 审中-公开
    紧凑型模块系统和方法

    公开(公告)号：WO2006121489A3

    公开(公告)日：2008-01-03

    申请号：PCT/US2006007193

    申请日：2006-02-28

    Applicant: STAKTEK GROUP LP ,  CADY JAMES W ,  WEHRLY JAMES DOUGLAS JR ,  GOODWIN PAUL

    Inventor： CADY JAMES W ,  WEHRLY JAMES DOUGLAS JR ,  GOODWIN PAUL

    IPC: G11C8/00

    CPC classification number: H05K1/189 ,  H05K2201/056 ,  H05K2201/10159 ,  H05K2201/10189

    Abstract: A flexible circuit is populated on one or both sides and disposed about a substrate to create a circuit module. Along one of its edges, the flex circuit is connected to a connective facility such as a multiple pin connector while the flex circuit is disposed about a thermally-conductive form that provides structure to create a module with plural layers of circuitry in a single module. In preferred embodiments, the form is metallic and, in alternative preferred embodiments, the module circuitry is disposed within a housing. Preferred embodiments may be devised that present a compact flash module within a housing that may be connected to or into a system or product through a connective facility that is preferably a male or female socket connector while the housing is configured to mechanically adapt to an application environment.

    Abstract translation: 柔性电路填充在一侧或两侧并且设置在基板周围以形成电路模块。 沿着其边缘之一，柔性电路连接到诸如多针连接器的连接设备，而柔性电路围绕导热形式设置，其提供结构以在单个模块中创建具有多层电路的模块。 在优选实施例中，该形式是金属的，并且在替代优选实施例中，模块电路设置在壳体内。 可以设计出优选实施例，其在壳体内呈现紧凑型闪光模块，其可以通过连接设备连接到系统或产品，该连接设备优选地是公插座或母插座连接器，而壳体被配置成机械地适应应用环境 。

    Circuit module system and method
    6.
    发明专利
    Circuit module system and method 未知

    公开(公告)号：GB2417836B

    公开(公告)日：2009-08-26

    申请号：GB0516622

    申请日：2005-08-12

    Applicant: STAKTEK GROUP LP

    Inventor： GOODWIN PAUL ,  CADY JAMES W ,  WEHRLY JAMES DOUGLAS

    IPC: H05K1/14 ,  G11C5/00 ,  H01L25/10 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18

    Abstract: A circuit module comprises a rigid, preferably thermally conductive, substrate 14, a flexible circuit 12 wrapped around an edge of the substrate, a plurality of chip scale packages (CSPs) attached to the flexible circuit and expansion board contacts 20 formed on the flexible circuit adjacent to the edge. The CSPs may be standard memory modules and are connected to the contacts 20 by means of conductive traces in the flexible circuit 16. The contacts 20 are arranged so that the circuit module may be plugged at its edge into a standard circuit board expansion slot in e.g. a computer. The substrate may assist in heat dissipation from the attached CSPs.

    Circuit module for memory expansion
    7.
    发明专利
    Circuit module for memory expansion 未知

    公开(公告)号：GB2417836A

    公开(公告)日：2006-03-08

    申请号：GB0516622

    申请日：2005-08-12

    Applicant: STAKTEK GROUP LP

    Inventor： GOODWIN PAUL ,  CADY JAMES W ,  WEHRLY JAMES DOUGLAS

    IPC: H05K1/14 ,  G11C5/00 ,  H01L25/10 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18

    Abstract: A circuit module 10 comprises a rigid substrate 14 having laterally opposed sides S1, S2 and a flexible circuit 12 wrapped around one edge 16A of the substrate. The flexible circuit is attached to at least one of the sides of the substrate and has a plurality of contacts 20 in the vicinity of the edge 16A for connection to a circuit board socket. A plurality of memory CSPs 18 (chipscale packaged devices) are provided on at least one of the sides of the flexible circuit. Also claimed are modules having thermally conductive properties and various shaped substrates.

    Circuit module for memory expansion
    9.
    发明专利
    Circuit module for memory expansion 未知

    公开(公告)号：GB2453064A

    公开(公告)日：2009-03-25

    申请号：GB0822086

    申请日：2005-08-12

    Applicant: STAKTEK GROUP LP

    Inventor： GOODWIN PAUL ,  CADY JAMES W ,  WEHRLY JAMES DOUGLAS

    IPC: H05K1/18 ,  G11C5/00 ,  H01L25/10 ,  H05K1/02 ,  H05K1/11

    Abstract: A circuit module comprises a rigid, preferably thermally conductive, substrate 14, a flexible circuit 12 wrapped around an edge of the substrate, a plurality of chip scale packages (CSPs) attached to the flexible circuit and expansion board contacts 20 formed on the flexible circuit adjacent to the edge. The CSPs may be standard memory modules and are connected to the contacts 20 by means of conductive traces in the flexible circuit 16. The contacts 20 are arranged so that the circuit module may be plugged at its edge into a standard circuit board expansion slot in e.g. a computer. The substrate may assist in heat dissipation from the attached CSPs.

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