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    Circuit module system and method
    1.
    发明专利
    Circuit module system and method 审中-公开
    电路模块系统和方法

    公开(公告)号：JP2006074031A

    公开(公告)日：2006-03-16

    申请号：JP2005235451

    申请日：2005-08-15

    Applicant: Staktek Group Lp ,  スタクテック・グループ・エルピー

    Inventor： GOODWIN PAUL ,  CADY JAMES W ,  WEHRLY JAMES DOUGLAS JR

    IPC: H05K1/14 ,  G11C5/00 ,  H01L25/065 ,  H01L25/07 ,  H01L25/10 ,  H01L25/18 ,  H05K1/02 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K7/20

    CPC classification number: H05K1/189 ,  G11C5/04 ,  H01L25/105 ,  H01L2224/16 ,  H01L2924/00014 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2224/0401

    Abstract: PROBLEM TO BE SOLVED: To provide a packaging technology which reduces an increase in packaging volume accompanied by an increase in capacity. SOLUTION: Each flexible circuit is arranged with integrated circuits (ICs) disposed along one or both of its major sides, and bent around the edge of a rigid thermally-conductive substrate, thus placing ICs on one or both sides of the substrate with one or two layers of ICs on one or both sides of the substrate. On the side of the flexible circuit closest to the substrate, ICs are disposed at least partially in places which are windows, pockets, or cutaway areas in the substrate. The substrate material can be removed to reduce a module profile. An extension of the substrate reduces a thermal module load and encourages reduction in thermal variation among the ICs of the module during operation. COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：提供一种包装技术，其随着容量的增加而减少包装体积的增加。

    解决方案：每个柔性电路布置有沿着其主要侧面中的一个或两个侧面设置的集成电路（IC），并且围绕刚性导热基板的边缘弯曲，从而将IC放置在基板的一侧或两侧 在衬底的一侧或两侧上具有一层或两层IC。 在靠近基板的柔性电路的一侧，IC至少部分地设置在基板中的窗口，凹穴或切口区域的位置。 可以去除衬底材料以减少模块轮廓。 衬底的延伸减少了热模块的负载，并且有助于在操作期间模块的IC之间的热变化减小。 版权所有（C）2006，JPO＆NCIPI

    Circuit module system and method
    3.
    发明专利
    Circuit module system and method 未知

    公开(公告)号：AU2005203591A1

    公开(公告)日：2006-03-23

    申请号：AU2005203591

    申请日：2005-08-11

    Applicant: STAKTEK GROUP LP

    Inventor： CADY JAMES W ,  WEHRLY JAMES DOUGLAS JR ,  GOODWIN PAUL

    IPC: H05K1/02 ,  G11C5/00 ,  H01L23/538 ,  H01L25/10 ,  H05K1/11 ,  H05K1/18

    Abstract: A circuit module comprises a rigid, preferably thermally conductive, substrate 14, a flexible circuit 12 wrapped around an edge of the substrate, a plurality of chip scale packages (CSPs) attached to the flexible circuit and expansion board contacts 20 formed on the flexible circuit adjacent to the edge. The CSPs may be standard memory modules and are connected to the contacts 20 by means of conductive traces in the flexible circuit 16. The contacts 20 are arranged so that the circuit module may be plugged at its edge into a standard circuit board expansion slot in e.g. a computer. The substrate may assist in heat dissipation from the attached CSPs.

    MEMORY EXPANSION AND INTEGRATED CIRCUIT STACKING SYSTEM AND METHOD
    4.
    发明专利
    MEMORY EXPANSION AND INTEGRATED CIRCUIT STACKING SYSTEM AND METHOD 未知

    公开(公告)号：AU2003304192A1

    公开(公告)日：2005-01-04

    申请号：AU2003304192

    申请日：2003-09-15

    Applicant: STAKTEK GROUP LP

    Inventor： WEHRLY JAMES DOUGLAS JR ,  BUCHLE JEFF ,  RAPPORT RUSSELL ,  CADY JAMES W ,  WILDER JAMES ,  ROPER DAVID L

    IPC: H01L21/44 ,  H01L23/31 ,  H01L23/498 ,  H01L23/50 ,  H01L23/538 ,  H01L25/065 ,  H01L25/10 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36

    Abstract: The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In a two-high CSP stack or module devised in accordance with a preferred embodiment of the present invention, two CSPs are stacked, with one CSP disposed above the other. The two CSPs are connected with flex circuitry. A form standard is disposed between the flex circuitry and a CSP in the stack. The form standard can take many configurations and may be used where flex circuits are used to connect CSPs to one another in stacked modules having two or more constituent CSPs. For example, in stacked modules that include four CSPs, three form standards are employed in preferred embodiments, although fewer may be used. The form standard provides a thermally conductive physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design.

    CIRCUIT MODULE SYSTEM AND METHOD
    6.
    发明专利
    CIRCUIT MODULE SYSTEM AND METHOD 未知

    公开(公告)号：CA2515714A1

    公开(公告)日：2006-03-03

    申请号：CA2515714

    申请日：2005-08-11

    Applicant: STAKTEK GROUP LP

    Inventor： GOODWIN PAUL ,  CADY JAMES W ,  WEHRLY JAMES DOUGLAS JR

    IPC: H05K1/00 ,  G11C5/00 ,  H01L23/36 ,  H01L25/10 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K7/20

    Abstract: Flexible circuitry is populated with integrated circuits (ICs) disposed alo ng one or both of its major sides. Contacts distributed along the flexible circuitry provide connection to the ICs. Preferably, the flexible circuitry is dispose d about an edge of a rigid, thermally-conductive substrate thus placing the integrat ed circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. In alternative, but also preferred embodiments, the ICs on the side of the flexible circuit closest to the substrate are disposed, at least partially, in what are windows, pockets, or cutaway areas in the substrate. Other embodiments may only populate one side of the flexible circuit or may remove substrate material to reduce module profile. In preferred embodiments, the contacts distributed along the flexible circuitry are configured for insertion into an edge connector socket such as those found in general purpose and server computers. Preferred substrates are comprised of thermall y conductive material. Extensions from the substrate in preferred embodiments can be expected to reduce thermal module loading and encourage reduced thermal variations amongst the integrated circuits of the module during operation.

    COMPACT MODULE SYSTEM AND METHOD
    8.
    发明申请
    COMPACT MODULE SYSTEM AND METHOD 审中-公开
    紧凑型模块系统和方法

    公开(公告)号：WO2006121489A3

    公开(公告)日：2008-01-03

    申请号：PCT/US2006007193

    申请日：2006-02-28

    Applicant: STAKTEK GROUP LP ,  CADY JAMES W ,  WEHRLY JAMES DOUGLAS JR ,  GOODWIN PAUL

    Inventor： CADY JAMES W ,  WEHRLY JAMES DOUGLAS JR ,  GOODWIN PAUL

    IPC: G11C8/00

    CPC classification number: H05K1/189 ,  H05K2201/056 ,  H05K2201/10159 ,  H05K2201/10189

    Abstract: A flexible circuit is populated on one or both sides and disposed about a substrate to create a circuit module. Along one of its edges, the flex circuit is connected to a connective facility such as a multiple pin connector while the flex circuit is disposed about a thermally-conductive form that provides structure to create a module with plural layers of circuitry in a single module. In preferred embodiments, the form is metallic and, in alternative preferred embodiments, the module circuitry is disposed within a housing. Preferred embodiments may be devised that present a compact flash module within a housing that may be connected to or into a system or product through a connective facility that is preferably a male or female socket connector while the housing is configured to mechanically adapt to an application environment.

    Abstract translation: 柔性电路填充在一侧或两侧并且设置在基板周围以形成电路模块。 沿着其边缘之一，柔性电路连接到诸如多针连接器的连接设备，而柔性电路围绕导热形式设置，其提供结构以在单个模块中创建具有多层电路的模块。 在优选实施例中，该形式是金属的，并且在替代优选实施例中，模块电路设置在壳体内。 可以设计出优选实施例，其在壳体内呈现紧凑型闪光模块，其可以通过连接设备连接到系统或产品，该连接设备优选地是公插座或母插座连接器，而壳体被配置成机械地适应应用环境 。

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