Abstract:
A vertical conduction integrated electronic device including: a semiconductor body (12); a trench (22) that extends through part of the semiconductor body and delimits a portion (24) of the semiconductor body, which comprises a first conduction region (16) having a first type of conductivity and a body region (40) having a second type of conductivity, which overlies the first conduction region; a gate region (30) of conductive material, which extends within the trench; an insulation region (39a) of dielectric material, which extends within the trench and is arranged between the gate region and the body region; and a second conduction region (20), which overlies the body region. The second conduction region is formed by a conductor.
Abstract:
The vertical conduction MOSFET device (100)is formed by a body (105) of silicon carbide, which has a first type of conductivity and a face (105A), and by a superficial body region (115) of a second type of conductivity, which has a first doping level, extends into the body, from the face of the body, to a first depth (d sb ) along a first direction, and has a first width (W sb ) along a second direction transversal to the first direction. The MOSFET device is also formed by a source region (120) and by a deep body region (110). The source region is of the first type of conductivity, extends to the inside of the superficial body region, from the face of the body, to a second depth (d b ), along the first direction, and has a second width (W s ) along the second direction, wherein the second depth is smaller than the first depth and the second width is smaller than the first width. The deep body region is of the second type of conductivity, has a second doping level and extends into the body, at a distance from the face of the body and in direct electrical contact with the superficial body region, wherein the second doping level is higher than the first doping level.